BS EN 61837-2-2011 Surface mounted piezoelectric devices for frequency control and selection Standard outlines and terminal lead connections Ceramic enclosures《频率控制和选择用表面安装压电装置 标准概.pdf

《BS EN 61837-2-2011 Surface mounted piezoelectric devices for frequency control and selection Standard outlines and terminal lead connections Ceramic enclosures《频率控制和选择用表面安装压电装置 标准概.pdf》由会员分享，可在线阅读，更多相关《BS EN 61837-2-2011 Surface mounted piezoelectric devices for frequency control and selection Standard outlines and terminal lead connections Ceramic enclosures《频率控制和选择用表面安装压电装置 标准概.pdf（90页珍藏版）》请在麦多课文档分享上搜索。

1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationSurface mounted piezoelectricdevices for frequency control and selection Standard outlines and terminal lead connectionsPart 2: Ceramic enclosuresBS EN 61837-2:2011Licensed Copy:

2、 Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 22/11/2011 07:47, Uncontrolled Copy, (c) BSINational forewordThis British Standard is the UK implementation of EN 61837-2:2011. It is identical to IEC 61837-2:2011. It supersedes BS EN 61837-2:2001 which is withdrawn.The UK participation in its preparation wa

3、s entrusted to Technical Committee EPL/49, Piezoelectric devices for frequency control and selection.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are re

4、sponsible for its correct application. BSI 2011ISBN 978 0 580 67137 1 ICS 29.035.30, 31.140 Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 July 2011.Amendmen

5、ts issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 61837-2:2011Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 22/11/2011 07:47, Uncontrolled Copy, (c) BSIEUROPEAN STANDARD EN 61837-2 NORME EUROPENNE EUROPISCHE NORM July 2011 CENELEC European Committee for Electrotech

6、nical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 618

7、37-2:2011 E ICS 31.140 Supersedes EN 61837-2:2000English version Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2011) Dispositifs pizolectriques montage en surface pour la commande

8、et le choix de la frquence - Encombrements normaliss et connexions des sorties - Partie 2: Enveloppes en cramique (CEI 61837-2:2011) Oberflchenmontierbare piezoelektrische Bauteile zur Frequenzstabilisierung und -selektion - Norm-Gehusemae und Anschlsse - Teil 2: Keramikgehuse (IEC 61837-2:2011) Thi

9、s European Standard was approved by CENELEC on 2011-07-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical ref

10、erences concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC

11、 member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hun

12、gary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. BS EN 61837-2:2011Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 22/11/2011 07:47, Uncontrolled Copy

13、, (c) BSIEN 61837-2:2011 - 2 - Foreword The text of document 49/884/CDV, future edition 2 of IEC 61837-2, prepared by IEC TC 49, Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection, was submitted to the IEC-CENELEC parallel vote

14、 and was approved by CENELEC as EN 61837-2 on 2011-07-01. This European Standard supersedes EN 61837-2:2000. In EN 61837-2:2011, types of enclosures are renamed to express their features in their names for better understanding. The relative comparison of new types with old ones is listed in Table. 1

15、. New names of enclosures express configuration type, terminal lead numbers, sizes and arrangement of terminal pads. The details of definition are shown in Clause 3: Configuration of enclosures, and Clause 4: Designation of types. Enclosures in EN 61837-2:2011 are based on EN 61240. In EN 61837-2:20

16、11, 27 enclosures are added to EN 61837-2:2000, as follows: QCC-12/1407A, DCC-2/1206A, QCC-10/9272A, DCC-4/9070A, DCC-2-8045B, DCC-6/7834B, DCC-6/7050A, QCC-10/7050A, DCC-4/6035C, DCC-2/6035C, QCC-8/5045A, DCC-4/5032A, DCC-4/5032C, DCC-2/4818C, DCC-2/4115C, QCC-8/3838A, DCC-6/3838A, DCC-4/3225C, DCC

17、-2/3215C, QCC-8/3030B, DCC-6/3030A, DCC-6/2520A, DCC-4/2520C, DCC-4/2020C, DCC-4/2016C, DCC-4/1612C, DCC-2/1612C. As a result, EN 61837-2:2011 contains a total of 38 enclosure types, which are listed in Table 1 Designation of ceramic enclosures. This standard is to be read in conjunction with EN 612

18、40. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent rights. The following dates were fixed: latest date by which the EN has to be implemented at

19、national level by publication of an identical national standard or by endorsement (dop) 2012-04-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2014-07-01 Annex ZA has been added by CENELEC. _ BS EN 61837-2:2011Licensed Copy: Wang Bin, ISO/EXCHANGE C

20、HINA STANDARDS, 22/11/2011 07:47, Uncontrolled Copy, (c) BSI- 3 - EN 61837-2:2011 Endorsement notice The text of the International Standard IEC 61837-2:2011 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to

