BS EN 61249-7-1-1996 Materials for interconnection structures - Sectional specification set for restraining core materials - Copper invar copper《互连接装置用材料 第7部分 芯约束用材料分规范 第1节 铜 殷钢 铜》.pdf
《BS EN 61249-7-1-1996 Materials for interconnection structures - Sectional specification set for restraining core materials - Copper invar copper《互连接装置用材料 第7部分 芯约束用材料分规范 第1节 铜 殷钢 铜》.pdf》由会员分享,可在线阅读,更多相关《BS EN 61249-7-1-1996 Materials for interconnection structures - Sectional specification set for restraining core materials - Copper invar copper《互连接装置用材料 第7部分 芯约束用材料分规范 第1节 铜 殷钢 铜》.pdf(12页珍藏版)》请在麦多课文档分享上搜索。
1、BRITISH STANDARD BS EN 61249-7-1:1996 IEC 1249-7-1: 1995 Materials for interconnection structures Part 7: Sectional specification set for restraining core materials Section 1: Copper/invar/copper The European Standard EN 61249-7-1:1995 has the status of a British Standard ICS 31.180BSEN61249-7-1:199
2、6 This British Standard, having been prepared under the direction of theElectrotechnical Sector Board, was published under the authority of the Standards Board and comesinto effect on 15 August 1996 BSI 11-1999 The following BSI references relate to the work on this standard: Committee reference EPL
3、/52 Draft announced in BSI News Update May 1996 ISBN 0 580 26031 3 Committees responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/52, Printed circuits, on which the following bodies were represented: British Telecommunications plc E
4、lectrical and Electronic Industries Association (BEAMA Ltd.) Federation of the Electronics Industries GAMBICA (BEAMA Ltd.) Institute of Metal Finishing National Supervisory Inspectorate Printed Circuit Interconnection Federation Surface Mount CIC type B Copper/Invar/copper in the ratio12,5/75/12,5 b
5、y volume percentage; CIC type C Copper/Invar/copper in the ratio20/60/20 by volume percentage. The tolerance shall be 10 % of the nominal content of each component. 3.2 Constituent materials 3.2.1 Invar Nickel-iron alloy of the following composition: 3.2.2 Copper The copper shall have a minimum puri
6、ty of 99,8 % copper (with silver content regarded as copper), excluding any “as shipped” surface treatment. Element % by weight Nickel 35,5 36,5 Phosphorus 0,025 maximum Sulphur 0,025 maximum Carbon 0,12 maximum Manganese 0,50 maximum Silicon 0,25 maximum Iron balanceEN61249-7-1:1995 4 BSI 11-1999 4
7、 Electrical properties Table 1 Electrical properties 5 Non-electrical properties 5.1 Appearance The copper-clad faces shall be free from oxide, blisters, wrinkles, pin-holes, deep scratches, and pits. 5.2 Thickness The thickness of the CIC material, measured by a micrometer, shall not depart from th
8、e nominal thickness by more than the appropriate value shown below. Table 2 Thickness tolerances 5.3 Bow and twist Table 3 Bow and twist 5.4 Tensile strength and elongation Table 4 Tensile and elongation properties Property Test method CIC type Requirement M7m Resistivity As specified in IEC 468 A 0
9、,17 0,01 B 0,07 0,01 C 0,04 0,01 Nominal thickness mm Tolerance mm 0,10 to 0,30 0,010 Over 0,30 to 0,60 0,025 Over 0,60 to 1,20 0,050 Over 1,20 to 2,40 0,10 Property Test method (sub-clause of IEC249-1) Requirement For all CIC types % Bow 3.1 0,5 max. Twist 3.3 0,5 max. Property Test method CIC type
10、 Requirement Tensile strength As specified in ISO 6892 A 380 N/mm 2to 480 N/mm 2 B 380 N/mm 2to 480 N/mm 2 C 310 N/mm 2to 480 N/mm 2 Elongation (gauge length: 50mm) As specified in ISO 6892 A 25 % min. B 20 % min. C 20 % min.EN61249-7-1:1995 BSI 11-1999 5 5.5 Modulus of elasticity Table 5 Modulus of
11、 elasticity 5.6 Thermal coefficient of expansion Table 6 Thermal coefficient of expansion 5.7 Bond strength between copper and Invar The CIC material shall be capable of being bent 180 around an arbor with a diameter equal to the thickness of the material without showing separation between the layer
12、s, at room temperature. 6 Surface treatment The sheet shall be capable of being bonded to a laminate according to the suppliers recommendations. If agreed upon between purchaser and supplier, the copper surface may be given a chemical or electrochemical treatment to enhance adhesion to the required
13、substrate. If such a treatment has been applied, it shall be substantially uniform in colour and intensity over the entire area of the surface so treated, and shall be sufficiently adherent to withstand normal handling of the material during the users manufacturing processes, including the laminatio
14、n process itself, and to meet the relevant requirements of the laminate manufactured from the CIC material. 7 Packaging and marking The material shall be packed adequately to avoid damage, bow, contamination in transit and storage. Separate sheets shall be interleaved with chemically neutral, or sui
15、tably treated paper. Each package shall be labelled with the material type designation, the manufacturers name, the nominal material thickness and the batch reference number. The package label shall also show the number of sheets. Any labels on sheets shall remain securely fixed during normal handli
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