DLA DSCC-DWG-85151 REV F-2009 DELAY LINE THREE DELAY LINE UNITS 14 PIN DIP COMPATIBLE TTL INTERFACED.pdf
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1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Revised drawing to reflect MIL-D-83532 requirements. Editorial changes throughout. 14 Sep 1987 Randy Larson B Added minimum pulse width requirement. Added three suggested supply sources. Added notes 5 and 6 to figure 1. Changed several values in table II. E
2、ditorial changes throughout. 3 Apr 1989 Randy Larson C Add paragraph 3.5.1. Added tolerance to pin diameters on figure 1. Changed flat pin dimension in note 5. Editorial changes throughout. 13 Jan 1992 Randy Larson D Changes in accordance with NOR 5999-R004-92 9 Sep 1992 David Moore E Incorporated b
3、oilerplate update. Updated vendor addresses. Editorial changes throughout. 26 Sep 2000 Kendall A. Cottongim F Editorial changes and boilerplate updates made throughout. 14 May 2009 Michael A. Radecki Prepared in accordance with ASME Y14.100 Source control drawing REV STATUS OF PAGES REV F F F F F F
4、F F F PAGES 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Dan McGrath DESIGN ACTIVITY DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OH 45444-5000 Original date of drawing 9 Oct 1985 CHECKED BY Dan McGrath TITLE DELAY LINE, THREE DELAY LINE UNITS, 14 PIN DIP COMPATIBLE, TTL INTERFACED APPROVED BY Ivan R. Jones
5、SIZE A CODE IDENT. NO. 14933 DWG NO. 85151 REV F PAGE 1 OF 9 AMSC N/A 5999-E207CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-D
6、EFENSE ELECTRONICS SUPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 85151 REV F SHEET 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a family of active 14-pin DIP compatible TTL delay lines with three delay line units per package. 1.2 Part or Identifying Number (PIN).
7、 The complete PIN shall be as follows: 85151 -01 | | | | Drawing number Dash number (see table I) 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this
8、 specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents in sections 3 and 4 of this specification, whether or not they a
9、re listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or co
10、ntract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-M-38510 - Microcircuits, General Specification for. MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for. MIL-PRF-83532 - Delay Lines, Active, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-1
11、285 - Marking of Electrical and Electronic Parts. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of preced
12、ence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence unless otherwise noted. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUI
13、REMENTS 3.1 Materials. Materials shall be as specified in MIL-PRF-83532. 3.1.1 Cases. Cases shall be molded diallyl phthalate or encapsulated epoxy and shall be in accordance with MIL-PRF-83532. 3.1.2 Solder and soldering flux. Solder and soldering flux shall be in accordance with MIL-PRF-83532. 3.2
14、 Interface and physical dimensions. See figure 1. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTORNICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 85151 REV F SHEET 3 3.3 Terminal type. Terminals shall be printed-cir
15、cuit pin type in accordance with MIL-M-38510 and may be round or flat (see figure 1). 3.4 Operating temperature range. Operating temperature range shall be -55C to +125C. 3.5 Delay time. See table I. 3.5.1 Check for internal shorts. When a test signal is applied to any input, a delay signal should b
16、e detected at the output for that line only. For example, when input 1 is tested, there shall be no signals detected at outputs 2 and 3. All three inputs shall be checked in this manner. 3.6 Delay tolerance. At +25C, the delay tolerance shall be 2.0 ns or 5 percent, whichever is greater. At -55C or
17、+125C the delay tolerance shall be 3 ns or 8 percent, whichever is greater. 3.7 Rise time. The rise time shall be 4 ns maximum. 3.8 Pulse width. Minimum input pulse width shall be 100 percent of the total delay time. 3.9 Integrated circuits. Integrated circuits shall be tested to and meet the screen
18、ing requirements of MIL-PRF-38535. 3.10 DC characteristics. DC characteristics shall be in accordance with table II. 3.11 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible, provided
19、 that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. 3.12 Manufacturer eligibility. To be eligible for listing as an approved source of supply, a manufacturer shall be listed on the MIL-PRF-83532 Qualified Products
20、 List for at least one part, or perform the Group A inspection specified herein on a sample of parts agreed upon by the manufacturer and DSCC-VA. 3.13 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be an approved source of supply. 3.14 Pure
21、tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.3). 3.15 Marking. Delay lines shall be ma
22、rked on the top of the case in accordance with method I of MIL-STD-1285, except the delay line shall be marked with the PIN as specified herein (see 1.2), the manufacturers name or Commercial and Government Entity (CAGE) code, date lot codes, and an index mark next to pin 1 (see figure 1). 3.16 Work
23、manship. The delay line shall be uniform in quality and free from any defects that will affect life, serviceability, or appearance. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTORNICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 1
24、4933 DWG NO. 85151 REV F SHEET 4 FIGURE 1. Interface and physical dimensions. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTORNICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 85151 REV F SHEET 5 NOTES: 1. Dimensions
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