BS QC 790107-1995 Specification for harmonized system of quality assessment for electronic components - Semiconductor devices - Integrated circuits - Digital integrated circuits - d.pdf

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1、BRITISH STANDARD BS QC 790107:1995 IEC 748-2-10: 1994 Specification for Harmonized system of quality assessment for electronic components Semiconductor devices Integratedcircuits: Digital integrated circuits Blankdetail specification Integrated circuit dynamic read/write memoriesBSQC 790107:1995 BSI

2、 02-2000 ISBN 0 580 34464 9 Committees responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/47 Semiconductors, upon which the following bodies were represented: Federation of the Electronics Industry GAMBICA (BEAMA Ltd.) Ministry of

3、Defence Society of British Aerospace Companies Limited The following bodies were also represented in the drafting of the standard, through subcommittees and panels: British Telecommunications Plc Federation of the Electronics Industry National Supervising Inspectorate (BSI QA) Amendments issued sinc

4、e publication Amd. No. Date CommentsBSQC 790107:1995 BSI 02-2000 i Contents Page Committees responsible Inside front cover National foreword ii Text of IEC 748-2-10 1BSQC 790107:1995 ii BSI 02-2000 National foreword This British Standard has been prepared under the direction of the Electrotechnical

5、Sector Board. It is identical with IEC Publication 748-2-10 (QC709107) Semiconductor devices Integrated circuits. Part 2: Digital integrated circuits. Section 10: Blank detail specification for integrated circuit dynamic read/write memories, published by the International Electrotechnical Commission

6、 (IEC) and is a harmonized specification within the IECQ system of quality assessment for electronic components. IEC 748-2-10 was prepared by subcommittee 47A Integrated circuits of Technical Committee No.47 Semiconductor devices, and the United Kingdom participation in the drafting was provided by

7、Technical Committee EPL/47, Semiconductors. Scope This standard lists the test and inspection requirements, together with the essential descriptive parameters, limiting values, electrical characteristics and marking and ordering information which shall be included as mandatory requirements in any de

8、tail specification for these components. The British Standard which implements the IECQ Rules of Procedure is BS 9000 General requirements for a system of electronic components of assessed quality Part 3:1991 Specification for the national implementation of the IECQ System. Detail Specifications Det

9、ail specifications shall comply with the requirements of this Blank Detail Specification and BS QC 001002:1991 Rules of Procedure of the IEC Quality assessment System for Electronic Components (IECQ). Cross-references Publication referred to Corresponding British Standard IEC 68-2-17:1978 BS 2011 En

10、vironmental testing Part 2.1 Tests Part 2.1Q:1981 Test Q. Sealing IEC 617-12:1991 BS 3939 Graphical symbols for electrical power, telecommunications and electronics diagrams Part 12:1991 Guide for binary logic elements IEC 747-10:1991 BS QC 700000:1991 Harmonized system of quality assessment for ele

11、ctronic components. Generic specification for discrete devices and integrated circuits IEC 748-2:1985 BS 6493 Semiconductor devices Part 2 Integrated circuits Section2.2:1986 Recommendations for digital integrated circuits IEC 748-11:1990 BS QC 790100:1991 Harmonized system of quality assessment for

12、 electronic components. Semiconductor devices. Sectional specification for semiconductor integrated circuits excluding hybrid circuits IEC 749:1984 BS 6493 Semiconductor devices Part 3:1985 Mechanical and climatic test methodsBSQC 790107:1995 BSI 02-2000 iii A British Standard does not purport to in

13、clude all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pag

14、esi toiv, theIEC title page, pages ii to iv, pages1 to15 and abackcover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover.iv blankBSQC 790107:1995 ii BSI 02-2000 Contents Page Introdu

15、ction 1 1 Marking and ordering information 3 2 Application related description 3 3 Specification of the function 3 4 Limiting values (absolute maximum rating system) 4 5 Operating conditions (within the specified operating temperature range) 4 6 Electrical characteristics 4 7 Programming 10 8 Mechan

16、ical and environmental ratings, characteristics and data 10 9 Additional information 10 10 Screening procedure (if required) 10 11 Quality assessment procedures 10 12 Structural similarity procedures 10 13 Test conditions and inspection requirements 11 14 Additional measurement method 15 Table 1 Gro