21、 be added for the standards indicated: IEC 60122-3:2010 NOTE Harmonized as EN 60122-3:2010 (not modified). IEC 60191-6:2009 NOTE Harmonized as EN 60191-6:2009 (not modified). IEC 60368-1:2000 NOTE Harmonized as EN 60368-1:2000 (not modified). IEC 60368-2-2:1996 NOTE Harmonized as EN 60368-2-2:1999 (

22、not modified). IEC 60368-3:2001 NOTE Harmonized as EN 60368-3:2001 (not modified). IEC 60679-1:2007 NOTE Harmonized as EN 60679-1:2007 (not modified). IEC 60679-3:2001 NOTE Harmonized as EN 60679-3:2001 (not modified). IEC 60862-1:2003 NOTE Harmonized as EN 60862-1:2003 (not modified). IEC 60862-2:2

23、002 NOTE Harmonized as EN 60862-2:2002 (not modified). IEC 60862-3:2003 NOTE Harmonized as EN 60862-3:2003 (not modified). IEC 61019-1:2004 NOTE Harmonized as EN 61019-1:2005 (not modified). IEC 61016-2:2005 NOTE Harmonized as EN 61016-2:2005 (not modified). ISO 1101:2004 NOTE Harmonized as EN ISO 1

24、101:2005 (not modified). _ BS EN 61837-2:2011Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 22/11/2011 07:47, Uncontrolled Copy, (c) BSIEN 61837-2:2011 - 4 - Annex ZA (normative) Normative references to international publications with their corresponding European publications The following r

25、eferenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by comm

26、on modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 61240 - Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules EN 61240 - BS EN 61837-2:2011Licensed Copy: Wan

27、g Bin, ISO/EXCHANGE CHINA STANDARDS, 22/11/2011 07:47, Uncontrolled Copy, (c) BSI 2 61837-2 IEC:2011 CONTENTS 1 Scope . 5 2 Normative references . 5 3 Configuration of enclosures 5 4 Designation of types . 5 5 Ceramic enclosure dimensions . 6 6 Lead connections . 6 7 Designation of ceramic enclosure

28、s . 6 Bibliography 84 Table 1 Designation of ceramic enclosures 6 BS EN 61837-2:2011Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 22/11/2011 07:47, Uncontrolled Copy, (c) BSI61837-2 IEC:2011 5 SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION STANDARD OUTLINES AND TE

29、RMINAL LEAD CONNECTIONS Part 2: Ceramic enclosures 1 Scope This part of IEC 61837 deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240. 2 Normative references The

30、 following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 61240, Piezoelectric devices Preparation of outl

31、ine drawings of surface-mounted devices (SMD) for frequency control and selection General rules 3 Configuration of enclosures The enclosures of the surface-mounted devices are made of ceramic materials with the terminals of deposited metal film (leadless type) based on descriptive designation system

32、 for semiconductors devices package. The configuration symbols are shown as follows: DCC (dual chip carrier); QCC (quad chip carrier). 4 Designation of types The designation of types is shown on four parts as follows: A: Configuration symbol of enclosures: DCC (dual chip carrier); QCC (quad chip car

33、rier). B: Structure of terminal leads: leadless type has no mark. C: Number of terminal leads A B C D D E BS EN 61837-2:2011Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 22/11/2011 07:47, Uncontrolled Copy, (c) BSI 6 61837-2 IEC:2011 D: Serial number of both figures E: Arrangement of termin

34、al land: A (arranges to the width direction side); B (arranges in the length direction side); C (arranges in both the width and the length direction side). 5 Ceramic enclosure dimensions The dimensions given in this standard apply to all completed SMD-devices for frequency control and selection. Onl

35、y those dimensions which meet the requirements of IEC 61240 are given. 6 Lead connections Recommendations for the lead connections of all completed SMD-devices for frequency control and selection are given in the following individual sheets. Lead connections shall always be given in the detail speci

36、fication. 7 Designation of ceramic enclosures Table 1 is a list which includes all new enclosure types with their sheet numbers and brief descriptions. Old enclosure names are also listed as references. Table 1 Designation of ceramic enclosures No. Type Old type Sheet No. Description 1 QCC-18/1809A

37、QCC-18/01 Sheet 1 Ceramic, welded, eighteen leadless SMD outline 2 QCC-12/1407A Sheet 2 Ceramic, welded, twelve leadless SMD outline 3 DCC-4/1206A DCC-4/01 Sheet 3 Ceramic, four leadless SMD outline 4 DCC-2/1206A Sheet 4 Ceramic, two leadless SMD outline 5 QCC-10/9272A Sheet 5 Ceramic, welded, ten l

38、eadless SMD outline 6 DCC-4/9070A Sheet 6 Ceramic, welded, four leadless SMD outline 7 DCC-4/8045B DCC-04/02, 03 Sheet 7 Ceramic, welded, four leadless SMD outline 8 DCC-2/8045B Sheet 8 Ceramic, welded, two leadless SMD outline 9 DCC-6/7834B Sheet 9 Ceramic, welded, six leadless SMD outline 10 DCC-6

