BS IEC 61523-3-2004 Delay and power calculation standards - Standard delay formaty (SDF) for the electronic design process《延迟和功率计算标准 电子设计过程用标准延迟格式(SDF)》.pdf
《BS IEC 61523-3-2004 Delay and power calculation standards - Standard delay formaty (SDF) for the electronic design process《延迟和功率计算标准 电子设计过程用标准延迟格式(SDF)》.pdf》由会员分享,可在线阅读,更多相关《BS IEC 61523-3-2004 Delay and power calculation standards - Standard delay formaty (SDF) for the electronic design process《延迟和功率计算标准 电子设计过程用标准延迟格式(SDF)》.pdf(94页珍藏版)》请在麦多课文档分享上搜索。
1、BRITISH STANDARD BS IEC 61523-3:2004 Delay and power calculation standards Part 3: Standard Delay Format (SDF) for the electronic design process ICS 35.240.50 BS IEC 61523-3:2004 This British Standard was published under the authority of the Standards Policy and Strategy Committee on 15 December 200
2、4 BSI 15 December 2004 ISBN 0 580 44887 8 National foreword This British Standard reproduces verbatim IEC 61523-3:2004 and implements it as the UK national standard. The UK participation in its preparation was entrusted to Technical Committee GEL/93, Design automation, which has the responsibility t
3、o: A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards C
4、orrespondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard does
5、not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European develop
6、ments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the IEC title page, pages 2 to 90, an inside back cover and a back cover. The BSI copyright notice displayed in this document indicates when the document was last issued. Amendments is
7、sued since publication Amd. No. Date CommentsINTERNATIONAL STANDARD IEC 61523-3 First edition 2004-09 IEEE 1497 Delay and power calculation standards Part 3: Standard Delay Format (SDF) for the electronic design process Reference number IEC 61523-3(E):2004 IEEE Std. 1497(E):2001 BSIEC615233:2004 CON
8、TENTS FOREWORD. 3 IEEE Introduction. 71. Overview. 8 1.1 Scope. 8 1.2 Organization of this standard 8 2. References. 9 3. Conventions 9 3.1 Terminology conventions 9 3.2 Syntactic conventions 9 4. SDF in the design process. 12 4.1 Sharing of timing data. 12 4.2 Using multiple SDF files in one design
9、. 12 4.3 Timing data and constraints 13 4.4 Timing environments 13 4.5 Back-annotation of timing data for design analysis 13 4.6 Forward-annotation of timing constraints for design synthesis. 15 4.7 Timing models supported by SDF. 16 5. Defining the standard delay format. 18 5.1 SDF file content 18
10、5.2 Header section. 20 5.3 Cells 25 5.4 Delays 28 5.5 Timing checks. 46 5.6 Labels 60 5.7 Timing environment 62 Annex A (normative) Syntax of SDF . 74 Annex B (informative) SDF file examples . 84 Annex C (informative) List of Participants. 89 Pusilbdeh yb IEC uecil rednecn from 4002 .EEEI .EEEI lAr
11、listhg erdevres. BSIEC615233:20042INTERNATIONAL ELECTROTECHNICAL COMMISSION _ DELAY AND POWER CALCULATION STANDARDS Part 3: Standard Delay Format (SDF) for the electronic design process FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization co
12、mprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International St
13、andards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this pr
14、eparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two orga
15、nizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form
16、 of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretat
17、ion by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or reg
18、ional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) Attention is drawn to the possibility that some of the elements of t
19、his IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC/IEEE 61523-3 has been processed through IEC technical committee 93: Design automation. The text of this standard is based on the follow
20、ing documents: IEEE Std FDIS Report on voting 1497 (2001) 93/191/FDIS 93/196/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives. The commit
21、tee has decided that the contents of this publication will remain unchanged until 2006. IEC 61523 consists of the following parts, under the general title Delay and power calculation standards: IEC 61523-1, Part 1: Integrated circuit delay and power calculation systems Psilbudeh yb IEC uecil rednecn
22、 from 4002 .EEEI .EEEI lAir lsthg erdevres. BSIEC615233:20043IEC 61523-2, Part 2: Pre-layout delay calculation specification of CMOS ASIC libraries IEC/IEEE 61523-3, Part 3: Standard Delay Format (SDF) for the electronic process Psilbudeh yb IEC uecil rednecn from 4002 .EEEI .EEEI lAir lsthg erdevre
23、s. BSIEC615233:20044IEC/IEEE Dual Logo International Standards This Dual Logo International Standard is the result of an agreement between the IEC and the Institute of Electrical and Electronics Engineers, Inc. (IEEE). The original IEEE Standard was submitted to the IEC for consideration under the a
24、greement, and the resulting IEC/IEEE Dual Logo International Standard has been published in accordance with the ISO/IEC Directives. IEEE Standards documents are developed within the IEEE Societies and the Standards Coordinating Committees of the IEEE Standards Association (IEEE-SA) Standards Board.
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