BS IEC 62830-3-2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3 Vibration based electromagnetic energy harvesting《半导体器件 收集和产生能量的半导体器.pdf
《BS IEC 62830-3-2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3 Vibration based electromagnetic energy harvesting《半导体器件 收集和产生能量的半导体器.pdf》由会员分享,可在线阅读,更多相关《BS IEC 62830-3-2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3 Vibration based electromagnetic energy harvesting《半导体器件 收集和产生能量的半导体器.pdf(24页珍藏版)》请在麦多课文档分享上搜索。
1、Semiconductor devices Semiconductor devices for energy harvesting and generationPart 3: Vibration based electromagnetic energy harvestingBS IEC 62830-3:2017BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06National forewordThis British Standard is the UK implementation
2、 of IEC 62830-3:2017. The UK participation in its preparation was entrusted to TechnicalCommittee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa cont
3、ract. Users are responsible for its correct application. The British Standards Institution 2017.Published by BSI Standards Limited 2017ISBN 978 0 580 86792 7ICS 31.080.99Compliance with a British Standard cannot confer immunity fromlegal obligations.This Published Document was published under the au
4、thority of theStandards Policy and Strategy Committee on 30 April 2017.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS IEC 62830-3:2017 2 IEC 62830-3:2017 IEC 2017 CONTENTS FOREWORD . 4 1 Scope 6 2 Normative references 6 3 Terms and definitions 6 3.1 General terms
5、. 6 3.2 Electromagnetic transducer . 8 3.3 Characteristic parameters . 9 4 Essential ratings and characteristic parameters . 11 4.1 Identification and type . 11 4.2 Limiting values and operating conditions . 12 4.3 Additional information . 12 5 Test method 12 5.1 General . 12 5.2 Electrical characte
6、ristics . 13 5.2.1 Test procedure 13 5.2.2 Inductance . 14 5.2.3 Resonant frequency . 14 5.2.4 Bandwidth 15 5.2.5 Damping ratio 15 5.2.6 Quality factor . 16 5.2.7 Output voltage . 16 5.2.8 Output current . 17 5.2.9 Output power . 17 5.2.10 Optimal load impedance 18 5.2.11 Maximum output power 18 5.3
7、 Mechanical characteristics 19 5.3.1 Test procedure 19 5.3.2 Temperature range 20 5.3.3 Input vibration 20 5.3.4 Temperature and humidity testing 20 5.3.5 Shock testing . 20 Bibliography 21 Figure 1 General structure of a vibration based electromagnetic energy harvester . 7 Figure 2 Conceptual diagr
8、am of a vibration based electromagnetic energy harvester 8 Figure 3 Equivalent circuit of a vibration based electromagnetic energy harvester 9 Figure 4 Test procedure of vibration based electromagnetic energy harvesters 13 Figure 5 Test setup for the electrical characteristics of a vibration based e
9、lectromagnetic energy harvester . 14 Figure 6 Frequency response of a vibration based electromagnetic energy harvester 15 Figure 7 Amplitude decay plot to determine the damping ratio of vibration based electromagnetic energy harvester . 16 Figure 8 Output voltage of a vibration based electromagnetic
10、 energy harvester at various external loads . 16 Figure 9 Output currents of a vibration based electromagnetic energy harvester at various output voltages . 17 BS IEC 62830-3:2017IEC 62830-3:2017 IEC 2017 3 Figure 10 Output power of a vibration based electromagnetic energy harvester at various exter
11、nal loads . 18 Figure 11 Output power and voltage of a vibration based electromagnetic energy harvester at various input vibrations 18 Figure 12 Block diagram of a test setup for evaluating the reliability of a vibration based electromagnetic energy harvester . 19 Table 1 Specification parameters fo
12、r vibration based electromagnetic energy harvesters . 12 BS IEC 62830-3:2017 4 IEC 62830-3:2017 IEC 2017 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES SEMICONDUCTOR DEVICES FOR ENERGY HARVESTING AND GENERATION Part 3: Vibration based electromagnetic energy harvesting FOREWORD 1)
13、The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical
14、and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical
15、committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organizatio
16、n for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical commi
17、ttee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is
18、 accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and r
19、egional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and,
20、 in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or a
21、gents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use o
22、f, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that som
23、e of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62830-3 has been prepared by IEC technical committee 47: Semiconductor devices. The text of this standard is base
24、d on the following documents: FDIS Report on voting 47/2363/FDIS 47/2380/RVD Full information on the voting for the approval of this International Standard can be found in the report on voting indicated in the above table. This document has been drafted in accordance with the ISO/IEC Directives, Par
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