DLA DSCC-DWG-03024 REV B-2013 SHIELDING BEAD ELECTRONIC CHIP FERRITE HIGH RELIABILITY.pdf
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1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Addition of pure tin prohibition requirement. Add new paragraph 3.12 and update drawing format throughout. 21 May 2013 Michael Radecki B Corrected typographical and referenced paragraphs errors. Added a NOTE to paragraph 4.6.15 and a subparagraph to 4.6.17.
2、 25 June 2013 Michael Radecki Prepared in accordance with ASME Y14.100 REV STATUS OF PAGES REV 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 PAGES B B B B B B B B B B B B B B B B PMIC N/A PREPARED BY Ken R. Beymer DESIGN ACTIVITY DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OH Original date of drawing July 24
3、, 2003 CHECKED BY Ken R. Beymer TITLE SHIELDING BEAD, ELECTRONIC, CHIP, FERRITE, HIGH RELIABILITY APPROVED BY Kendall A. Cottongim SIZE A CODE IDENT. NO. 037Z3 DWG NO. 03024 REV B PAGE 1 OF 16 AMSC N/A 5950-2013-E13 CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 HAS CHANGED NAMES TO: DLA LAND AND MARITIME
4、COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03024 REV B PAGE 2 1. SCOPE 1.1 Scope. This drawing establishes the requirements for the scre
5、ening of ferrite chip beads. Ferrite chip beads described in this document are manufactured and screened for high reliability applications. Ferrite chip beads described herein are capable of operation over a temperature range of -55C to +125C ambient including high vacuum environments. 1.2 Part or I
6、dentifying Number (PIN). The complete PIN shall be as follows: 03024 -001 P | | | | | | Drawing Dash number Impedance tolerance number (see table I) (see table II) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standard
7、s, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract (see 6.2). STANDARDS DEPARTMENT OF DEFENSE MIL-STD-202 - Test Method Standard for Electronic and Electrical Componen
8、t Parts. MIL-STD-1285 - Marking of Electrical and Electronic Parts. (Copies of these documents are available online at http:/quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The follow
9、ing documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract (see 6.2). AMERICAN NATIONAL STANDARDS J-STD-004 - Requirements for Soldering Fluxes. J-STD-006 - Requirements for Elec
10、tronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications. (DoD activities may obtain copies of American National Standards from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094. The private sector an
11、d other Government agencies may purchase copies from the Institute for Interconnecting and Packaging Electronic Circuits (IPC), 7380 N. Lincoln Avenue, Lincolnwood, IL 60646-1776.) Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER
12、, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03024 REV B PAGE 3 AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI) ANSI/EIA-595 - Visual and Mechanical Inspection Multilayer Ceramic Chip Capacitors. ISO 10012 - Measurement Management Systems - Requirements for Measurement Processes and Me
13、asuring Equipment. (Applications for copies should be addressed to the American National Standards Institute (ANSI), 1819 L Street NW, Suite 600, Washington, DC 20036, https:/www.ansi.org ). AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM) ASTM E595 - Standard Test Method for Total Mass Loss and Co
14、llected Volatile Condensable Materials from Outgassing in a Vacuum Environment. (Applications for copies of ASTM publications should be addressed to the American Society for Testing and Materials (ASTM), 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959.) INTERNATIONAL ELECTROTECHNICAL COMMISS
15、ION (IEC) IEC 60068-2-21 - Robustness of Terminations and Integral Mounting Devices. Applications for copies should be addressed to the Customer Service Center (CSC), International Electrotechnical Commission, 3, rue de Varembe, 1211 GENEVA 20, Switzerland.) NATIONAL CONFERENCE OF STANDARDS LABORATO
16、RIES (NCSL) NCSL Z540.3 - Requirements for Calibration of Measuring and Test Equipment. (Copies of this document are available online at www.ncsli.org or from NCSL International, 1800 30th Street, Suite 305, Boulder, CO 80701-1026.) (Non-Government standards and other publications are normally avail
17、able from the organizations that prepare or distribute the documents. These documents also may be available in or through libraries or other informational services.) 2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of thi
18、s document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Design and Construction. 3.1.1 Dimensions and configurations. Dimensions and configuration shall be as specified in figure 1 a
19、nd table I. 3.1.2 Terminals. The terminations shall be covered with tin/lead coating. The tin content of the coating shall not exceed 97%. Gold terminations are optional. When gold terminations are required, the procurement activity shall indicate on their purchase order that gold terminations are a
20、 requirement. Also, the minimum thickness of the gold plating shall be 50 micro-inches, as measured on crown and band area (corners excluded). With either termination finish (Sn/Pb or Gold), a Ni barrier plating is required. 3.1.3 Body. The body shall be comprised of a ferrite-based material that is
21、 substantially devoid of air. 3.2 Impedance. The impedance values for ferrite chip beads shall be as specified in table I. Impedance shall be measured in accordance with 4.6.19. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, C
22、OLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03024 REV B PAGE 4 3.3 Maximum Current Rating. The maximum current rating is the maximum amperes that the ferrite chip bead will carry at a body temperature of +25C without degradation. The applicable current rating is specified in table I.
23、3.4 Temperature Rating. The temperature rating for ferrite chip beads specified herein is -55C to +150C nonoperating. The maximum operating temperature shall not exceed a body temperature of +125C. The temperature derating curve is given in figure 2. 3.5 Maximum DC Resistance. The maximum DC resista
24、nce values for ferrite chip beads shall be as specified in table 1 and measured in accordance with 4.6.2. Configuration Dimensions A B C BW AA 0.063 0.006 (1.60 0.15) 0.031 0.006 (0.80 0.15) 0.031 0.006 (0.80 0.15) 0.014 0.006 (0.36 0.15) BB 0.079 0.008 (2.00 0.20) 0.049 0.008 (1.25 0.20) 0.035 0.00
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