BS IEC 60300-3-7-1999 Dependability management - Application guide - Application guide - Reliability stress screening of electronic hardware《可靠性管理 应用指南 电子硬件的可靠性应力筛选》.pdf

《BS IEC 60300-3-7-1999 Dependability management - Application guide - Application guide - Reliability stress screening of electronic hardware《可靠性管理 应用指南 电子硬件的可靠性应力筛选》.pdf》由会员分享，可在线阅读，更多相关《BS IEC 60300-3-7-1999 Dependability management - Application guide - Application guide - Reliability stress screening of electronic hardware《可靠性管理 应用指南 电子硬件的可靠性应力筛选》.pdf（38页珍藏版）》请在麦多课文档分享上搜索。

1、BRITISH STANDARD 603003-7 1999 Dependability management - Part 3-7: Application guide - Reliability stress screening of electronic hardware ICs 03.120.01; 31.020 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGIIT LAW BS IEC 603003-7:1999 This British Standard, having been prepared u

2、nder the - present to the responsible internationailEuropean committee any enquiries on the interpretation, or proposals for change, and keep the UK inkrests informed; - monitor related internationai and European developments and promulgate them in the UK. A list of organizations represented on this

3、 subcommittee can be obtained on request to its secretary. From 1 January 1997, all IEC publications have the number 60000 added to the old number. For instance, IEC 27-1 has been renumbered as IEC 60027-1. For a period of time during the change over from one numbering system to the other, publicati

4、ons may contain identifiers from both systems. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “Internaonal Standards Correspondence Index”, or by using t

5、he “Find” facity of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from l

6、egd obligations. Summary of pages This document comprises a hnt cover, an inside front cover, the IEC title page, pages 2 to 35 and a back cover. The BI copyright notice displayed in this document indicxtes when the document was last issued Amendments issued since publication O BSI 09-1999 ISBN O 58

7、0 32937 2 - STD-BSI BS IEC b0300-3-7-ENGL 1777 W lib2Libb7 077Lib7L 782 BS IEC 60300-3-7:1999 NORME CE1 INTERNATIONALE INTERNATIONAL STANDARD IEC 60300-3-7 Premire dition First edition 1999-05 Gestion de la sret de fonctionnement - Partie 3-7: Guide dapplication - Dverminage sous contraintes du mate

8、riel lectronique Dependability management - Part 3-7: Application guide - Reliability stress screening of electronic hardware Numro de rfrence Reference number CEVI EC 60300-3-7: 1 999 1 CONTENTS Page FOREWORD ._._.,. 3 INTRODUCTION ., 4 cirue 1 scope _.-*. (5 2 Normative references .- . . 5 3 Defin

9、itions . - 6 8 4 Acronyms _-., 5 6 7 8 11 9 Screening types . . . . . 13 10 Screening levels ._._. 14 11 Screening strength . . ._. 14 12 Selection of screens .,., 14 13 Flaws detected by a reliability stress screening process . . 14 Pre-production screening process ._-. 15 15 Planning, performing a

10、nd eliminating a reliability stress screening process . 15 15.1 General . 15 15.2 Step 1 - Identification of objectives and goals , 15 15.3 Step 2 - Screening process design and application . . . 17 21 15.4 Step 3 - Cost-benefit analysis . 15.5 Step 4 - Preparation of a screening plan . 23 15.6 Step

11、 5 - Screening process data collection, analysis and corrective actions , 24 General considerations for a reliability stress screening programme . 9 General information about the reliability stress screening process ._. . . . . 9 Analysis of the benefits of the reliability stress screening process .

