DLA DSCC-VID-V62 06619 REV C-2013 MICROCIRCUIT DIGITAL SIGNAL PROCESSORS MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Activate device type 03. - CFS 07-02-21 Thomas M. Hess B Correct package style in 1.2.2. - CFS 07-04-17 Thomas M. Hess C Update boilerplate to current MIL-PRF-38535 requirements. - PHN 13-12-11 Thomas M. Hess CURRENT DESIGN ACTIVITY CAGE CODE 16236 HAS CHAN
2、GED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV C C C C C C C C C C C C C C C C C C C C C PAGE 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 REV STATUS OF PAGES REV C C C C C C C C C C C C C C C C
3、 C PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 PMIC N/A PREPARED BY Phu H. Nguyen DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing CHECKED BY Phu H. Nguyen TITLE MICROCIRCUIT, DIGITAL SIGNAL PROCESSORS, MONOLITHIC SILICON YY MM DD 06-05-09 APPROVED BY Thomas M. H
4、ess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/06619 REV C PAGE 1 OF 38 AMSC N/A 5962-V022-14 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/06619 REV C PAGE 2 1. S
5、COPE 1.1 Scope. This drawing documents the general requirements of a high performance floating-point digital signal processor microcircuit, with an operating temperature range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification
6、. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/06619 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). 1/ Device type Generic Circuit function 0
7、1 SM320F2808-EP Digital Signal Processors 02 SM320F2806-EP Digital Signal Processors 03 SM320F2801-EP Digital Signal Processors 1.2.2 Case outline(s). The case outlines are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 100 JEDEC MS-026 Plastic quad flatpack 1.2.3 Le
8、ad finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Other 1/ Users are cautioned to review the manufacturers data manual for
9、 additional user information relating to this device. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/06619 REV C PAGE 3 1.3 Absolute maximum ratings. 2/ 3/ Supply
10、 voltage ranges, (VDDIO, VDD3VFL) (with respect to VSS) -0.3 V to +4.6 V Supply voltage ranges, (VDDA2, VDDAIO) (with respect to VSSA) -0.3 V to +4.6 V Supply voltage ranges, (VDD) (with respect to VSS) . -0.3 V to +2.5 V Supply voltage ranges, (VDD1A18, VDD2A18) (with respect to VSSA) -0.3 V to +2.
11、5 V Supply voltage ranges, (VSSA2, VSSAIO, VSS1AGND, VSS2AGND) (with respect to VSS) -0.3 V to +0.3 V Input voltage range, (VIN) . -0.3 V to +4.6 V Output voltage range, (VO) . -0.3 V to +4.6 V Input clamp current, IIK(VINVDDIO) . 20 mA 4/ Output clamp current, IOK(VOVDDIO) 20 mA Operating ambient t
12、emperature ranges, (TA) -55C to +125C 5/ Junction temperature range TJ. -55C to +150C 5/ Storage temperature range, (TSTG) -65C to +150C 5/ 1.4 Recommended operating conditions. Device supply voltage, I/O, (VDDIO) . +3.14 V to +3.47 V Device supply voltage, CPU (VDD) +1.71 V to 1.89 V Supply ground,
13、 (VSS, VSSIO) 0 V ADC supply voltage, 3.3 V (VDDA2, VDDAIO) . +3.14 V to +3.47 V ADC supply voltage, 1.8 V (VDD1A18, VDD2A18) . +1.71 V to +1.89 V Flash programming supply voltage, (VDD3VFL) . +3.14 V to +3.47 V Device clock frequency (system clock), (fSYSCLKOUT) . 2 MHz to 100 MHz High level input
14、voltage, (VIH) . +2.0 V to VDDIOMaximum low level input voltage, (VIL) . 0.8 V Maximum high level output source current, VOH= 2.4 V (IOH) : All I/Os except group 2 . -4 mA Group 2 6/ . -8 mA Maximum low level output sink current, VOL= VOLmax (IOL) : All I/Os except group 2 . 4 mA Group 2 6/ . 8 mA A
15、mbient temperature, (TA) -55C to +125C Thermal resistance characteristics for case outline X: Parameter Air Flow 0 lfm 150 lfm 250 lfm 500lfm JAC/W High k PCB 48.16 40.06 37.96 35.17 JTC/W 0.3425 0.85 1.0575 1.410 JC12.89 JB29.58 2/ Stresses beyond those listed under “absolute maximum rating” may ca
16、use permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect dev
17、ice reliability. 3/ All voltage values are with respect to VSS, unless otherwise noted. 4/ Continuous clamp current per pin is 2 mA. This includes the analog inputs which have an internal clamping circuit that clamps the voltage to a diode drop above VDDA2or below VSSA25/ Long term high temperature
18、storage and/or extended use at maximum temperature conditions may result in a reduction of overall device life. 6/ Group 2 pins are as follows: GPIO28, GPIO29, GPIO30, GPIO31, TDO, XCLOUT, EMU0, and EMU1. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,
19、-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/06619 REV C PAGE 4 2. APPLICABLE DOCUMENTS JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEP95 Registered and Standard Outlines for Semiconductor Devices (Copies of these documents are available online at ht
20、tp:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201-2107). 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers nam
21、e, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and ele
22、ctrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outlines. The case outlines shall be as shown in 1.2.2 and figur
23、e 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. 3.5.3 Block diagram. The block diagram shall be as specified in figure 3. 3.5.5 Package life time versus operating junction temperature. The package life time versus operating junction temperature shall be as sp
24、ecified in figure 4. 3.5.6 Typical operational power versus frequency (for device type 01). The typical operational power versus frequency (for device type 01) shall be as specified in figure 5. 3.5.7 Test load circuits. The test load circuits shall be as specified in figure 6. 3.5.8 Timing waveform
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