BS EN 61249-4-14-2009 Materials for printed boards and other interconnecting structures - Sectional specification set for prepreg materials unclad (for the manufacture of multilayee.pdf

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1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI British StandardsWB9423_BSI_StandardColCov_noK_AW:BSI FRONT COVERS 5/9/08 12:55 Page 1Materials for printed boards and other interconnecting structures Part 4-14: Sectional specification set for prep

2、reg materials, unclad (for the manufacture of multilayerboards) Epoxide woven E-glass prepreg of definedflammability (vertical burning test) for lead-free assemblyBS EN 61249-4-14:2009National forewordThis British Standard is the UK implementation of EN 61249-4-14:2009. It isidentical to IEC 61249-4

3、-14:2009.The UK participation in its preparation was entrusted to Technical CommitteeEPL/501, Electronic assembly technology.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions of a

4、contract. Users are responsible for its correct application. BSI 2009 ISBN 978 0 580 58810 5 ICS 31.180Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 October

5、 2009Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 61249-4-14:2009EUROPEAN STANDARD EN 61249-4-14 NORME EUROPENNE EUROPISCHE NORM June 2009 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europische

6、s Komitee fr Elektrotechnische Normung Central Secretariat: Avenue Marnix 17, B - 1000 Brussels 2009 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61249-4-14:2009 E ICS 31.180 English version Materials for printed boards and oth

7、er interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-14:2009) Matriaux pour circuits imprims

8、et autres structures dinterconnexion - Partie 4-14: Srie de spcifications intermdiaires pour matriaux primprgns, non plaqus (pour la fabrication des cartes multicouches) - Tissu de verre poxyde primprgn de type E dinflammabilit dfinie (essai de combustion verticale) destin aux assemblages sans plomb

9、 (CEI 61249-4-14:2009) Materialien fr Leiterplatten und andere Verbindungsstrukturen - Teil 4-14: Rahmenspezifikationen fr unkaschierte Prepreg-Materialien (zur Herstellung von Mehrlagenleiterplatten) - Mit E-Glasgewebe verstrkte Epoxidharz-Prepregs mit definierter Brennbarkeit (Brennprfung mit vert

10、ikaler Prflingslage) fr bleifreie Bestckungstechnik (IEC 61249-4-14:2009) This European Standard was approved by CENELEC on 2009-06-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a natio

11、nal standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in

12、 any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Cze

13、ch Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. BS EN 61249-4-14:2009EN 61249-4-14:2009

14、- 2 - Foreword The text of document 91/850/FDIS, future edition 1 of IEC 61249-4-14, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61249-4-14 on 2009-06-01. The following dates were fixed: latest date by which

15、 the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2010-03-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2012-06-01 Annex ZA has been added by CENELEC. _ Endorsement notice The t

16、ext of the International Standard IEC 61249-4-14:2009 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60194 NOTE Harmonized as EN 60194:2006 (not modified). IEC 6

17、1249-2-7 NOTE Harmonized as EN 61249-2-7:2002 (not modified). IEC 61249-2-8 NOTE Harmonized as EN 61249-2-8:2003 (not modified). ISO 9000 NOTE Harmonized as EN ISO 9000:2005 (not modified). _ BS EN 61249-4-14:2009- 3 - EN 61249-4-14:2009 Annex ZA (normative) Normative references to international pub

18、lications with their corresponding European publications The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) a

19、pplies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 61189-2 2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Par

20、t 2: Test methods for materials for interconnection structures EN 61189-2 2006 IEC 61249-2-36 -1)Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning

21、 test), copper-clad for lead-free assembly EN 61249-2-36 20092)IEC 62326-4 -1)Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specificationEN 62326-4 19972)ISO 11014-1 1994 Safety data sheet for chemical products - Part 1: Content and order of section

22、s - - 1)Undated reference. 2)Valid edition at date of issue. BS EN 61249-4-14:2009 2 61249-4-14 IEC:2009(E) CONTENTS FOREWORD.4 1 Scope.6 2 Normative references .6 3 Materials and construction6 3.1 Reinforcement.6 3.2 Resin system.7 4 Properties.7 4.1 Properties related to the appearance of the prep