39、/7050A Sheet 10 Ceramic, welded, six leadless SMD outline 11 DCC-4/7050A DCC-4/08 Sheet 11 Ceramic, welded, four leadless SMD outline 12 DCC-4/7050B DCC-4/04, 05 Sheet 12 Ceramic, welded, four leadless SMD outline 13 QCC-10/7050A Sheet 13 Ceramic, welded, ten leadless SMD outline 14 QCC-6/7050A QCC-

40、6/01, 02 Sheet 14 Ceramic, welded, six leadless SMD outline 15 DCC-6/6035A DCC-4/06, 07 Sheet 15 Ceramic, welded, six leadless SMD outline 16 DCC-4/6035C Sheet 16 Ceramic, welded, four leadless SMD outline 17 DCC-2/6035C Sheet 17 Ceramic, welded, two leadless SMD outline 18 QCC-8/5050A QCC-8/02 Shee

41、t 18 Ceramic, welded, eight leadless SMD outline 19 QCC-12/5045A QCC-12/02 Sheet 19 Ceramic, welded, twelve leadless SMD outline 20 QCC-8/5045A Sheet 20 Ceramic, welded, eight leadless SMD outline BS EN 61837-2:2011Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 22/11/2011 07:47, Uncontrolled

42、 Copy, (c) BSI61837-2 IEC:2011 7 No. Type Old type Sheet No. Description 21 DCC-4/5032A Sheet 21 Ceramic, welded, four leadless SMD outline 22 DCC-4/5032C Sheet 22 Ceramic, welded, four leadless SMD outline 23 DCC-2/5032B DCC-2/01 Sheet 23 Ceramic, welded, two leadless SMD outline 24 DCC-2/4818C She

43、et 24 Ceramic, welded, two leadless SMD outline 25 DCC-2/4115C Sheet 25 Ceramic, welded, two leadless SMD outline 26 DCC-4/4025C DCC-6/01 Sheet 26 Ceramic, welded, four leadless SMD outline 27 QCC-8/3838A Sheet 27 Ceramic, welded, eight leadless SMD outline 28 DCC-6/3838A Sheet 28 Ceramic, welded, s

44、ix leadless SMD outline 29 DCC-2/3215C Sheet 29 Ceramic, welded, two leadless SMD outline 30 DCC-4/3225C Sheet 30 Ceramic, welded, four leadless SMD outline 31 QCC-8/3030B Sheet 31 Ceramic, welded, eight leadless SMD outline 32 DCC-6/3030A Sheet 32 Ceramic, welded, six leadless SMD outline 33 DCC-6/

45、2520A Sheet 33 Ceramic, welded, six leadless SMD outline 34 DCC-4/2520C Sheet 34 Ceramic, welded, four leadless SMD outline 35 DCC-4/2020C Sheet 35 Ceramic, welded, four leadless SMD outline 36 DCC-4/2016C Sheet 36 Ceramic, welded, four leadless SMD outline 37 DCC-4/1612C Sheet 37 Ceramic, welded, f

46、our leadless SMD outline 38 DCC-2/1612C Sheet 38 Ceramic, welded, two leadless SMD outline BS EN 61837-2:2011Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 22/11/2011 07:47, Uncontrolled Copy, (c) BSI 8 61837-2 IEC:2011 Ref. Dimensions (mm) Notes Min. Nom. Max. A (18,0) 18,30 B (9,0) 9,30 G

47、2,00 K 0,50 1,10 LB1,20 1,80 Note 1 e 2,54 y 0,10 NOTE 1 Dimension LBmax. can be increased to 2,10mm for lead 1 to identity the orientation. Ceramic, welded, eighteen leadless SMD outline Type QCC-18/1809A Scale 3: 1 Sheet 1 IEC 853/11 BS EN 61837-2:2011Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA ST

48、ANDARDS, 22/11/2011 07:47, Uncontrolled Copy, (c) BSI61837-2 IEC:2011 9 Terminal land connections of Type QCC-18/1809A No. Crystal unit Crystal oscillator Crystal filter SAW devices 1 Ground 2 Option 3 Option 4 Option 5 Option 6 Ground 7 Input/Output 8 Ground 9 Input/Output /Ground 10 Ground 11 Opti

49、on 12 Option 13 Option 14 Option 15 Ground 16 Output/Input 17 Ground 18 Output/Input /Ground BS EN 61837-2:2011Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 22/11/2011 07:47, Uncontrolled Copy, (c) BSI 10 61837-2 IEC:2011 Ref. Dimensions (mm) Notes Min. Nom. Max. A (14,0) 14,30 B (6,5) 6,80 G 2,00 K 0,50 1,10 LB 1,80 2,30 Note 1 e 2,54 y 0,10 NOTE 1 Dim