DLA MIL-DTL-83505 B-2001 SOCKETS (LEAD ELECTRONIC COMPONENTS) GENERAL SPECIFICATION FOR《(电子引线元件)套筒一般规范》.pdf

《DLA MIL-DTL-83505 B-2001 SOCKETS (LEAD ELECTRONIC COMPONENTS) GENERAL SPECIFICATION FOR《(电子引线元件)套筒一般规范》.pdf》由会员分享，可在线阅读，更多相关《DLA MIL-DTL-83505 B-2001 SOCKETS (LEAD ELECTRONIC COMPONENTS) GENERAL SPECIFICATION FOR《(电子引线元件)套筒一般规范》.pdf（17页珍藏版）》请在麦多课文档分享上搜索。

1、 MIL-DTL-83505B 25 September 2001 SUPERSEDING MIL-S-83505A 30 November 1987 DETAIL SPECIFICATION SOCKETS, (LEAD, ELECTRONIC COMPONENTS) GENERAL SPECIFICATION FOR This specification is approved for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specificatio

2、n covers the general requirements for individual lead sockets for insertion through mounting boards or panels. 1.2 Classification. 1.2.1 Terminal types. Lead sockets have terminals of the following types, as specified (see 3.1 and figure 1). Type I - Solderless wrap. Type II - Printed circuit. Type

3、III - Solder wire turrent. Type IV - Solder cup. Type V - Other (see 3.1). Type VI - Solderless spring contact (no terminal). FIGURE 1. Terminal type configurations. Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document shou

4、ld be addressed to: Commander, Defense Supply Center Columbus, ATTN: VAI, 3990 East Broad Street, Columbus, Ohio 43216-5000, by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. AMSC N/A FSC 5935 DISTRIBUTION STATEMENT A. Appro

5、ved for public release; distribution is unlimited. TURRENTSOLDERWRAPSOLDERLESSPRINTEDCIRCUITSOLDERLESS(NO TERMINAL)WIRESOLDERCUPSPRINGCONTACTPLATEDTHRU HOLEINCH-POUND Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-DTL-83505B 2 2. APPLICABLE DOCU

6、MENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure

7、the completeness of this list, document users are cautioned that they must meet all specified requirement documents cited in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications,

8、 standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation

9、 (see 6.2). SPECIFICATIONS DEPARTMENT OF DEFENSE MIL-DTL-83505/1 - Sockets (lead, Electronic Components) (Type I, Solderless Wrap). MIL-DTL-83505/2 - Sockets (Lead, Electronic Components (Type II, Printed Circuit). MIL-DTL-83505/6 - Sockets (Lead, Electronic Components) (Type VI, Solderless Spring C

10、ontacts). MIL-DTL-83734 - Sockets, Plug-in Electronic Components, Dual-in-Line (DIPS) and Single-in-Line Packages (SIPS) General Specification For. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-202 - Tests Methods for Electronic and Electrical Component Parts. MIL-STD-1285 - Marking of Electrical and Elec

11、tronic Parts. MIL-STD-1344 - Test Methods for Electrical Connectors. (Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the Defense Printing Service Detachment Office Building 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 2.2.2 Non-Go

12、vernment publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of the DoDISS cited in the solicitation. Unless otherwise specified, the issues of d

13、ocuments not listed in the DoDISS are the issues of the documents cited in the solicitation (see 6.2). AMERICAN NATIONAL STANDARDS INSTITUTE, INC. ANSI B46.1-78 - Surface Roughness, Waviness and Lay. ANSI Y14.5-1973 - Dimensioning and Tolerancing for Engineering Drawings. ANSI/NCSL Z540-1-1994 - Cal

14、ibration Laboratories and Measuring and Test Equipment, General Requirements. (Application for copies should be addressed to the American National Standards Institute, Inc. 1430 Broadway, New York, NY 10017.) AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM) ASTM B16 - Rod, Bar, and Shapes for use i

15、n Screw Machines, Free Cutting Brass. ASTM B139 - Rod, Phosphor Bronze, Bar, and Shapes. ASTM B194 - Plate, Copper Beryllium Alloy, Sheet, Strip, and Rolled Bar. ASTM B196 - Rod and Bar, Copper Beryllium Alloy. ASTM B488 - Standard Specification for Electrodeposited Coatings of Gold for Engineering

16、Uses. ASTM B740 - Copper-Nickel-Tin Spinodal Alloy Strip. (Application for copies should be addressed to the American Society for Testing and Materials, 1916 Race Street, Philadelphia, PA 19103.) Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-DT

17、L-83505B 3 COPPER DEVELOPMENT ASSOCIATION (CDA) Copper Alloy No. CA 11000 (Application for copies should be addressed to the Copper Development Association Inc. 405 Lexington Avenue, New York, NY 10017.) INTERNATIONAL ORGANIZATION FOR STANDARDIZATION (ISO) ISO-10012-1 - Quality Assurance Requirement

