BS PD IEC TS 61967-3-2014 Integrated circuits Measurement of electromagnetic emissions Measurement of radiated emissions Surface scan metho《集成电路 电磁辐射的测量 放射形辐射测量 表面扫描法》.pdf
《BS PD IEC TS 61967-3-2014 Integrated circuits Measurement of electromagnetic emissions Measurement of radiated emissions Surface scan metho《集成电路 电磁辐射的测量 放射形辐射测量 表面扫描法》.pdf》由会员分享,可在线阅读,更多相关《BS PD IEC TS 61967-3-2014 Integrated circuits Measurement of electromagnetic emissions Measurement of radiated emissions Surface scan metho《集成电路 电磁辐射的测量 放射形辐射测量 表面扫描法》.pdf(38页珍藏版)》请在麦多课文档分享上搜索。
1、BSI Standards PublicationIntegrated circuits Measurement of electromagnetic emissionsPart 3: Measurement of radiated emissions Surface scan methodPD IEC/TS 61967-3:2014National forewordThis Published Document is the UK implementation of IEC/TS 61967-3:2014.It supersedes DD IEC/TS 61967-3:2005 which
2、is withdrawn.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Use
3、rs are responsible for its correct application. The British Standards Institution 2014.Published by BSI Standards Limited 2014ISBN 978 0 580 78113 1ICS 31.200 Compliance with a British Standard cannot confer immunity fromlegal obligations.This Published Document was published under the authority of
4、theStandards Policy and Strategy Committee on 30 September 2014.Amendments/corrigenda issued since publicationDate Text affectedPUBLISHED DOCUMENTPD IEC/TS 61967-3:2014IEC TS 61967-3 Edition 2.0 2014-08 TECHNICAL SPECIFICATION SPECIFICATION TECHNIQUE Integrated circuits Measurement of electromagneti
5、c emissions Part 3: Measurement of radiated emissions Surface scan method Circuits intgrs Mesure des missions lectromagntiques Partie 3: Mesure des missions rayonnes Mthode de balayage en surface INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE W ICS 31.200 PRICE
6、CODE CODE PRIX ISBN 978-2-8322-1809-9 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous av
7、ez obtenu cette publication via un distributeur agr. colourinsidePD IEC/TS 61967-3:2014CONTENTS FOREWORD. 5 INTRODUCTION . 7 1 Scope 8 2 Normative references 8 3 Terms, definitions and abbreviations 8 3.1 Terms and definitions 8 3.2 Abbreviations 9 4 General . 9 5 Test conditions 10 5.1 General . 10
8、 5.2 Supply voltage 10 5.3 Frequency range . 10 6 Test equipment 10 6.1 General . 10 6.2 Shielding . 10 6.3 RF measuring instrument 10 6.4 Preamplifier 10 6.5 Cables 11 6.6 Near-field probe 11 6.6.1 General . 11 6.6.2 Magnetic (H) field probe . 11 6.6.3 Electric (E) field probe 11 6.6.4 Combined ele
9、ctric and magnetic (E/H) field probe . 11 6.6.5 Probe-positioning and data acquisition system 11 7 Test setup . 12 7.1 General . 12 7.2 Test configuration . 12 7.3 Test circuit board 14 7.4 Probe-positioning system software setup . 14 7.5 DUT software 14 8 Test procedure 14 8.1 General . 14 8.2 Ambi
10、ent conditions 14 8.3 Operational check . 14 8.4 Test technique 15 9 Test report 16 9.1 General . 16 9.2 Measurement conditions 16 9.3 Probe design and calibration . 16 9.4 Measurement data 16 9.5 Post-processing 17 9.6 Data exchange 17 Annex A (normative) Calibration of near-field probes 18 A.1 Gen
11、eral . 18 A.2 Test equipment . 20 A.2.1 General . 20 PD IEC/TS 61967-3:2014 IEC TS 61967-3:2014 IEC 2014 A.2.2 PCB with microstrip line . 20 A.3 Calibration setup . 21 A.4 Calibration procedure 22 Annex B (informative) Discrete electric and magnetic field probes 25 B.1 General . 25 B.2 Probe electri
12、cal description . 25 B.3 Probe physical description . 26 B.3.1 General . 26 B.3.2 Electric field probe . 26 B.3.3 Magnetic field probe . 26 Annex C (informative) Combined electric and magnetic field probe example 28 C.1 General . 28 C.2 Probe electrical description . 28 C.3 Probe physical descriptio
13、n . 29 C.4 Measurement and data acquisition system . 29 Annex D (informative) Coordinate systems . 31 D.1 General . 31 D.2 Cartesian coordinate system . 31 D.3 Cylindrical coordinate system 32 D.4 Spherical coordinate system 33 D.5 Coordinate system conversion . 33 Bibliography . 34 Figure 1 Example
14、 of probe-positioning system 12 Figure 2 One-input RF measurement setup 13 Figure 3 Two-input RF measurement setup with reference probe 13 Figure 4 Two-input RF measurement setup with reference signal 13 Figure 5 Examples of data overlaid on an image of the DUT (Contour chart) . 16 Figure A.1 Typica
15、l probe factor against frequency 20 Figure A.2 Microstrip line for calibration (transverse cross-section) . 21 Figure A.3 Microstrip line for calibration (longitudinal cross-section) 21 Figure A.4 Probe calibration setup 22 Figure A.5 Scan direction across Microstrip line 22 Figure A.6 Typical plot
16、of measured signal level and simulated field strength (HX) 24 Figure A.7 Typical plot of measured signal level and simulated field strength (Hz) . 24 Figure B.1 Electric and magnetic field probe schematics . 25 Figure B.2 Example of electric field probe construction (EZ) . 26 Figure B.3 Example of m
17、agnetic field probe construction (HXor HY) . 27 Figure C 1 Electromagnetic field probe schematic . 28 Figure C.2 Electromagnetic field probe construction . 29 Figure C.3 Measurement and data acquisition system overview 30 Figure C.4 Measurement and data acquisition system detail . 30 Figure D.1 Righ
18、t-hand Cartesian coordinate system (preferred) 31 Figure D.2 Left-hand Cartesian coordinate system 32 Figure D.3 Cylindrical coordinate system 32 Figure D.4 Spherical coordinate system . 33 PD IEC/TS 61967-3:2014 IEC TS 61967-3:2014 IEC 2014 Table A.1 Probe factor linear units . 19 Table A.2 Probe f
19、actor logarithmic units . 19 Table A.3 Dimensions for 50 microstrip . 21 Table D.1 Coordinate system conversion 33 PD IEC/TS 61967-3:2014 IEC TS 61967-3:2014 IEC 2014 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ INTEGRATED CIRCUITS MEASUREMENT OF ELECTROMAGNETIC EMISSIONS Part 3: Measurement of radia
20、ted emissions Surface scan method FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions
21、 concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”)
22、. Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collabora
23、tes closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on th
24、e relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure tha
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