12、 10 Characteristics of a successful reliability stress screening programme 10 Figures 1 Levels where reliability stress screening can be performed . 12 2 Reliability stress screening of repairable items 22 3 Flow char! for control of a reliability stress screening process ._. 25 A.l Level chosen for

13、 the RSS process 31 Table A.l - Relation between the sensitivity of flaws and stresses 32 Annex A (informative) RSS of repairable items produced in lots 28 Annex B (informative) RSS of electronic components . . . . . . . . 33 2 STD-BSI BS IEC b0300-3-7-ENGL 1999 = Lb2LibbS 079Lib73 755 W BS IEC 6030

14、0-3-7:1999 INTERNATIONAL ELECTROTECHNICAL COMMISSION DEPENDABILITY MANAGEMENT - Part 3-7: Application guide - Reliability stress screening of electronic hardware FOREWORD The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all national elect

15、rotechnical committees (IEC National Committees). The object of the IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, the IEC publishes International Standards. Their prep

16、aration is entrusted to technical committees: any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC collaborates clos

17、ely with the International Organization for Standardization (EO) in accordance with conditions determined by agreement between the two organizations. The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international consensus of opinion on the releva

18、nt subjects since each technical committee has representation from all interested National Committees. The documents produced have the form of recommendations for international use and are published in the form of standards, technical reports or guides and they are accepted by the National Committee

19、s in that sense. In order to promote international unification, IEC National Committees undertake to apply IEC International Standards transparently to the maximum extent possible in their national and regional standards. Any divergence between the IEC Standard and the corresponding national or regi

20、onal standard shall be clearly indicated in the latter. The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with one of its standards. Attention is drawn to the possibility that some of the elements of this

21、International Standard may be the subject of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60300-3-7 has been prepared by IEC technical committee 56: Dependability. The text of this standard is based on the following do

22、cuments: FDIC I Report on votina I I 561654lFDIS I 56/660/RVD I Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. Annexes A and B are for information only. 3 INTRODUCTION With the continuous advancement in electronics

23、technology, especially the usage of new materials and the introduction of new and immature manufacturing processes, stress and time dependent types of physical, chemical and mechanical imperfections are introduced to the electronic hardware. These types of imperfections are called flaws. Based on th

24、e operational and environmental stress profiles of electronic hardware, these flaws could manifest as failures during the hardware useful life. A reliability stress screening process (RSS) is a process which involves the application of operational and/or environmental stress to electronic hardware o

25、n a 100 % basis, for the purpose of precipitating inherent, as well as process-induced, flaws while neither destroying nor degrading in a significant way the hardware being stressed. Screening can also be made without increased stress. This screening is based on measurements on primary functional pa

26、rameters or secondary parameters. Such a screening process is called an indicator screening. A standard on indicator screening is planned. It is important to emphasize that flaws which can be revealed by functional tests, visual inspection, or other types of conventional quality control procedures,

27、should not be the target of the screening process. The objective of a stress screening process is to focus on flaws which are not revealed by normal methods, and manifest these as failures in the factory rather than in the field. However, the RSS process should not create failure modes other than th

28、ose normally expected during the operational life of the item. It is important to point out the difference in interpretation and purpose between a screening process and testing. In spite of the fact that an analysis of screening process data may reveal the weakness of a certain manufacturing process

29、, or a common part failure pattern, the purpose of an RSS process should not be confused with that of environmental qualification tests, reliability tests, factory acceptance tests or any other type of tests. The purpose of these other tests is to demonstrate the conformance of the hardware to desig

30、n and reliability/quality requirements. In addition, the environments used in the screening process are tailored to precipitate specific flaws and may have no relation to the hardware life cycle environmental profile. In other words, the RSS process is a stimulation process and not a simulation test

31、. However, data from a component RSS process may be used to accept or reject a lot of equipment or components. 4 STD.BS1 BS IEC b0300-3-7-ENGL 1777 lb2qbb 0774b75 528 BS IEC 60300-3-71999 DEPENDABILITY MANAGEMENT - Part 3-7: Application guide - Reliability stress screening of electronic hardware 1 S

32、cope This part of IEC 60300 serves as an application guide to a reliability stress screening process for electronic hardware. The concept, purpose and justification of the screening process are explained. The main elements of a screening programme are stated, together with the general planning proce

33、dure. This standard is intended as a guide and should be used in conjunction with one of the IEC reliability stress screening standards, (“tools“ in the toolbox concept), referenced in clause 15, based on the screening process application level. This standard gives guidance in cases where it is esse