18、 for Measuring Equipment. (Applications for copies should be addressed to the International Organization for Standardization, i,rue de Varembe, Case postale 56, CH-1211 Geneve 20, Switzerland.) SOCIETY OF AUTOMOTIVE ENGINEERS INC. (SAE) AMS-QQ-N-290 - Nickel Plating (Electrodeposited). AMS-QQ-P-8172

19、8 - Plating, Tin-Lead (Electrodeposited). (Application for copies should be addressed to the Society of Automotive Engineers, 400 Commonwealth Drive, Warrendale, PA 15096-0001.) 2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (exc

20、ept for related associated specifications or specification sheets), the text of this document takes precedence. Nothing in this document however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Specification sheets. The individual item re

21、quirements shall be as specified herein and in accordance with the applicable specification sheet. In the event of any conflict between the requirements of this specification and the specification sheet, the latter shall govern. 3.1.1 Reference critical interface materials, plating, and processes. T

22、he identified reference critical interface materials, plating, and processes have been established to provide assurances that sockets manufactured to this specification will properly interface to similar industry standards or government specified component interconnection systems without problems of

23、 electrochemical contamination of critical electrical or mechanical interfaces or generation of incompatible mechanical interface surface wear products. The manufacturers of sockets supplied to this specification are allowed to use alternate recognized industry standards for materials, plating, and

24、processes from those identified in 3.3 of this specification. Alternate materials, plating, and processes used must be coordinated with the qualifying activity as part of the qualification process. Use of alternates to those referenced guidance items by the supplier must not result in inferior short

25、 or long term performance or reliability of supplied sockets as compared with sockets manufactured using the referenced materials, plating, or processes. Short or long term failures or reliability problems due to use of these alternates shall be the responsibility of the supplier. 3.2 Quality. 3.2.1

26、 Qualification. Sockets furnished under this specification shall be products that are authorized by the qualifying activity for listing on the applicable qualified products list before contract award (see 4.5 and 6.4). 3.3 Materials. Example reference materials are identified herein. However, when a

27、n example reference material is not identified, a material shall be used which will enable the sockets and accessories to meet the performance requirements of this specification. Acceptance or approval of a constituent material shall not be construed as a guaranty of acceptance of the finished produ

28、ct. 3.3.1 Recycled, recovered, or environmentally preferable material. Recycled, recovered, or environmentally preferable material should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements and promotes economically advantag

29、eous life cycle costs. 3.3.2 Electrical contact gold guidelines. Electrical contact gold plating shall be in accordance with ASTM B488, type 2, code C,.000030 (0.00076 mm) inch minimum thickness on the contact mating surface. Silver shall not be used as an underplate. 3.3.3 Socket (including termina

30、tion). See figure 2. 3.3.3.1 Spring contact. The spring contact portion of the socket shall be beryllium copper in accordance ASTM B139, ASTM B194, ASTM B196, copper-tin-nickel spinodial alloy C72900 in accordance with ASTM B740. Provided by IHSNot for ResaleNo reproduction or networking permitted w

31、ithout license from IHS-,-,-MIL-DTL-83505B 4 BEVELLED,CHAMFERED ORTAPERED ENTRYINSIDE SURFACE OFCONTACT (INTERFACEW ITH COMPONET LEAD).020 MIN GOLD.020 MIN G OLDTERMINALSPRING CONTACTSEE DETAIL ARETENTION MEANS(DESIGN OPTIONAL)OUTER SLEEVEDETAIL A(1 TINE)COMPLETE GOLDCOVERAGEFIGURE 2. General config

32、uration. 3.3.3.2 Spring contact finish. The spring contact finish shall be gold in accordance with ASTM B488, type 2, code C, class 0.76 (30 microinch) minimum thickness. Finish shall be applied over a nickel, in accordance with AMS-QQ-N-290, underplate thickness 30 - 150 microinch (0.76 - 3.81 m).

33、The spring contact finish shall be applied overall or localized (see 3.3). When contacts are provided in strip form, the absence of plating in the area where the contact was removed from the strip is acceptable, provided it is a non-functional area and any corrosion formed as a result of salt spray

34、testing does not creep into the contact engaging area. When a localized finish is used the finish and underplate shall be as specified above but the location of the finish shall conform to detail A of figure 2 (see 3.1 and 3.3.2). 3.3.3.3 Outer sleeve (including termination). The sleeve and terminat

35、ion portion of the socket shall be made of brass in accordance with ASTM B16 or copper in accordance with Copper Development Association Alloy C11000. 3.3.3.4 Outer sleeve (including termination) finish. The finish for the sleeve shall be one of the following as specified (see 3.1). a Gold plating s