17、up A: Lot-by-lot 12 Table 2 Group B: Lot-by-lot 13 Table 3 Group C: Periodic 14 Table 4 Group D 15BSQC 790107:1995 BSI 02-2000 iii The following publications are quoted in this standard: IEC 68-2-17:1978 Environmental testing Part 2: Tests Test Q: Sealing IEC 134:1961 Rating systems for electronic t

18、ubes and valves and analogous semiconductor devices IEC 617-12:1991 Graphical symbols for diagrams Part 12: Binary logic elements IEC 747-10:1991 Semiconductor devices Discrete devices and integrated circuits Part 10: Generic specification for discrete devices and integrated circuits IEC 748-2:1985

19、Semiconductor devices Integrated circuits Part2:Digital integrated circuits Amendment No. 1 (1991). IEC 748-11:1990 Semiconductor devices Integrated circuits Part11:Sectional specification for semiconductor integrated circuits excluding hybrid circuits IEC 749:1984 Semiconductor devices Mechanical a

20、nd climatic test methods Amendment No. 1 (1991) Amendment No. 2 (1993)iv blankBSQC 790107:1995 BSI 02-2000 1 Introduction The IEC Quality Assessment System for Electronic Components is operated in accordance with the statutes of the IEC and under the authority of the IEC. The object of this system i

21、s to define quality assessment procedures in such a manner that electronic components released by one participating country as conforming with the requirements of an applicable specification are equally acceptable in all other participating countries without the need for further testing. This blank

22、detail specification is one of a series of blank detail specifications for semiconductor devices and shall be used with the following publications: IEC 747-10/QC 700000, Semiconductor devices Discrete devices and integrated circuits Part10:Generic specification for discrete devices and integrated ci

23、rcuits. IEC 748-11/QC 790100, Semiconductor devices Integrated circuits Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits. Required information Numbers shown in brackets on this page and the following pages correspond to the following items of required

24、information, which should be entered in the spaces provided on the next page of this specification. Identification of the detail specification 1 The name of the National Standards Organization under whose authority the detail specification is issued. 2 The IECQ number of the detail specification. 3

25、The numbers and issue numbers of the generic and sectional specifications. 4 The national number of the detail specification, date of issue and any further information, if required by the national system. Identification of the component 5 Main function and type number. 6 Information on typical const

26、ruction (materials, the main technology) and the package. If applicable, variants of the products shall be given here together with the variant characteristics. The detail specification shall give a brief description including the following: technology (N MOS, etc.); structure (words bits); the type

27、 of the output circuit (e.g.: three-state); major functions. 7 Outline drawing, terminal identification, marking, and/or reference of the relevant document for outlines. 8 Categories of assessed quality according to 2.6 of the generic specification. 9 Reference data. The clauses given in square brac

28、kets on the next page of this standard, which forms the front page of the detail specification, are intended for guidance to the specification writer and shall not be included in the detail specification. When confusion may arise as to whether the paragraph is only instruction to the writer or not,

29、the paragraph shall be enclosed in brackets.BSQC 790107:1995 2 BSI 02-2000 Name (address) of responsible NAI (and possibly of body from which the specification is available). 1 Number of IECQ detail specification, plus issue number and/or date. QC 790107-. 2 ELECTRONIC COMPONENT OF ASSESSED QUALITY

30、IN ACCORDANCE WITH: 3 National number of the detail specification. 4 Generic specification: Publication 747-10/QC 700000 This box need not be used if the national number repeats IECQ number. Sectional specification: Publication 748-11/QC 790100 and national references if different. BLANK DETAIL SPEC

31、IFICATION FOR INTEGRATED CIRCUIT DYNAMIC READ/WRITE MEMORIES 5 Type number(s) of the relevant device(s). Ordering information: see 1.2 of this standard. Mechanical description 7 Short description 6 Outline references: Standard package references should be given, IEC number (mandatory if available) a

32、nd/or national number. Application: Function: Typical construction: Si, monolithic, MOS. Encapsulation: cavity or non-cavity. Comparison table of characteristics for variant products. Outline drawing: may be transferred to or given with more details in clause 8 of this standard. CAUTION: Electrostat

