DLA DSCC-DWG-88034 REV J-2006 RESISTOR FIXED FILM CHIP LOW VALUES HIGH POWER STYLE 2512《固定的薄膜片状低压高功率2512型电阻器》.pdf
《DLA DSCC-DWG-88034 REV J-2006 RESISTOR FIXED FILM CHIP LOW VALUES HIGH POWER STYLE 2512《固定的薄膜片状低压高功率2512型电阻器》.pdf》由会员分享,可在线阅读,更多相关《DLA DSCC-DWG-88034 REV J-2006 RESISTOR FIXED FILM CHIP LOW VALUES HIGH POWER STYLE 2512《固定的薄膜片状低压高功率2512型电阻器》.pdf(8页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Add new paragraph on resistance. Editorial changes throughout. 31 Jul 1989 D. Moore B Revise 3.3.6 to include ranges for resistance temperature coefficient. Revise 4.8 to include provisions for test fixturing. 10 Jan 1990 D. Moore C Revise 3.3.5 to reflect
2、new voltage rating. Editorial changes throughout. 12 Jun 1990 D. Moore D Add new characteristic E. Revise 3.3.4 to reflect new power ratings. Revise 3.3.6 to list characteristic E. Add new vendor, similar PIN. Editorial changes throughout. 26 Feb 1992 D. Moore E Revise 3.3.5 voltage rating to 200 vo
3、lts. Dimensional change. Editorial changes throughout. 13 Feb 1995 Edward Back F Add new source of supply. Add resistance tolerance 0.1 percent and 5.0 percent. Dimension changes in accordance with MIL-PRF-55342/9. Editorial corrections throughout. 5 Apr 1999 James A. Crum G Extend minimum resistanc
4、e value to 1 ohm for characteristic K however, each unit package shall be marked in accordance with MIL-STD-1285 and include the PIN as specified herein (see 1.2), the manufacturers name or Commercial and Government Entity (CAGE) code, and date lot codes. 3.5 Recycled, recovered, or environmentally
5、preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. 3.6 Certificate of compl
6、iance. A certificate of compliance shall be required from manufacturers requesting to be a suggested source of supply. 3.7 Workmanship. Resistors shall be uniform in quality and free from any defects that will affect life, serviceability, or appearance. Provided by IHSNot for ResaleNo reproduction o
7、r networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88034 REV J PAGE 6 4. VERIFICATION 4.1 Product assurance program. The product assurance program specified in MIL-PRF-55342 and maintained in accordance with MIL-STD-7
8、90 is not applicable to this document. 4.2 Qualification inspection. Qualification inspection is not applicable to this document. 4.3 Product level qualification. The product level qualification specified in MIL-PRF-55342 is not applicable to this document. 4.4 Conformance inspection. 4.4.1 Inspecti
9、on of product for delivery. Inspection of product for delivery shall consist of the groups A and B inspections. 4.4.1.1 Group A inspection. Group A inspection shall consist of the inspections specified in table II, and shall be made on the same set of sample units, in the order shown. 4.4.1.1.1 Subg
10、roup 1. Subgroup I tests shall be performed on a production lot basis on 100 percent of the product supplied under this document. Resistors that are out of resistance tolerance, or which experience a change in resistance greater than that permitted for the tests of this subgroup shall be removed fro
11、m the lot. Lots having more than 5 percent total rejects, due to exceeding the specified resistance tolerance change limit shall not be furnished on contracts. 4.4.1.1.2 Subgroup 2. Subgroup II tests shall be performed on an inspection lot basis. A sample of 13 parts shall be randomly selected; if o
12、ne or more defects are found, the lot shall be rescreened and defects removed. A new sample of 13 parts shall then be randomly selected. If one or more defects are found in this second sample, the lot shall be rejected and shall not be supplied against the document. 4.4.1.1.3 Subgroup 3. Subgroup 3
13、tests shall be performed as specified in MIL-PRF-55342. 4.4.2 Group B inspection. Group B inspection shall be in accordance with MIL-PRF-55342 except subgroup 1 and subgroup 2 tests shall be performed on ceramic boards. 4.4.2.1 Certification. The acquiring activity, at its discretion, may accept a c
14、ertificate of compliance with group B requirements in lieu of performing group B tests (see 6.2d). 4.5 Visual and mechanical examination. Resistors shall be examined to verify that the materials, design, construction, physical dimensions, marking, and workmanship are in accordance with the applicabl
15、e requirements of MIL-PRF-55342. TABLE II. Group A inspection. Inspection Requirement Method Sampling procedure Subgroup 1 DC resistance Thermal shock Power conditioning DC resistance 3.3.9 3.3.10 3.3.11 3.3.9 4.6 4.7 4.8 4.6 100 percent Subgroup 2 Visual inspection 3.2, 3.4, 3.7 4.5 13 samples, 0 f
16、ailures Subgroup 3 Solderability 3.3.12 4.9 See 4.4.1.1.3 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88034 REV J PAGE 7 4.6 DC resistance. DC resistance shall be t
17、ested in accordance with MIL-PRF-55342. 4.7 Thermal shock. Thermal shock shall be tested in accordance with MIL-PRF-55342. 4.8 Power conditioning. Resistors shall be tested in accordance with method 108 of MIL-STD-202. The following details and exceptions shall apply: a. Method of mounting: Chip res
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