36、hall be in accordance with ASTM B 488, type 2, code C, class 0.51 (20 microinch) minimum thickness, over nickel, in accordance with QQ-N-290, thickness 30 - 150 microinches (0.76 - 3.81 m) (see 3.3). b. Tin-lead in accordance with AMS-P-81728, minimum thickness of 180 microinches (4.57 m) over nicke

37、l, in accordance with AMS-QQ-N-290, thickness of 30 -150 microinches (0.76 - 3.81 m), or copper. For printed circuit terminations (type II), the tin-lead finish shall be 50 to 70 percent tin; for all other terminations, the tin-lead finish shall be 5 percent minimum lead. For tin-lead finished coppe

38、r sleeves, nickel or copper underplate is not required (see 3.3). 3.4 Design and construction. Sockets shall be of the design, construction, and physical dimensions specified (see 3.1). The entry to the socket shall be beveled, chamfered or tapered to facilitate the engagement of the component lead

39、into the socket, except type VI socket. The lead socket sleeve and terminal shall be of machined one-piece construction. The material shall be brass in accordance with ASTM B16. The body shall provide a means of retention to a mounting board as specified (see 3.1) and figure 2. 3.4.1 Temperature rat

40、ing. Part or Identifying Number (PIN) applicable to tin finishes shall have a temperature rating of -40C to +105C. Unless otherwise specified (see 3.1) PINs applicable to gold finish (plating or inlay) contact engagement area shall have a temperature rating of -55C to +125C. 3.4.2 Wire termination.

41、Unless otherwise specified wire terminations shall conform to figure 1 and shall be as specified (see 3.1). 3.4.2.1 Solderable terminals. Terminals intended for soldering shall be designed so that there shall be no solder wicking into the lead engagement chamber. 3.4.2.2 Solderless wrappost geometry

42、 (type I). The solderless geometry shall be in accordance with figures 3 and 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-DTL-83505B 5 3.4.2.2.1 Tip configuration. The tip of the wrappost shall terminate in a radius or bevel to facilitate i

43、nsertion into the wrapping tool. If the tip of the wrappost terminates in a bevel, the apex of the bevel shall be flat, with no side of the flat exceeding .015 inch (0.38 mm) on a .025 inch (0.63 mm) square and .020 inch (0.51 mm) on a .045 inch (1.14 mm) and .06 inch X .03 inch (1.52 mm X 0.76 mm)

44、rectangular. E length Number of wrapped connections Wire gage 30 (mm) Wire gage 28 (mm) Wire gage 26 (mm) Wire gage 24 (mm) Wire gage 22 (mm) Wire gage 20 (mm) Wire gage 18 (mm) 1 .185 (4.70) .219 (5.56) .226 (5.74) .258 (6.55) .303 (7.69) .327 (8.31) .391 (9.93) 2 .320 (8.13) .388 (9.85) .402 (10.2

45、1) .466 (11.83) .556 (14.12) .604 (15.34) .732 (18.59) 3 .455 (11.56) .557 (14.15) .578 (14.68) .674 (14.43) .809 (20.55) .881 (22.37) 1.073 (27.25) FIGURE 3. Wrappable length. 3.4.2.2.2 Parallelism. See figure 4 and associated table. Inches mm .0012 .0015 .003 0.030 0.038 0.38 Wrappost geometry A (

46、mm) B (mm) C (mm) Parallelism (mm) Straightness Inch/inch (mm) .025 (0.63) nominal .022 (0.56) min .025 (0.63) nominal .022 (0.56) min .0355 (0.902) max .0325 (0.825) min .002 (0.05) .002 (0.05) .005 (0.13) .005 (0.13) FIGURE 4. Diagonal dimension. Provided by IHSNot for ResaleNo reproduction or net

47、working permitted without license from IHS-,-,-MIL-DTL-83505B 6 3.5 Performance. 3.5.1 Insertion force. The maximum insertion force shall be as specified (see 3.1 and 4.6.3). There shall be no damage to the contact retention member nor shall the contact retention member be displaced from its origina

48、l location during this test. 3.5.2 Withdrawal force. The spring contact within the socket shall hold the test pin with the .5 ounce (14.2 g) minimum withdrawal force applied (see 4.6.4). 3.5.3 Socket contact retention (for type I through IV). There shall be no damage or loosening of the socket from

49、the mounting board after the socket retention test (see 4.6.5). 3.5.3.1 Solderless spring contact printed wiring board (pwb) retention (type VI). There shall be no separation or loosening of the contact from the test board after the solderless spring contact pwb retention (see 4.6.5.1). 3.5.4 Low-signal level contact resistance circuit. The socket shall show no electrical discontinuity and the contact resistance requirement shall not be exceeded the values specified in table I (