DLA DSCC-VID-V62 06623-2006 MICROCIRCUIT DIGITAL-LINEAR 3 V TO 5 5 V MULTICHANNEL RS-232 LINE DRIVER RECEIVER MONOLITHIC SILICON《数字线性微电路3V到5V多通道RS-232线驱动器 接收器单片硅》.pdf
《DLA DSCC-VID-V62 06623-2006 MICROCIRCUIT DIGITAL-LINEAR 3 V TO 5 5 V MULTICHANNEL RS-232 LINE DRIVER RECEIVER MONOLITHIC SILICON《数字线性微电路3V到5V多通道RS-232线驱动器 接收器单片硅》.pdf》由会员分享,可在线阅读,更多相关《DLA DSCC-VID-V62 06623-2006 MICROCIRCUIT DIGITAL-LINEAR 3 V TO 5 5 V MULTICHANNEL RS-232 LINE DRIVER RECEIVER MONOLITHIC SILICON《数字线性微电路3V到5V多通道RS-232线驱动器 接收器单片硅》.pdf(15页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV REV STATUS OF PAGES PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing
2、YY-MM-DD CHECKED BY TOM HESS APPROVED BY RAYMOND MONNIN TITLE MICROCIRCUIT, DIGITAL-LINEAR, 3 V TO 5.5 V MULTICHANNEL RS-232 LINE DRIVER / RECEIVER, MONOLITHIC SILICON SIZE A CODE IDENT. NO. 16236 DWG NO. V62/06623 06-04-27 REV PAGE 1 OF 15 AMSC N/A 5962-V061-06 Provided by IHSNot for ResaleNo repro
3、duction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/06623 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance 3 V to 5.5 V multichannel RS-232 line driver
4、/ receiver microcircuit, with an operating temperature range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering
5、documentation: V62/06623 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 MAX3232-EP 3 V to 5.5 V multichannel RS-232 line driver / receiver 1.2.2 Case outline(s). The case outline(s) are as
6、 specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 16 MO-150 Plastic small outline Y 16 MO-153 Plastic small outline 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture: Finish designator Material A Hot
7、 solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Other Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/06623 REV PAGE 3 1.3 Absolute
8、maximum ratings. 1/ Supply voltage range (VCC) -0.3 V to 6 V 2/ Positive output supply voltage range (V+) -0.3 V to 7 V 2/ Negative output supply voltage range (V-) . 0.3 V to -7 V 2/ Supply voltage difference (V+ - V-) 13 V 2/ Input voltage range (VI): Drivers -0.3 V to 6 V Receivers . -25 V to 25
9、V Output voltage range (VO): Drivers -13.2 V to 13.2 V Receivers . -0.3 V to VCC+ 0.3 V Package thermal impedance (JA): 3/ Case X . 82C/W Case Y . 108C/W Operating virtual junction temperature (TJ) 150C Storage temperature range (Tstg) -65C to +150C 1.4 Recommended operating conditions. 4/ Supply vo
10、ltage range (VCC): VCC= 3.3 V 3 V to 3.6 V VCC= 5 V . 4.5 V to 5.5 V Driver high level input voltage (VIH) at DIN pins: VCC= 3.3 V 2 V minimum VCC= 5 V . 2.4 V minimum Driver low level input voltage (VIL) at DIN pins . 0.8 V maximum Driver input voltage (VI) at DIN pins . 0 V to 5.5 V Receiver input
11、 voltage (VI) . -25 V to 25 V Operating free air temperature (TA) . -55C to +125C 1/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond th
12、ose indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. See figure 6. 2/ All voltages are with respect to network GND. 3/ Maximum power dissipation is a function of TJ(max), JA, and TA. T
13、he maximum allowable power dissipation at any allowable ambient temperature is PD= (TJ(max) TA) / JA. Operating at the absolute maximum TJof 150C can affect reliability. 4/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and/
14、or distributor maintain no responsibility or liability for product used beyond the stated limits. See figure 6. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/066
15、23 REV PAGE 4 2. APPLICABLE DOCUMENTS JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices (Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Mark
16、ing. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers p
17、art number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, constru
18、ction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outlines. The case outlines shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. 3.5.3 Truth table. The truth table shall be as shown in figure 3.
19、3.5.4 Logic diagram. The logic diagram shall be as shown in figure 4. 3.5.5 Timing waveforms and test circuits. The timing waveforms and test circuits shall be as shown in figure 5. 3.5.6 Typical operating circuit. The typical operating circuit shall be as shown in figure 6. Provided by IHSNot for R
20、esaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/06623 REV PAGE 5 TABLE I. Electrical performance characteristics. 1/ Limits Test Symbol Conditions 2/ see figure 6Temperature, TA Device ty
21、pe Min Max Unit Supply current ICCNo load, VCC= 3.3 V to 5 V -55C to +125C 01 2 mA Driver section High level output voltage VOHDOUT at RL= 3 k to GND, DIN = GND -55C to +125C 01 5 V Low level output voltage VOLDOUT at RL= 3 k to GND, DIN = VCC-55C to +125C 01 5 V High level input current IIHVI= VCC-
22、55C to +125C 01 1 A Low level input current IILVIat GND -55C to +125C 01 1 A Short circuit output 3/ current IOSVCC= 3.6 V, VO= 0 V -55C to +125C 01 60 mA VCC= 5.5 V, VO= 0 V 60 Output resistance roVCC, V+, and V- = 0 V, VO= 2 V -55C to +125C 01 300 Switching characteristics section Maximum data rat
23、e CL= 1000 pF, RL= 3 k, one DOUT switching, see figure 5 -55C to +125C 01 150 kbit/s Pulse skew 4/ tsk(p)CL= 150 pF to 2500 pF, RL= 3 k to 7 k, see figure 5 +25C 01 300 typical 5/ ns Slew rate, transition region SR(tr) RL= 3 k to 7 k, VCC= 3.3 V, CL= 150 pF to 1000 pF, see figure 5 -55C to +125C 01
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