23、reg7 4.1.1 Dewetted areas (fish eyes) 7 4.1.2 Broken filaments7 4.1.3 Distortion.7 4.1.4 Creases.7 4.1.5 Edge conditions.7 4.2 Properties related to B-stage prepreg7 4.2.1 Resin content 8 4.2.2 Treated weight.8 4.2.3 Resin flow .8 4.2.4 Scaled flow thickness 8 4.2.5 Melting viscosity 8 4.2.6 Gel tim

24、e.9 4.2.7 Volatile content9 4.3 Properties related to prepreg after curing 9 4.3.1 Electric strength 9 4.3.2 Flammability9 4.3.3 Relative permittivity and dissipation factor .10 4.3.4 Cured thickness.10 4.3.5 Glass transition temperature (Tg) 10 4.3.6 Decomposition temperature (Td)10 4.3.7 Thermal r

25、esistance 11 4.3.8 Z-axis expansion .11 5 Delivery form 11 5.1 Rolls11 5.2 Sheets.11 5.3 Cut panels.11 6 Quality assurance.12 6.1 Quality system.12 6.2 Responsibility for inspection12 6.3 Qualification inspection .12 6.4 Quality conformance inspection.12 6.5 Certificate of conformance.12 6.6 Safety

26、data sheet 12 7 Packaging and marking 12 8 Shelf life.13 9 Ordering information.13 Bibliography14 BS EN 61249-4-14:200961249-4-14 IEC:2009(E) 3 Table 1 Flammability, vertical burning test .10 Table 2 Decomposition temperature requirements .10 Table 3 Thermal resistance requirements 11 Table 4 Z-axis

27、 expansion requirements11 BS EN 61249-4-14:2009 4 61249-4-14 IEC:2009(E) INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxi

28、de woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of

29、 IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (P

30、AS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising wi

31、th the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as n

32、early as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in t

33、hat sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committ

34、ees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking pro

35、cedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or ag

36、ents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of

37、, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some

38、 of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61249-4-14 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this stan

39、dard is based on the following documents: FDIS Report on voting 91/850/FDIS 91/862/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part

40、 2. BS EN 61249-4-14:200961249-4-14 IEC:2009(E) 5 A list of all parts of the IEC 61249 series, under the general title Materials for printed boards and other interconnecting structures, can be found on the IEC website. The committee has decided that the contents of this publication will remain uncha

41、nged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be

42、issued at a later date. BS EN 61249-4-14:2009 6 61249-4-14 IEC:2009(E) MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass prepreg of defined flammabili

43、ty (vertical burning test) for lead-free assembly 1 Scope This part of IEC 61249 gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-36 when manufacturing multilayer boards according to IEC 62326-4.

44、Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achi

45、eved through the use of brominated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the suppliers instructions, the glass transition temperature is defined to be 120 C minimum. 2 Normative references The following referenced documents

46、 are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 61189-2:2006, Test methods for electrical materials, printed boards and other i

47、nterconnection structures and assemblies Part 2: Test methods for materials for interconnection structures IEC 61249-2-36, Materials for printed boards and other interconnecting structures Part 2-36: Reinforced base materials, clad and unclad Epoxide woven E-glass laminated sheets of defined flammab

48、ility (vertical burning test), copper-clad for lead-free assembly IEC 62326-4, Printed boards Part 4: Rigid multilayer printed boards with interlayer connections Sectional specification ISO 11014-1:1994, Safety data sheet for chemical products Part 1: Content and order of sections 3 Materials and co

49、nstruction The prepreg consists of a reinforcing E-glass fabric which is impregnated with di-functional and multi-functional epoxide resin then partially cured to the B-stage. 3.1 Reinforcement Woven E-glass as specified in future IEC 61249-6-3 (under consideration), Woven E-glass fabric (for the manufacture of prepreg and copper-clad laminate). BS EN 61249-4-14:200961249-4-14 IEC:2009(E) 7 3.2 Resin system Majority di-function