CECC 30 801- 005 BS CECC 30 801-005 Issue 1 Tantalum Chip Capacitor Polar Solid Electrolyte Metallized Terminations Style 1 (En)《BS CECC 30 801-005第一期 钽薄片电容器两级固体电解质金属化端头 式样1(英文)》.pdf
《CECC 30 801- 005 BS CECC 30 801-005 Issue 1 Tantalum Chip Capacitor Polar Solid Electrolyte Metallized Terminations Style 1 (En)《BS CECC 30 801-005第一期 钽薄片电容器两级固体电解质金属化端头 式样1(英文)》.pdf》由会员分享,可在线阅读,更多相关《CECC 30 801- 005 BS CECC 30 801-005 Issue 1 Tantalum Chip Capacitor Polar Solid Electrolyte Metallized Terminations Style 1 (En)《BS CECC 30 801-005第一期 钽薄片电容器两级固体电解质金属化端头 式样1(英文)》.pdf(16页珍藏版)》请在麦多课文档分享上搜索。
1、BRITISH STANDARDS INSTITUTIOF 2, PARK STREET, LONDON, WlA 2BS W1 1: 0.1 A +0.3/-0.2 1.2 0.8 2.2 0.8 2.2 1.3 2.4 1.3 Specification available from:- As shown in PD 9002, CECC O0 200 and AVX LIMITED, TANTALUM DIVISION, LONG ROAD, PAIGNTON, DEVON TQ4 7ER S min 1.1 1.4 2.9 4.4 ELECTRONIC COMPONENTS OF AS
2、SESSED QUALITY DETAIL SPECIFICATION IN ACCORDANCE WITH BS CECC 30 O00 1984 BS CECC 30 800 1978 Outline and dimensions Third angle projection Marking information: See Clause 5.0 TABLE 1 DIMENSIONS RELATED TO CASE SIZE BS CECC 30 801-005 ISSUE 1 DATE November 1987 Number of pages 16 MANUFACTURERS TYPE
3、 NUMBER TAJ SEE PD 9002 AND CECC O0 200 For ordering information see Clause 6.0 TANTALUM CHIP CAPACITOR POLAR SOLID ELECTROLYTE METALLISED TERMINATIONS STYLE 1 Complies with the minimum requirements of TABLES 2 & 3 of BS CECC 30 800 Issue 1 Case size 1 L 0.2 C 1 6.0 7.3 DI w +0.2/-0.1 1.6 2.8 3.2 4.
4、3 H max 1.8 2.1 2.8 3.1 NOTE: W1 dimension applies to the termination width for the A Dimension only I I Information on availability of components qualified to this detail specification are given in the Qualified Product Lists PD 9002 and CECC O0 200 Page 1 Copyright CENELEC Electronic Components Co
5、mmittee Provided by IHS under license with CECCNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-BS CECC 30 801-005 Issue 1 November 1987 2.0 METHOD OF MOUNTING 2.1 Hethods of mounting the units for normal use include:- a) Reflow soldering by direct heat using solder
6、 paste or solder preforms. b) Vapour Phase reflow soldering using solder paste or solder preforms. c) Wave soldering. Limiting factors are:- O 1) Temperature : Temperature should not exceed 260 C. 2) Duration : Time duration should not exceed 10 seconds at maximum temperature for reflow soldering, a
7、nd 5 seconds for wave soldering. - Rominal temperature and duration : 23OoC for 10 seconds. 2.2 For Qualification Testing the mounting method detailed in the Sectional Specification BS CECC 30 800 Clause 4.8 applies. 3.0 RATING AND CHARACTERISTICS Style Capacitance range Talerunce on Rated Capzcitan
8、ce - stzndzrd Hated Voltage Category Voltage Climatic Category Rated Temperature Category Temperature Variation of Capacitance with Temperature Leakage Current Impedance at 100 kHz Tangent of Loss Angle UA Style 1 - Encapsulated See Table 2A - + je%, 2m See Table 2A See Table 2A 55/125/56 85OC 125%
9、See Table 3 See Table 3 See Table 2B / 1OV - $ 0.04 for C $ 1.0 uF 5 1Ov - / 30 uFV CU / 75 uFV CU / 360 uFV Capacitance OR uFV Impedance in Ohms - max. 50 20 15 . . 7.5 2.5 Page 4 I Copyright CENELEC Electronic Components Committee Provided by IHS under license with CECCNot for ResaleNo reproductio
10、n or networking permitted without license from IHS-,-,-m I1974499 0001632 OTB m BS CECC 30 801-005 Issue 1 November 1987 TABLE 3 CHARACTERISTICS AT HIGH AND LOW TEMPERATURE Maximum Values Tan Delta Capacitance Change Leakage Current “R (VI 4.0 CR (uF) (%I t85C (UA) ,85OC o 1.10 IU Ir II Il -55OC +2O
11、0C -55OC -85OC .2O0C o 1.01 :U ir 1.5 t 125OC k125OC ,125OC 1)o l. 125 :U ir II -8% t8% tl2% 0.06 3.09 ).O72 1.09 3.3 to 1 O0 2.2 to 1 O0 1.5 to 47 1 .o 2.2 to 33 0.68 2.2 to 22 0.47 1.5 to 15 o. 1 to 1 .o 1.5 to 10 o. 1 to 1 .o 1.5 to 4.7 II Il Il II II II II Il 6.3 10 II II II II II 0.04 0.06 0.04
