DLA DSCC-VID-V62 09624 REV A-2009 MICROCIRCUIT DIGITAL DIGITAL SIGNAL CONTROLLER (DSC) MONOLITHIC SILICON.pdf
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1、 REVISIONSLTR DESCRIPTION DATE APPROVEDA Correct device 01 and 02 temp range. Phn 12/17/09 T. Hess Prepared in accordance with ASME Y14.24 Vendor item drawing REV A A A A A A A A A A A A A A A A A A A A A A PAGE 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 REV A A A A A A A A A
2、A A A A A A A A A A A A A PAGE 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 REV STATUS OF PAGES REV A A A A A A A A A A A A A A A A A PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 PMIC N/A PREPARED BY Phu H. Nguyen DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Origi
3、nal date of drawing CHECKED BY Phu H. Nguyen TITLE MICROCIRCUIT, DIGITAL, DIGITAL SIGNAL CONTROLLER (DSC), MONOLITHIC SILICON YY MM DD 09-11-03 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/09624 REV A PAGE 1 OF 61 AMSC N/A 5962-V019-10 .Provided by IHSNot for ResaleNo reproduc
4、tion or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09624 REV A PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance digital signal controller microcircuit, with a
5、n operating temperature range of -40C to +125C (device type 02) and an extended operating temperature range of -55C to +125C (device type 01). 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administra
6、tive control number for identifying the item on the engineering documentation: V62/09624 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). 1/ Device type Generic Operating temperature Circuit function 01 SM320F28335-EP -55C to +125
7、C Digital signal controller 02 SM320F28335-EP -40C to +85C Digital signal controller 1.2.2 Case outline(s). The case outlines are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 179 Plastic Ball Grid Array Y 176 JEDEC MS-026 Plastic Quad Flatpack 1.2.3 Lead finishes.
8、The lead finishes are as specified below or other lead finishes as provided by the device manufacture: Finish designator Material A Hot solder dip B Tin-lead plateC Gold plateD PalladiumE Gold flash palladium Z Other 1/ Users are cautioned to review the manufacturers data manual for additional user
9、information relating to this device. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09624 REV A PAGE 3 1.3 Absolute maximum ratings. 2/ 3/ Supply voltage range, (
10、VDDIO, VDD3VFL) with respect to VSS. -0.3 V to +4.6 V Supply voltage range, (VDDA2, VDDAIO) with respect to VSSA-0.3 V to +4.6 V Supply voltage range, (VDD) with respect to VSS. -0.3 V to +2.5 V Supply voltage range, (VDD1A18, VDD2A18) with respect to VSSA-0.3 V to +2.5 V Supply voltage range, (VSSA
11、2, VSSAIO, VSS1AGND,VSS2AGND) with respect to VSS. -0.3 V to +0.3V Input voltage range, (VI) . -0.3 V to +4.6 V Output voltage range, (VO) . -0.3 V to +4.6 V Input clamp current, (IIK) (VINVDDIO) 4/ 20 mA Output clamp current, (IOK) (VOVDDIO) 20 mA Operating ambient temperature ranges, (TA): Device
12、type 01 . -55C to +125 5/ Device type 02 -40C to +85C 5/ Junction temperature range, (TJ) -40C to +150C 5/ Storage temperature range, (TSTG) -65C to +150C 5/ 1.4 Recommended operating conditions. 6/ 7/ Device supply voltage, (I/O, VDDIO) . +3.135 V to +3.465 V Device supply voltage CPU, VDD: Device
13、operation 150 MHz . +1.805 V to +1.995 V Device operation 100 MHz . +1.71 V to +1.89 V Supply ground, (VSS, VSSIO, VSSAIO, VSSA2, VSSA1AGND, VSS2AGND) . 0 V ADC supply voltage (3.3 V), (VDDA2, VDDAIO) . +3.135 V to +3.465 V ADC supply voltage, VDD1A18, VDD2A18): Device operation 150 MHz . +1.805 V t
14、o +1.995 V Device operation 100 MHz . +1.71 V to +1.89 V Flash supply voltage, VDD3VFL. +3.135 V to +3.465 V Device clock frequency (system clock), (fSYSCLKOUT) . 2 MHz to 150 MHz High level input voltage, (VIH) . +2 V to VDDIOMaximum low level input voltage, (VIL) . +0.8 V Maximum high level output
15、 source current, VOH= 2.4 V, (IOH): All I/Os except group 2 -4 mA Group 2 7/ -8 mA Maximum low level output sink current, (VOL= VOLMAX, (IOL): All I/Os except group 2 4 mA Group 2 7/ 8 mA Ambient temperature, TA: Device type 01 -55C to +125 Device type 02 -40C to +85C Maximum junction temperature (T
16、J) . +125C _ 2/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied
17、. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 3/ All voltage values are with respect to VSS., unless otherwise noted. 4/ Continuous clamp current per pin is 2 mA. This includes the analog inputs which have an internal clamping circuit that clamps
18、 the voltage to a diode drop above VDDA2or below VSSA2. 5/ Long term high temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall device life. 6/ Use of this product beyond the manufacturers design rules or stated parameters is done at
19、 the users risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. 7/ Group 2 pins are as follows: GPIO28, GPIO29, GPIO30, GPIO31, TDO, XCLKOUT, EMU0, EMU1, XINTF pins, GPIO35-87, XRDnullnullnullnullnullnull. Provided by IHSNot for
20、 ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09624 REV A PAGE 4 2. APPLICABLE DOCUMENTS JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices JEDEC STD 51-7 High Ef
21、fective Thermal Conductivity Test Board for Leaded Surface Mount Packages (Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and
22、legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (i
23、f applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are a
24、s specified herein. 3.5 Diagrams. 3.5.1 Case outline(s). The case outline(s) shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. 3.5.3 Block diagram. The block diagram shall be as specified in figure 3. 3.5.4 Timing waveforms.
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