DLA DSCC-VID-V62 05604 REV C-2010 MICROCIRCUIT DIGITAL-LINEAR 3 3 V RS-485 TRANSCEIVER MONOLITHIC SILICON.pdf
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1、 REVISIONSLTR DESCRIPTION DATE APPROVEDA Under paragraph 6.3, delete CAGE 01295 as a source of supply for the 02XA device. - ro 05-06-17 R. MONNIN B Correct lead finishes on last page. Update boilerplate. - CFS 05-12-02 Thomas M. Hess C Add device type 04. Make a change to the symbol “c” min dimensi
2、on from 0.007 inch (0.17 mm) to 0.005 inch (0.13 mm). - ro 10-01-19 C. SAFFLE Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV C C C C C C C C PAGE 18 19 20 21 22 23 24 25 REV STATUS OF PAGES REV C C C C C C C C C C C C C C C C C PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
3、 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing YY MM DD CHECKED BY TOM HESS TITLE MICROCIRCUIT, DIGITAL-LINEAR, 3.3 V RS-485 TRANSCEIVER, MONOLITHIC SILICON 05-02-10 APPROVED BY RAYMOND MONNIN SIZE A CODE IDENT. NO. 16236 DWG NO.
4、 V62/05604 REV C PAGE 1 OF 25 AMSC N/A 5962-V001-10 .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05604 REV C PAGE 2 1. SCOPE 1.1 Scope. This drawing documents
5、the general requirements of a high performance 3.3 V RS-485 transceiver microcircuit, with device types 01 and 02 having a operating temperature range of -40C to +125C, device type 03 having a operating temperature range of -40C to +85C, and device type 04 having a operating temperature range of -55
6、C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/05604 - 01 X E Drawing Device type Case outline
7、Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function Signaling rate 01 SN65HVD10-EP 3.3 V RS-485 transceiver 25 Mbps 02 SN65HVD11-EP 3.3 V RS-485 transceiver 10 Mbps 03 SN65HVD12-EP 3.3 V RS-485 transceiver 1 Mbps 04 SN65HVD10-EP 3.3 V RS-
8、485 transceiver 25 Mbps 1.2.2 Case outline(s). The case outlines are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 8 MS-012 AA Plastic small outline 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufa
9、cturer: Finish designator Material A Hot solder dip B Tin-lead plateC Gold plateD PalladiumE Gold flash palladium Z Other Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG N
10、O. V62/05604 REV C PAGE 3 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage range (VCC) -0.3 V to 6 V Voltage range at A or B -9 V to 14 V Input voltage range at D, DE, R, or RE . -0.5 V to VCC+0.5 V Voltage input range, transient pulse, A and B through 100 (see figure 15) -50 V to 50 V Electrostat
11、ic discharge (ESD): Human body model: 3/ A, B, and GND 16 kV All pins 4 kV Charged device model: 4/ All pins charge 1 kV Continuous total power dissipation . See dissipation rating table Junction temperature (TJ) 170C Storage temperature range (TSTG) . -65C to +150C Lead temperature 1.6 mm (1/16 inc
12、h) from case for 10 seconds . 260C Thermal resistance, junction-to-ambient (JA) . 5/ 1.4 Recommended operating conditions. 6/ Supply voltage range (VCC) 3 V minimum to 3.6 V maximum Voltage at any bus terminal (separately or common mode) VIor VIC-7 V minimum to 12 V maximum 7/ High level input volta
13、ge (VIH) at D, DE, RE pins . 2 V minimum to VCCmaximum Low level input voltage (VIL) at D, DE, RE pins 0 V minimum to 0.8 V maximum Differential input voltage (VID) (see figure 11) -12 V minimum to 12 V maximum High level output current (IOH): Driver . -60 mA minimum Receiver . -8 mA minimum Low lev
14、el output current (IOL): Driver . 60 mA maximum Receiver . 8 mA maximum Differential load resistance (RL) . 54 minimum Differential load capacitance (CL) 50 pF nominal Signaling rate Device types 01 and 04 . 25 Mbps maximum Device type 02 . 10 Mbps maximum Device type 03 . 1 Mbps maximum Junction te
15、mperature (TJ) 145C maximum 5/ 1/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditio
16、ns” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ All voltage values, except differential I/O bus voltages, are with respect to network ground terminal. 3/ Tested in accordance with JEDEC standard 22, test method A114-A. 4/ Teste
17、d in accordance with JEDEC standard 22, test method C101. 5/ See thermal characteristics section in 1.5. 6/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for produc
18、t used beyond the stated limits. 7/ The algebraic convention, in which the least positive (most negative) limit is designated as minimum in this data sheet. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHI
19、O SIZE A CODE IDENT NO. 16236 DWG NO. V62/05604 REV C PAGE 4 1.5 Thermal characteristics. Junction-to-ambient thermal resistance (JA) (high K board, no airflow) 121C/W typical 8/ 9/ Junction-to-board thermal resistance (JB) (high K board) 67C/W typical Junction-to-case thermal resistance (JC) . 41C/
20、W typical Device power dissipation (PD): (RL= 60 , CL= 50 pF, DE at VCCRE at 0 V, input to D a 50% duty cycle square wave at indicated signaling rate) Device types 01 and 04 (25 Mbps) . 233 mW maximum Device type 02 (10 Mbps) . 176 mW maximum Device type 03 (500 kbps) 161 mW maximum Ambient air temp
21、erature (TA) ( high K board, no airflow ) . -40C to +116C Thermal shutdown junction temperature (TJSD) . 165C typical Package dissipation ratings table. Package TA 25C Derating factor 1/ TA= 70C TA= 85C TA= 125C power rating above TA= 25C power rating power rating power rating X 2/ 597 mW 4.97 mW/C
22、373 mV 298 mW 100 mW X 3/ 990 mW 8.26 mW/C 620 mW 496 mW 165 mW 1/ This is the inverse of the junction-to-ambient thermal resistance when board mounted and with no air flow. 2 / Tested in accordance with the low-K thermal metric definitions of EIA/JESD51-3. 3 / Tested in accordance with the high-K t
23、hermal metric definitions of EIA/JESD51-7. _ 8/ The intent of JAspecification is solely for thermal performance comparison of one package to another in a standardized environment. This methodology is not meant to and will not predict the performance of a package in an application specific environmen
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