33、ic sensitive devices Terminal identification drawing showing pin assignments, including graphical symbols. Categories of assessed quality 8 From 2.6 of the generic specification. Marking: letters and figures, or colour code. The detail specification shall prescribe the information to be marked on th

34、e device, if any. See 2.5 of generic specification and/or 1.1 of this standard. Reference data 9 Reference data on the most important properties to permit comparison between types. Information about manufacturers who have components qualified to this detail specification is available in the current

35、Qualified Products List.BSQC 790107:1995 BSI 02-2000 3 1 Marking and ordering information 1.1 Marking See 2.5 of the generic specification. 1.2 Ordering information The following minimum information is necessary to order a specific device, unless otherwise specified: precise type reference (and nomi

36、nal voltage value, if required); IECQ reference of the detail specification with issue number and/or date when relevant; categories as defined in clause 9 of the sectional specification and, if required, the screening sequence as defined in clause 8 of the sectional specification; packaging for deli

37、very; any other particulars. 2 Application related description The following characteristics shall be given: nominal supply voltage; refresh mode; operating modes (for example address sampling); electrical compatibility (if appropriate). It shall be stated whether the integrated circuit memory is el

38、ectrically compatible with other particular integrated circuits or families of integrated circuits, or whether special interfaces are required. 3 Specification of the function 3.1 Block diagram The block diagram shall be sufficiently detailed to enable the individual functional units within the memo

39、ry to be identified with their main input and output paths and the identification of their external connections (chip enable, address decode, programming, etc.). The graphical symbol for the function shall be given. This can be obtained from a catalogue of standard graphical symbols, or designed acc

40、ording to the rules of IEC 617-12. 3.2 Identification and function of terminals All terminals shall be identified on the block diagram (supply terminals, address, data and control terminals). The terminal functions shall be indicated in a table as follows. 3.3 Functional description The following ch

41、aracteristics shall be given: memory size: the total number of bits of information capable of being stored in the memory circuit; memory organization: the number of bits per word capable of being stored in the memory circuit; addressing mode; chip select 1)(if applicable); output enable 1)(if applic

42、able); Terminal number Terminal Symbol Terminal designation Function Function of terminal Input/output identification Type of output circuit 1) The chip select and the output enable shall be distinguished.BSQC 790107:1995 4 BSI 02-2000 stand-by mode (if applicable); truth table (this table shall sho

43、w the output states versus the different combinations of the address inputs and the select inputs). 4 Limiting values (absolute maximum rating system) See IEC 134. These values apply over the operating temperature range, unless otherwise specified. Unless otherwise specified, limiting values shall b

44、e given as follows: any cautionary statement unique to an individual integrated circuit shall be included, for example the handling of MOS circuits; any interdependence of limiting values shall be specified; all conditions for which the limiting values apply shall be stated; if transient overloads a

45、re permitted, their magnitude and duration shall be specified. All voltages are referenced to a designated reference terminal. 5 Operating conditions (within the specified operating temperature range) These conditions are not to be inspected but may be used for quality assessment purposes. 6 Electri

46、cal characteristics The characteristics shall apply over the full operating conditions in clause 5 unless otherwise specified. Where the stated performance of the circuit varies over the operating temperature range, the values of the input and output voltages, and their associated currents shall be

47、stated at 25 C and at the extremes of the operating temperature range. Values of current and voltage shall be given for each functionally different type of input and/or output. Special characteristics and timing requirements shall be specified. Parameters Symbols Min. a Max. a Unit Supply voltage V

48、DD , V BB , V CC , V EE V Input voltages V 1 V Output voltages V O V Off-state voltage (note 1) V OZ V Output currents I O mA Input currents I I mA Power dissipation P D W Operating temperature T amband/or T case C Storage temperature T stg C NOTE 1Where appropriate. a Algebraic values. Characterist

49、ics Symbols Min. Max. Unit Supply voltage V CC(note 1) V DD(note 1) V BB(note 1) V EE(note 1) V V V V Low-level input voltage V IL V High-level input voltage V IH V Operating temperature T amband/or T case C NOTE 1Where appropriate these values shall also be quoted under stand-by conditions.BSQC 790107:1995 BSI 02-200