12、 0.06 16 20 0.04 0.06 0.04 0.06 0.04 0.06 Il Il II II Il II . 25 35 50 Whichever is the greater Measured with category vcltagc Page 5 Copyright CENELEC Electronic Components Committee Provided by IHS under license with CECCNot for ResaleNo reproduction or networking permitted without license from IH
13、S-,-,-m 1974499 O003633 T34 m BS CECC 30 801-005 Issue 1 Noveniber 1987 4.0 RELATED DOCUMENTS BS 600 1 Sampling procedures and tables for inspection by attributes RSE 9000 General requirements for electronic components BS CECC 30 O00 Harmonised system of quality assessment for electronic components.
14、 Generic specification : Fixed Capcitors BS CECC 30 800 Harmonised system of quality assessment for electronic components. Sectional specification : Tantalum Chip Capacitors. PD 9002 ES 9000 Component Selection Guide. CECC O0 200 Qualified Product List 5.0 MARKINGS The package containing the capacit
15、ors shall be clearly marked witn all the information listed below: Polarity of terminations ( unless identified by the construction 1. Rated Capacitance. Rated Voltage. Style. Tolerance on Rated Capacitance. Manufacturer Name and/or Trade Mark. Climatic Category. Year arid Month ( or Week j of manuf
16、acture. Manufacturers Type Designation. Reference t the Detail Specification. I The Capacitors shall be marked with 11, 2) and 31, where body size permits unaided visual legibility. The positive termination wiil be identified by a BAR on tne coded surface. Page 6 Copyright CENELEC Electronic Compone
17、nts Committee Provided by IHS under license with CECCNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-1974499 0001b34 970 BS CECC 30 801-005 Issue 1 November 1987 6.0 ORDERING INFORMATION When ordering to this specification the following information should be given:
18、 I Quantity. 2 Manufacturers type code. 3 Case size reference 4 Rated Capacitance. 5 Capacitance tolerance. 6 Rated d.c. voltage. 7 Specification number, Issue and Date. Example : off TAJ B 4.7uF 10% 16Vdc to BS CECC 30 801-005 Issue . Dated _ I 7.0 8.0 1 23 4 5 6 7 Qualification Approval and Qualit
19、y Conformance Inspection For qualification approval test and quality conformance inspection the test schedule severities and requirements given in the sectional specification C CECL 30 803 andlor this specification apply. A complete test schedule is given in TABLE 4, and the following notes a2ply Fo
20、r qualification testing see 3.3 of BS CECC 30 800. Subgroups Al and A2 are combined together to form Group O. number of samples and permissible defects as shown in BS CECC 30 800. All subgroups of C are required with the Trie samples required for qualification testing wiii be in accordance with clau
21、se 3.3. f ES CELS 3 800. Certified Test Records Required in accordance with 3.2 of BS CECC 30 800. Copyright CENELEC Electronic Components Committee Provided by IHS under license with CECCNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-m I1974499 0003635 807 m BS C
22、ECC 30 801-005 Issue 1 November 1987 9.0 Visual Examination The requirement for visual examination shall be:- “There shall be no visible damage which could reduce the useability of the product for its intended purpose.“ 10.0 Solderability The capacitors shall meet the requirements of IEC 68 - 2 - 20
23、 test Ta, Method I. The body of the capacitor may be wholly or partially immersed in the solder bath. TABLE 4 - NOTES (1) Clause number and test refer to BS CECC 30 800. Performance requirements refer to this specification and/or BS CECC 30 800. (2) IL = inspection Level AQL = Acceptable Quality Lev
24、el (3) Selected from BS 6001. In these tables : P = Periodicity in months N = Sample size C = Permissible defectives D = Destructive tests ND = Non Destructive tests Page 8 Copyright CENELEC Electronic Components Committee Provided by IHS under license with CECCNot for ResaleNo reproduction or netwo
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