DIN EN 16602-70-07-2015 Space product assurance - Verification and approval of automatic machine wave soldering English version EN 16602-70-07 2014《航天产品保证 自动机器波钎焊的检验和验收 英文版本EN 1660.pdf

《DIN EN 16602-70-07-2015 Space product assurance - Verification and approval of automatic machine wave soldering English version EN 16602-70-07 2014《航天产品保证 自动机器波钎焊的检验和验收 英文版本EN 1660.pdf》由会员分享，可在线阅读，更多相关《DIN EN 16602-70-07-2015 Space product assurance - Verification and approval of automatic machine wave soldering English version EN 16602-70-07 2014《航天产品保证 自动机器波钎焊的检验和验收 英文版本EN 1660.pdf（32页珍藏版）》请在麦多课文档分享上搜索。

1、Januar 2015DEUTSCHE NORM DIN-Normenausschuss Luft- und Raumfahrt (NL)Preisgruppe 14DIN Deutsches Institut fr Normung e. V. Jede Art der Vervielfltigung, auch auszugsweise, nur mit Genehmigung des DIN Deutsches Institut fr Normung e. V., Berlin, gestattet.ICS 49.140!%=;“2269324www.din.deDDIN EN 16602

2、-70-07Raumfahrtproduktsicherung Verifikation und Zulassung von Maschinenschwallltverfahren;Englische Fassung EN 16602-70-07:2014Space product assurance Verification and approval of automatic machine wave soldering;English version EN 16602-70-07:2014Assurance produits des projets spatiaux Validation

3、et approbation du brasage automatique la vague;Version anglaise EN 16602-70-07:2014Alleinverkauf der Normen durch Beuth Verlag GmbH, 10772 BerlinErsatz frDIN EN 14612:2004-05www.beuth.deGesamtumfang 32 SeitenDIN EN 16602-70-07:2015-01 2 Nationales Vorwort Dieses Dokument (EN 16602-70-07:2014) wurde

4、vom Technischen Komitee CEN/CLC/TC 5 Raumfahrt“ erarbeitet, dessen Sekretariat vom DIN (Deutschland) gehalten wird. Das zustndige deutsche Normungsgremium ist der Arbeitsausschuss NA 131-10-01 AA Interoperabilitt von Informations-, Kommunikations- und Navigationssystemen“ im DIN-Normenausschuss Luft

5、- und Raumfahrt (NL). Dieses Dokument ersetzt DIN EN 14612:2004-05. Dieses Dokument (EN 16602-70-07:2014) basiert auf ECSS-Q-ST-70-07C. Dieses Dokument enthlt unter Bercksichtigung des DIN-Prsidialbeschlusses 1/2004 nur die englische Originalfassung von EN 16602-70-07:2014. Dieses Dokument wurde spe

6、ziell zur Behandlung von Raumfahrtsystemen erarbeitet und hat daher Vorrang vor jeglicher Europischer Norm, da es denselben Anwendungsbereich hat, jedoch ber einen greren Geltungsbereich (z. B. Luft- und Raumfahrt) verfgt. nderungen Gegenber DIN EN 14612:2004-05 wurden folgende nderungen vorgenommen

7、: a) Norm-Nummer gendert; b) keinerlei nderungen des Textes. Frhere Ausgaben DIN EN 14612: 2004-05 DIN EN 16602-70-07:2015-01 3 Anhang A (informativ) Begriffe und Abkrzungen 3 Begriffe und Abkrzungen 3.1 Begriffe aus anderen Normen Fr die Anwendung dieses Dokuments gelten die Begriffe nach ECSS-S-ST

8、-00-01, ECSS-Q-ST-70, ECSS-Q-ST-70-08 und nach ECSS-Q-ST-70-28. 3.2 Fr diese Norm spezifische Begriffe 3.2.1 Zulassungsgremium zulassende Behrde Entitt/Organisation, verantwortlich fr Ausfhrung (oder die Untervergabe) der Prfung an Technology Samples, Durchfhrung des Audits fr automatische Schwalllt

9、linien, Autorisierung zur Umsetzung des Verifikationsprogramms fr Lieferanten und Benachrichtigung ber durchgefhrte Verifikationen und erteilte, erneuerte oder zurckgezogene Zulassungen ANMERKUNG Die zulassende Behrde ist der Endkunde oder der vom Endkunden benannte Vertreter. Beispielsweise ist fr

10、ESA-Programme der Endkunde die ESA. 3.2.2 Bestckungsdichte Anzahl der Bauteile je Flcheneinheit der Leiterplatte 3.2.3 ionisierbare Verunreinigung Prozessrckstnde, die als Ionen vorliegen und im gelsten Zustand die elektrische Leitfhigkeit erhhen ANMERKUNG Beispiele fr Prozessrckstnde sind Aktivator

11、en, Fingerabdrcke, Salze vom tzen und Beschichten. 3.2.4 Maschinenl flssige Verbindungen, die als Schmiermittel fr Schwallltanlagen formuliert und angewendet werden ANMERKUNG Primr dient Maschinenl als Grenze zwischen der Atmosphre und dem geschmolzenem Lot, wobei durch Maschinenl die Oxidation (das

