BS EN 61837-1-2012 Surface mounted piezoelectric devices for frequency control and selection Standard outlines and terminal lead connections Plastic moulded enclosure outlines《频带控制.pdf
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1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationSurface mounted piezoelectricdevices for frequency control and selection. Standard outlines and terminal lead connectionsPart 1: Plastic moulded enclosure outlinesBS EN 61837-1:2
2、012National forewordThis British Standard is the UK implementation of EN 61837-1:2012. It isidentical to IEC 61837-1:2012. It supersedes BS EN 61837-1:1999 which iswithdrawn.The UK participation in its preparation was entrusted to Technical CommitteeEPL/49, Piezoelectric devices for frequency contro
3、l and selection.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. The British Standards Institution 2012Published
4、by BSI Standards Limited 2012ISBN 978 0 580 66749 7ICS 31.140Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of the StandardsPolicy and Strategy Committee on 30 September 2012.Amendments issued since publicationA
5、md. No. Date Text affectedBRITISH STANDARDBS EN 61837-1:2012EUROPEAN STANDARD EN 61837-1 NORME EUROPENNE EUROPISCHE NORM August 2012 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Manage
6、ment Centre: Avenue Marnix 17, B - 1000 Brussels 2012 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61837-1:2012 E ICS 31.140 Supersedes EN 61837-1:1999English version Surface mounted piezoelectric devices for frequency control
7、and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines (IEC 61837-1:2012) Dispositifs pizolectriques montage en surface pour la commande et le choix de la frquence - Encombrements normaliss et connexions des sorties - Partie 1: Encombrements des
8、enveloppes en plastique moules (CEI 61837-1:2012) Oberflchenmontierbare piezoelektrische Bauteile zur Frequenzstabilisierung und -selektion - Norm-Gehusemae und Anschlsse - Teil 1: Kunststoffgehuse (IEC 61837-1:2012) This European Standard was approved by CENELEC on 2012-05-25. CENELEC members are b
9、ound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the
10、 CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Manageme
11、nt Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Irelan
12、d, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. BS EN 61837-1:2012EN 61837-1:2012 - 2 - Foreword The text of document 49/930/CDV, future edition 2 of IEC 61837-1, prepar
13、ed by IEC/TC 49 “Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 61837-1:2012. The following dates are fixed: latest date by which the document ha
14、s to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2013-02-25 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2015-05-25 This document supersedes EN 61837-1:1999. EN 61837-1:2012 includes
15、 the following significant technical changes with respect to EN 61837-1:1999: - one enclosure type (SIP-L5/01) has been deleted; - configuration symbol of enclosures is currently consolidated into one as DCC (dual chip carrier). This standard shall be read in conjunction with EN 61240:1997. Attentio
16、n is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 61837-1:2012 was approved by CEN
17、ELEC as a European Standard without any modification. BS EN 61837-1:2012- 3 - EN 61837-1:2012 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this docume
18、nt and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by
19、 (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 61240 1994 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules EN 61240 1997 BS EN 61837-1:2012 2 61837-1 IEC:2012 CONTENTS 1 Scope . 5 2
20、 Normative references . 5 3 Configuration of enclosures 5 4 Designation of types . 5 5 Plastic moulded enclosure dimensions . 6 6 Lead connections . 6 7 Plastic moulded enclosures 6 Table 1 Designation of plastic moulded enclosures 6 BS EN 61837-1:201261837-1 IEC:2012 5 SURFACE MOUNTED PIEZOELECTRIC
21、 DEVICES FOR FREQUENCY CONTROL AND SELECTION STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS Part 1: Plastic moulded enclosure outlines 1 Scope This part of IEC 61837 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in plastic mould
22、ed enclosures and is based on IEC 61240. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the
23、 referenced document (including any amendments) applies. IEC 61240: 1994, Piezoelectric devices Preparation of outline drawings of surface-mounted devices (SMD), for frequency control and selection General rules13 Configuration of enclosures These enclosures are made of plastic moulded materials wit
24、h the terminal leads based on the descriptive designation system for semiconductors, devices package. The configuration symbols are shown as follows: DCC (dual chip carrier) 4 Designation of types The designation of types is shown in four parts as follows: A: Configuration symbol of enclosures: DCC
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