CECC 90 104- 153 ISSUE 1-1986 CEI-CECC 90 104-153 Hex Non-Inverting 3-State Buffer (En)《CEI-CECC 90 104-153 六同相三态缓冲器(英文)》.pdf

《CECC 90 104- 153 ISSUE 1-1986 CEI-CECC 90 104-153 Hex Non-Inverting 3-State Buffer (En)《CEI-CECC 90 104-153 六同相三态缓冲器(英文)》.pdf》由会员分享，可在线阅读，更多相关《CECC 90 104- 153 ISSUE 1-1986 CEI-CECC 90 104-153 Hex Non-Inverting 3-State Buffer (En)《CEI-CECC 90 104-153 六同相三态缓冲器(英文)》.pdf（2页珍藏版）》请在麦多课文档分享上搜索。

1、rn 1974499 0052983 7T0 rn COIIlTATO BLBTBCNCO ITAUANO Virlr Monza, 259 - 20126 XILANO Spec if cat ion ruai lable from :- As shown in CECC 00200 ELECTRONIC CoHPNENT OF ASSESSED QULIM IN ACCORWCE WITH CECC 90 000 : 1976 CECC 90 100 : 1977 MECMICAL DESCRIPTION .CI CEI-CECC 90 104-153 ISSUE 1, December

2、1984 PAGE 1 OF 2 WWUFACTURERS TYPE NUIBER 45038 I I Function : HEX NON-IWERTING 3-STATE BUFF ER Si 1 icon complementary MOS with (8) buffered outputs cauitr and non cavity packaging. ASSESWENT L WELS R, Si T and V. Opt i onal screen i ng categories A, B, C and D. I I I CAlJION: THESE AR STfrTIC SPIS

3、ITIVE DEVICES - clause 1.11 I Notes : This detail specification shall be used in connection uith OS 6s-CECC 90 104-153. This addition was prepared according to CECC O0 1S1 clause 12.3.6 to include non- couitr (plastic) devices. Changes in subroups B4, C2, C4 and C7 are shown on page 2. Subgroup C7b

4、is an additional requirement, Pot pressure test. FoGvi ty packages (plastic) the 1 imi ted operating temperature ranga (-40 to +85C) appl i es. Refer to Qualified Product List CECC O0 200 for detail5 of manufacturers opproued to this 8geci.t icaticm. -1- Copyright CENELEC Electronic Components Commi

5、ttee Provided by IHS under license with CECCNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-1974499 0052984 b37 P i4 .a. a. N.a. 1 tamination or test ECC 90 000. lause No. ub-group 84 hange of temperature .6 .E. 1 ndpoint test ib-group C2 :sistance to cleaning Aven

6、ts 4.4 ) for non cavity packages Damp heat, accelerated 4.6.3.1 or all packages: ectrical tests ib-group u Psistance to soldering heat olloued by change of mperature ndpoint tests ) for non cavity packages hp heat, accelerated 4.6 -3.1 or all packages: hctrical tests yib-qroy, C7 a :Non cavity packa

7、ges kap heat, steady state 4.6.2 Endeint tests f lectrical tests Subgroup C7 b (Non cavity packages) Additional .accelwated test Endpoint tests Electrical tests Test Conditions issessment level .6.8.1 test Na = 65OC and +lSpC 6.3.1 test Da for su-groups A2 and A3 St x A .6.11 T = +150C .6 -8.1 cst N

8、a = -65% and +15OOC h.3.1 test Da s for sub-groups R and A3 lias conditions: 15 v 1.6.2 condition 3. 21 days hs for sub-groups R and A3 T E +121oc +1oc 2.08 Ah. thration: 96 h Recovery: 24 h AS for sub-gmps A2 an - Inwectica Requireaents for sub-gmups U and ,S for sub-groups A2 and t3 AS for sub-graips A2 and A3 As for subgroups A2 and A3 Page 2 of CEI-CECC 90 104- 105 up to -223 (incl.) Copyright CENELEC Electronic Components Committee Provided by IHS under license with CECCNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-