12、 Abkrtzen) des Lots verringert wird. Bestimmte le verringern auch die Oberflchenspannung des geschmolzenen Lots, wodurch seine Benetzungseigenschaften verbessert werden. 3.2.5 Maserbildung Measling Zustand im Basismaterial einer Leiterplatte in Form voneinander getrennter weier Punkte oder Kreuze“ u

13、nter der Oberflche des Basismaterials, bei denen Fasern im Glasgewebe an der Gewebekreuzung getrennt sind 3.2.6 Technology Samples Proben von schwallgelteten bestckten Leiterplatten ANMERKUNG Diese Proben werden vom Lieferanten zustzlich fr Verifikationszwecke bereitgestellt. DIN EN 16602-70-07:2015

14、-01 4 3.2.7 Schwalllten Wellenlten Prozess, bei dem Leiterplatten mit einer langsam flieenden Welle des flssigen Lots in Kontakt gebracht werden und bei dem die Zirkulation dieser Lotwelle durch Einsatz einer Pumpe erreicht wird, mit der das flssige Lotmetall aus einem geeignet gestalteten Behlter g

15、epumpt wird ANMERKUNG Die wichtigsten Funktionen der Lotwelle sind ihre Anwendung als Heizquelle, als Wrmebertragungs-mittel und zum Transport des geschmolzenen Lots zu dem zu ltenden Bereich. 3.2.8 Schwallltanlage Systeme, mit denen der Schwallltprozess durchzufhren ist ANMERKUNG 1 Eine typische Sc

16、hwallltanlage besteht aus mehreren Stationen: Station fr den Auftrag des Flussmittels (dem Fluxer), Station fr das Vorheizen und Station fr das Lten unter Anwendung eines Frdermediums. ANMERKUNG 2 Im Allgemeinen wird als Option eine Reinigung angeboten. Eine weitere Reinigung kann verlangt werden, u

17、m den ECSS-Normen (oder kundenspezifischen Normen), die Anforderungen an die Reinheit festlegen, zu entsprechen. 3.3 Abkrzungen Fr die Anwendung dieses Dokuments gelten die Abkrzungen in ECSS-S-ST-00-01 und die folgenden Abkrzungen: Abkrzung Bedeutung PID Prozessidentifizierungs-Dokument (en: proces

18、s identification document) EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 16602-70-07 October 2014 ICS 49.140 Supersedes EN 14612:2003 English version Space product assurance - Verification and approval of automatic machine wave soldering Assurance produits des projets spatiaux - Validation et

19、 approbation du brasage automatique la vague Raumfahrtproduktsicherung - Verifikation und Zulassung von Maschinenschwallltverfahren This European Standard was approved by CEN on 20 March 2014. CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the c

20、onditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC member. This European

21、 Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CEN an

22、d CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania,

23、 Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom. CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2014 CEN/CENELEC All rights of exploitation in any form and by any means reserved worldwide

24、for CEN national Members and for CENELEC Members. Ref. No. EN 16602-70-07:2014 EEN 16602-70-07:2014 (E) 2 Table of contents Foreword 4 Introduction 5 1 Scope . 6 2 Normative references . 7 3 Terms, definitions and abbreviated terms 8 3.1 Terms from other standards 8 3.2 Terms specific to the present

25、 standard . 8 3.3 Abbreviated terms. 9 4 Principles 10 5 Requirements 11 5.1 General . 11 5.1.1 PCB design constraints . 11 5.1.2 Rework 11 5.2 Request for verification of the automatic wave soldering process . 12 5.2.1 General . 12 5.2.2 Technology samples . 12 5.2.3 Examination 12 5.3 Line audit 1

26、3 5.4 Verification 13 5.4.1 Planning, management and finance 13 5.4.2 Description of samples 13 5.4.3 Initial tests . 14 5.4.4 Environmental exposure . 15 5.4.5 Final tests . 15 5.4.6 Final verification report 16 5.5 Approval . 16 5.5.1 Notification 16 5.5.2 Renewal of approval . 16 5.5.3 Withdrawal

27、 of approval 16 DIN EN 16602-70-07:2015-01 EN 16602-70-07:2014 (E) 3 5.5.4 Approval for future project . 17 5.6 Process requirements for wave soldering of printed circuit boards 17 Annex A (normative) Solder joint discrepancy log DRD . 20 Annex B (normative) Request for verification of the automatic

28、 wave soldering process - DRD. 22 Annex C (normative) Automatic wave soldering process verification report DRD 24 Annex D (normative) Machine-soldering logbook DRD 26 Annex E (normative) Wave soldering process identification document (PID) DRD 27 Bibliography . 28 Figures Figure 4-1: Sequence of mai

29、n events for final customer verification and approval of wave soldering process 10 Figure A-1 : Example of a solder joint discrepancy log . 21 Tables Table 5-1: Limits for warp and twist 14 DIN EN 16602-70-07:2015-01 EN 16602-70-07:2014 (E) 4 Foreword This document (EN 16602-70-07:2014) has been pre

