DLA DSCC-VID-V62 05608 REV B-2012 MICROCIRCUIT LINEAR WIDE BAND LOW DISTORTION FULLY DIFFERENTIAL AMPLIFIERS MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Update boilerplate paragraphs to current requirements. - PHN 11-11-29 Thomas M. Hess B Add device type 03. - phn 12-02-27 Thomas M. Hess CURRENT DESIGN ACTIVITY CAGE CODE 16236 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Prepared i
2、n accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV B B B B B B B B B B B B PAGE 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Phu H. Nguyen DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing CHECKED BY Phu H. Nguyen TITLE MIC
3、ROCIRCUIT, LINEAR, WIDE BAND, LOW DISTORTION FULLY DIFFERENTIAL AMPLIFIERS, MONOLITHIC SILICON YY MM DD 05-06-14 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/05608 REV B PAGE 1 OF 12 AMSC N/A 5962-V035-12 Provided by IHSNot for ResaleNo reproduction or networking permitted wit
4、hout license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05608 REV B PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance wide band, low distortion fully differential amplifiers, with an operating tem
5、perature range of -55C to +125C for device type 01 and 02 and an operating temperature range of -55C to +60C for device type 03. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control n
6、umber for identifying the item on the engineering documentation: V62/05608 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). 1/ Device type Generic TACircuit function 01 THS4502-EP -55C to +125C Wideband, low distortion fully diffe
7、rential amplifiers 02 THS4503-EP -55C to +125C Wideband, low distortion fully differential amplifiers 03 2/ THS4503-EP -55C to +60C Wideband, low distortion fully differential amplifiers 1.2.2 Case outline(s). The case outlines are as specified herein. Outline letter Number of pins JEDEC PUB 95 Pack
8、age style X 8 JEDEC MS-012 Plastic small outline package Y 8 JEDEC M0-187 Plastic small outline package 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator Material A Hot solder dip B Tin-lead plate C Gold pla
9、te D Palladium E Gold flash palladium Z Other 1/ Users are cautioned to review the manufacturers data manual for additional user information relating to this device. 2/ The device type 02 and 03 may have low level oscillation when the die temperature (also known as the junction temperature) exceeds
10、60C. These device are not recommended for new designs where the die temperature is expected to exceeds 60C. for more information, see manufacturer data on Maximum Die temperature to Oscillation. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE
11、 SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05608 REV B PAGE 3 1.3 Absolute maximum ratings. 3/ Supply voltage, (VS) . +16.5 V Input voltage, (VI): . VS Output current, (IO) . 150 mA 4/ Differential input voltage, (VID) +4.0 V Maximum junction temperature, (TJ) +1
12、50C 5/ Maximum junction temperature, continuous operation, long term reliability, (TJ) . +125C 6/ Operating free air temperature range, (TA) (device type 01 and 02) . -55C to +125C Operating free air temperature range, (TA) (device type 03) . -55C to +60C Storage temperature range, (TSTG) . -65C to
13、+150C Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds . +300C ESD ratings: HBM +3000 V CDM +1500 V MM +100 V Package dissipation ratings: Package JC(C/W) JA 7/ (C/W) Case X 38.3 97.5 Case Y 4/ 4.7 58.4 1.4 Recommended operating conditions. Supply voltage: Maximum dual supply 7.5 V Singl
14、e supply +4.5 V to +15.0 V Operating free air temperature range, (TA) (device type 01 and 02) -55C to +125C Operating free air temperature range, (TA) (device type 03) -55C to +60C 2. APPLICABLE DOCUMENTS JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEP95 Registered and Standard Outlines for Sem
15、iconductor Devices (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201.) 3/ Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions fo
16、r extended periods may affect device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. 4/ The devices on this drawing may incorporate a thermal pad on the underside of the chip. This act as a hea
17、tsink and must be connected to a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. Refer to the manufacturer for more information about utilizing the thermally enhanced packag
18、e. 5/ The absolute maximum temperature under any condition is limited by the constraints of the silicon process. 6/ Long term high temperature storage and/or extended used at maximum recommended operating conditions may result in a reduction of overall device life. See figure 3 for additional inform
19、ation on thermal derating. 7/ This data was taken using JEDEC standard high-K test PCB. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05608 REV B PAGE 4 3. REQUI
20、REMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the
21、 manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The
22、 design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline(s). The case outline(s) shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. 3.5.3 Wirebond life versus temperature. Wirebo
23、nd life versus temperature shall be as shown in figure 3. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05608 REV B PAGE 5 TABLE I. Electrical performance charac
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