DLA DSCC-VID-V62 05610 REV B-2012 MICROCIRCUIT LINEAR LOW NOISE HIGH SLEW RATE UNITY GAIN STABLE VOLTAGE FEEDBACK AMPLIFIER MONOLITHIC SILICON.pdf
《DLA DSCC-VID-V62 05610 REV B-2012 MICROCIRCUIT LINEAR LOW NOISE HIGH SLEW RATE UNITY GAIN STABLE VOLTAGE FEEDBACK AMPLIFIER MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA DSCC-VID-V62 05610 REV B-2012 MICROCIRCUIT LINEAR LOW NOISE HIGH SLEW RATE UNITY GAIN STABLE VOLTAGE FEEDBACK AMPLIFIER MONOLITHIC SILICON.pdf(12页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Add “Maximum junction temperature to prevent oscillation, (TJ)” in section 1.3. - PHN 10-06-22 Thomas M. Hess B Under paragraph 1.3, ESD rating Machine model limit, delete +100 V and substitute “+1000 V”. Add footnote to paragraphs 1.2.2, 1.4, and 6.3. Make
2、 changes to dual and single supply voltage limits under paragraph 1.4. Table I, VS= 5.0 V condition, delete Rf = 301 and replace with Rf = 249 , make changes to common mode rejection ratio, output current (sinking), specified operating voltage, positive and negative power supply rejection tests. Tab
3、le I, VS= 5.0 V condition, delete Rf = 301 and replace with Rf = 249 , make changes to output current (sourcing and sinking), common mode rejection ratio, positive and negative power supply rejection tests. Make corrections to A1 and c dimensions under case X. Make corrections to all dimensions unde
4、r case Y. Update notes for case outlines X and Y under figure 1. - ro 12-06-14 Charles F. Saffle CURRENT DESIGN ACTIVITY CAGE CODE 16236 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF P
5、AGES REV B B B B B B B B B B B B PAGE 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Phu H. Nguyen DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing YY-MM-DD CHECKED BY Phu H. Nguyen TITLE MICROCIRCUIT, LINEAR, LOW NOISE, HIGH SLEW RATE, UNITY GAIN STABLE VOLTAGE FEE
6、DBACK AMPLIFIER, MONOLITHIC SILICON 05-06-14 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/05610 REV B PAGE 1 OF 12 AMSC N/A 5962-V019-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS,
7、OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05610 REV B PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance low noise, high slew rate, unity gain stable voltage feedback amplifier, with an operating temperature range of -55C to +125C. 1.2 Vendor Item Dra
8、wing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/05610 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1)
9、(See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). 1/ Device type Generic Circuit function 01 THS4271-EP Low noise, high slew rate, unity gain stable voltage feedback amplifier 02 THS4275-EP Low noise, high slew rate, unity gain stable voltage feedback amplifier 1.2.2 Case outline(s). The case outline(s)
10、 are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 8 JEDEC MS-012 Plastic small outline package Y 2/ 8 JEDEC M0-187 Plastic small outline package 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufactu
11、re: Finish designator Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Other _ 1/ Users are cautioned to review the manufacturers data manual for additional user information relating to this device. 2/ The manufacture has changed lead frames NiPdAu to NiPd
12、AuAg and location of assembly from their Hana facility to their Shanghai facility. Product with a Lot Trace Code of 1CxxxxH and earlier is a NiPdAu frame from the Hana facility. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, C
13、OLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05610 REV B PAGE 3 1.3 Absolute maximum ratings. 3/ Supply voltage, (VS) +16.5 V Input voltage, (VI): VSOutput current, (IO) 100 mA Continuous power dissipation . See package dissipation rating table Maximum junction temperature, (TJ) .
14、+150C Maximum junction temperature, continuous operation, long term reliability, (TJ) +125C 4/ Maximum junction temperature to prevent oscillation, (TJ) +60C 5/ Storage temperature range, (TSTG) -65C to +150C Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds +300C ESD ratings: Human body
15、model (HBM) +3000 V Charge device model (CDM) . +1500 V Machine model (MM) +1000 V Package dissipation ratings: Package JC(C/W) JA 6/ (C/W) Case X 38.3 97.5 Case Y 7/ 4.7 58.4 1.4 Recommended operating conditions. 8/ Supply voltage, (VS+and VS-): Dual supply . 2.5 V to 5 V Single supply . +5.0 V to
16、+10 V Input common mode voltage range, . VS-+ 1.4 V to VS+- 1.4 V Operating free air temperature range, (TA) . -55C to +125C 3/ The absolute maximum temperature under any condition is limited by the constraints of the silicon process. Stresses above these ratings may cause permanent damage. Exposure
17、 to absolute maximum conditions for extended periods may affect device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. 4/ Long term high temperature storage and/or extended used at maximum reco
18、mmended operating conditions may result in a reduction of overall device life. See figure 3 for additional information on thermal derating. 5/ Device type 01 may have low-level oscillation when the die temperature exceeds +60C and is not recommended for new design. See maximum die temperature to pre
19、vent oscillation in manufacturer data. 6/ This data was taken using the JEDEC standard high K test PCB. 7/ The devices on this drawing may incorporate a thermal pad on the underside of the chip. This act as a heatsink and must be connected to a thermally dissipative plane for proper power dissipatio
20、n. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. Refer to the manufacturer for more information about utilizing the thermally enhanced package. 8/ Use of this product beyond the manufacturers design rules or stated parameters is
21、done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE
22、IDENT NO. 16236 DWG NO. V62/05610 REV B PAGE 4 2. APPLICABLE DOCUMENTS JEDEC Solid State Technology Association JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices (Applications for copies should be addressed to the JEDEC Office, 3103 North 10th Street, Suite 240-S, Arlington, VA
23、 22201-2107 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit
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