30、pared by Technical Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DIN. This standard (EN 16602-70-07:2014) originates from ECSS-Q-ST-70-07C. This European Standard shall be given the status of a national standard, either by publication of an identical text or by endorsement, at

31、the latest by April 2015, and conflicting national standards shall be withdrawn at the latest by April 2015. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and/or CENELEC shall not be held responsible for identifying any or a

32、ll such patent rights. This document supersedes EN 14612:2003. This document has been prepared under a mandate given to CEN by the European Commission and the European Free Trade Association. This document has been developed to cover specifically space systems and has therefore precedence over any E

33、N covering the same scope but with a wider domain of applicability (e.g. : aerospace). According to the CEN-CENELEC Internal Regulations, the national standards organizations of the following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech

34、Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

35、DIN EN 16602-70-07:2015-01 EN 16602-70-07:2014 (E) 5 Introduction Wave soldering is regarded as a critical process that can find limited application during the assembly of components on to printed circuit boards (PCBs) intended for spacecraft. The preferred procedure is by manual soldering to the re

36、quirements of ECSS-Q-ST-70-08. Generally the small number of identically designed circuits does not warrant the setting up of unique machine parameters for each individual layout. When wave soldering is identified as a suitable alternative to manual soldering for use in the customers projects, it ca

37、n be essential to follow the steps outlined in this document before the final customers approval is granted. The sequence of main events is shown in Figure 4-1. Each step is fully completed and the details recorded, so that a dossier is compiled for each manufacturers assembly line. All dossiers are

38、 kept updated by the approval authority and serve as a reference for the approval authoritys Project Engineers. A general qualification is not granted for wave soldering. Wave soldering lines that have been previously verified (see also clause 5.2) can be also approved for use on named projects, but

39、 this depends entirely on the specific project requirements. Project process approval is requested, as for all materials and critical processes, by means of ECSS-Q-ST-70. DIN EN 16602-70-07:2015-01 EN 16602-70-07:2014 (E) 6 1 Scope This specification defines the basic requirements for the verificati

40、on and approval of automatic machine wave soldering for use in spacecraft hardware. The process requirements for wave soldering of double-sided and multilayer boards are also defined. This standard may be tailored for the specific characteristic and constrains of a space project in conformance with

41、ECSS-S-ST-00. DIN EN 16602-70-07:2015-01 EN 16602-70-07:2014 (E) 7 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this ECSS Standard. For dated references, subsequent amendments to, or revision of any of the

42、se publications do not apply. However, parties to agreements based on this ECSS Standard are encouraged to investigate the possibility of applying the more recent editions of the normative documents indicated below. For undated references, the latest edition of the publication referred to applies. E

43、N reference Reference in text Title EN 16601-00-01 ECSS-S-ST-00-01 ECSS system - Glossary of terms EN 16602-10-09 ECSS-Q-ST-10-09 Space product assurance Nonconformance control system EN 16602-70 ECSS-Q-ST-70 Space product assurance - Materials, mechanical parts and processes EN 16602-70-08 ECSS-Q-S

44、T-70-08 Space product assurance - Manual soldering of high-reliability electrical connections EN 16602-70-10 ECSS-Q-ST-70-10 Space product assurance - Qualification of printed circuit boards EN 16602-70-28 ECSS-Q-ST-70-28 Space product assurance - Repair and modification of printed circuit board ass

45、emblies for space use DIN EN 16602-70-07:2015-01 EN 16602-70-07:2014 (E) 8 3 Terms, definitions and abbreviated terms 3.1 Terms from other standards For the purpose of this Standard, the terms and definitions from ECSS-S-ST-00-01 ECSS-Q-ST-70, ECSS-Q-ST-70-08 and ECSS-Q-ST-70-28 apply. 3.2 Terms spe

46、cific to the present standard 3.2.1 approval authority entity/organization responsible for executing (or sub-contracting) the examination of the technology samples, performing the automatic wave soldering process line-audit, authorizing the implementation of the suppliers verification programme, and

47、 notifying, renewing or withdrawing the approval of the verification NOTE The approval authority is the final customer or the representative nominated by him. For example, for ESA programmes, the final customer is ESA. 3.2.2 component density number of components per unit board area 3.2.3 ionisable

48、contaminant process residues that exist as ions and when dissolved, increase electrical conductivity NOTE Examples of such process residues flux are activators, fingerprints, etching and plating salts. 3.2.4 machine oil liquid compounds formulated for use as oil in wave-soldering equipment NOTE They

49、 serve primarily to provide a barrier between the atmosphere and molten solder, thereby reducing the oxidation (drossing) of the solder. Certain oils also reduce the surface tension of molten solder, thereby enhancing the wetting characteristics of the solder. DIN EN 16602-70-07:2015-01 EN 16602-70-07:2014 (E) 9 3.2.5 measling condition existing in the base laminate of a printed circuit board in the form of discrete white spots or “crosses” below the surface of th