DLA DSCC-VID-V62 09601-2009 MICROCIRCUIT DIGITAL MIXED SIGNAL MICROCONTROLLER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE 40 REV PAGE 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 REV REV STATUS OF PAGES PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 PMIC N/A PREPARED BY Phu H. Nguyen DEFENS
2、E SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing YY MM DD CHECKED BY Phu H. Nguyen APPROVED BY Thomas M. Hess TITLE MICROCIRCUIT, DIGITAL, MIXED SIGNAL MICROCONTROLLER, MONOLITHIC SILICON SIZE A CODE IDENT. NO. 16236 DWG NO. V62/09601 09-04-07 REV PAGE 1 OF 40 AMSC N/A 59
3、62-V054-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09601 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performan
4、ce mixed signal microcontroller microcircuit, with an operating temperature range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the ite
5、m on the engineering documentation: V62/09601 - 01 X A Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 MSP430F249-EP Mixed signal microcontroller 1.2.2 Case outline(s). The case outlines are as spec
6、ified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 64 JEDEC MO-220 Plastic quad flatpack 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator Material A Hot solder dip B Tin-lead plate C G
7、old plate D Palladium E Gold flash palladium Z Other 1.3 Absolute maximum ratings. 1/ Voltage applied at VCCto VSS-0.3 V to 4.1 V Voltage applied to any pin . -0.3 V to VCC+ 0.3 V 2/ Diode current at any device terminal . 2 mA Storage temperature range, TSTG(unprogrammed device) -55C to 150C 3/ Stor
8、age temperature range, TSTG(programmed device) -55C to 125C 3/ 1/ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated unde
9、r “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ All voltages referenced to VSS. The JTAG fuse blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is applied to the T
10、DI/TCLK pin when blowing the JTAG fuse. 3/ Higher temperature may be applied during board soldering process according to the current JEDEC J-STD-020 specification with peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels. Provided by IHSNot for Resal
11、eNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09601 REV PAGE 3 1.4 Recommended operating conditions. 4/ Supply voltage during program execution (VCC) (AVCC= DVCC= VCC) . 1.8 V to 3.6 V 5/ S
12、upply voltage during flash memory programming (VCC) (AVCC= DVCC= VCC) . 2.2 V to 3.6 V 5/ Supply voltage (VSS) (AVSS= DVSS= VSS) 0 V Processor frequency fSYSTEM(Maximum MCLK frequency): 6/ 7/ 8/ VCC= 1.8 V, Duty Cycle 50% 10% 4.15 MHz VCC= 2.7 V, Duty Cycle 50% 10% 12 MHz VCC 3.3 V, Duty Cycle 50% 1
13、0% 16 MHz Flash temperature range: Read . -55C to 125C Write . -55C to 125C Operating free air temperature range, TA. -55C to 125C 2. APPLICABLE DOCUMENTS JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices JEDEC J-STD-020 Joint IPC/JEDEC standard for moisture/reflow sensitivity
14、classification for nonhermetic solid state surface mount devices. (Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly
15、marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applic
16、able) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specif
17、ied herein. _ 4/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. 5/ It is recommended to power AVCCand DVCCfrom the same so
18、urce. A maximum difference of 0.3 V between AVCC and DVCC can be tolerated during power up. 6/ The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse width of the specified maximum frequency. 7/ Modules might have a different maximum input clock s
19、pecification. Refer to the data sheet from manufacturer. 8/ See figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09601 REV PAGE 4 3.5 Diagrams. 3.5.1 Case
20、 outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. 3.5.3 Functional block diagram. The functional block diagram shall be as shown in figure 3. 3.5.4 Operating area. The operating area shall be as sho
21、wn in figure 4. 3.5.5 Active mode supply current. The active mode supply current shall be as shown in figure 5. 3.5.6 POR/Brownout reset. The POR/Brownout reset shall be as shown in figure 6-8. 3.5.7 Test circuit and timing waveforms. The test circuit and timing waveforms shall be as shown in figure
22、 9-15. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09601 REV PAGE 5 TABLE I. Electrical performance characteristics. 1/ Limits Test Symbol Conditions 2/ unless
23、 otherwise specified TAVCCMin Max Unit Active mode supply current (into DVCC+ AVCC) Excluding External current 3/ 4/ -55C to 105C 275 TYP 125C 2.2 V 318 -55C to 105C 386 TYP Active mode (AM) current (1 MHz) IAM, 1MHzfDCO= fMCLK= fSMCLK= 1 MHz, fACLK= 32,768 Hz, Program executes from flash, BCSCTL1 =
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