34、ntial that early failures be removed from the items manufactured in order to deliver them to the customer when the problems causing the early failures are solved. The standard also gives guidance on where the reliability stress screening should be carried out, .e. component level, subsystem level, o

35、r system level (see figure l), and can also be used where steps to reduce the risk of early failures are included in a contract. This standard is aimed at personnel in the contract department, project management, product development, process management, production, quality control and purchasing. 2

36、Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this International Standard. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply. However, parties to agreemen

37、ts based on this International Standard are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. For undated references, the latest edition of the normative document referred to applies. Members of IEC and IS0 maintain registers o

38、f currently valid International Standards. IEC 60050(191): 1990, International Electrotechnical Vocabulary (IEV) - Chapter 197: Dependability and quality of service IEC 60068-2 (all parts), Environmental testing - Part 2: Tests IEC 60747 (all parts), Semiconductor devices - Discrete devices IEC 6074

39、8 (all parts), Semiconductor devices - Integrated circuits IEC 60749:1996, Semiconductor devices - Mechanical and climatic test methods IEC 61 163-1 :1995, Reliability stress screening - Part 7: Repairable items manufactured in lots IEC 61 163-2:1998, Reliability stress screening - Part 2: Electroni

40、c components IS0 8258:1991, Shewhart control charts MIL STO 750, 2052 Test methods for semiconductor devices, 2000 series test methods MIL STD 883, 2020 Test methods for microelectronics, 2000 series test methods 5 3 Definitions For the purpose of this part of IEC 60300 the following definitions, as

41、 well as those given in IEC 60050(191), apply. NOTE - Terms of particular importance for reliability stress screening of repairable items are quoted with the IEC SOOSO(l91) reference number stated in square brackets. The quotation includes ail notes, whether they are relevant to this standard or not

42、. Additional comments to an IEV term, relevant to RSS, are stated as remark“. 3.1 reliability improvement a process undertaken with the deliberate intention of improving the reliability performance by eliminating causes of systematic failures and/or by reducing the probability of occurrence of other

43、 failures IEV 191 -1 7-05 Remark - Reliability stress screening reduces the probability of occurrence of other failures. The systematic failures are principally catered for by a reliability growth programme, but some may appear during the RSS process. 3.2 systematic failure a failure related in a de

44、terministic way to a certain cause, which can only be eliminated by a modification of the design or of the manufacturing process, operational procedures, documentation or other relevant factors NOTE 1 - Corrective maintenance without modification will usually not eliminate the failure cause. NOTE 2

45、- A systematic failure can be induced at will by simulating the failure cause. IEV 191-04-191 NOTE 3 - Design, in this case, includes hardware and/or software as appropriate. 3.3 reliability screening (process) a process of detection of flaws and removal and repair of weak items for the purpose of r

46、eaching as rapidly as possible the reliability level expected during the useful life NOTE 1 - IEV 191-17-02 definies the term burn-in“. This term, however, is used by many manufacturers to describe a so-called soak test“, which is only one of many possible ways of screening. Furthermore, “burn-in“ m

47、ay include ageing, the purpose of which is to stabilize parameters, and where in many cases no failures occur. NOTE 2 - IEV 191-14-09 defines the term screening test“. This term, however, is defined too broadly to be applicable in the present context because it encompasses screening for all types of

48、 non-conformities. Furthermore, reliability screening is a process, not a test. NOTE 3 - Environmental test levels, e.g. IEC 60068-2, are often used in the stress screening process in order to use standard test equipment and standard control programmes for the equipment. 3.4 useful life under given

49、conditions, the time interval beginning at a given instant of time, and ending when the failure intensity becomes unacceptable or when the item is considered unrepairable as a result of a fault NOTE - In French the term dure de vie utile is the duration of this time interval. IEV 191-10-061 3.5 reliability stress screening (process) a process using environmental andior operational stress as a means of detecting flaws by precipitating them as detectable failures NOTE - lhe RSS process is designed with the intention of precipitating flaws as detectable