BS EN 60747-16-10-2004 Semiconductor devices - Technology Approval Schedule (TAS) for monolithic microwave integrated circuits《半导体器件 单片微波集成电路的技术验收程序(TAS)》.pdf

《BS EN 60747-16-10-2004 Semiconductor devices - Technology Approval Schedule (TAS) for monolithic microwave integrated circuits《半导体器件 单片微波集成电路的技术验收程序(TAS)》.pdf》由会员分享，可在线阅读，更多相关《BS EN 60747-16-10-2004 Semiconductor devices - Technology Approval Schedule (TAS) for monolithic microwave integrated circuits《半导体器件 单片微波集成电路的技术验收程序(TAS)》.pdf（58页珍藏版）》请在麦多课文档分享上搜索。

1、BRITISH STANDARD BS EN 60747-16-10: 2004 Semiconductor devices Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits The European Standard EN 60747-16-10:2004 has the status of a British Standard ICS 31.200 BS EN 60747-16-10:2004 This British Standard was publis

2、hed under the authority of the Standards Policy and Strategy Committee on 9 November 2004 BSI 9 November 2004 ISBN 0 580 44731 6 National foreword This British Standard is the official English language version of EN 60747-16-10:2004. It is identical with IEC 60747-16-10:2004. The UK participation in

3、 its preparation was entrusted to Technical Committee EPL/47, Semiconductors, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publicati

4、ons referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online. This publication does not purport to include all the necessa

5、ry provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpr

6、etation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 54, an inside back cover and a bac

7、k cover. The BSI copyright notice displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. Date CommentsEUROPEAN STANDARD EN 60747-16-10 NORME EUROPENNE EUROPISCHE NORM September 2004 CENELEC European Committee for Electrotechnical Standard

8、ization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2004 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60747-16-10:2

9、004 E ICS 31.200 English version Semiconductor devices Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits (IEC 60747-16-10:2004) Dispositifs semiconducteurs Partie 16-10: Format-cadre pour agrment de technologie (TAS) pour circuits intgrs monolithiques hyperf

10、rquences (CEI 60747-16-10:2004) Halbleiterbauelemente Teil 16-10: Prfplan fr die Technikanerkennung (Technology Approval Schedule - TAS) fr monolithische integrierte Mikrowellenschaltkreise (IEC 60747-16-10:2004) This European Standard was approved by CENELEC on 2004-09-01. CENELEC members are bound

11、 to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Cen

12、tral Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same s

13、tatus as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal,

14、 Slovakia, Slovenia, Spain, Sweden, Switzerland and United Kingdom. Foreword The text of document 47E/257/FDIS, future edition 1 of IEC 60747-16-10, prepared by SC 47E, Discrete semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approve

15、d by CENELEC as EN 60747-16-10 on 2004-09-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2005-06-01 latest date by which the national standards conflicting with the EN ha

16、ve to be withdrawn (dow) 2007-09-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60747-16-10:2004 was approved by CENELEC as a European Standard without any modification. _ Page2 EN607471610:2004CONTENTS INTRODUCTION.5 1 General 6 1.1 Scope6 1.2

17、 Normative documents6 1.3 Units, symbols and terminology.7 1.4 Standard and preferred values 7 1.5 Definitions.7 2 Definition of the component technology 9 2.1 Scope9 2.2 Description of activities and flow charts.10 2.3 Technical abstract .10 2.4 Requirements for control of subcontractors .13 3 Comp

18、onent design of MMICs15 3.1 Scope15 3.2 Description of activities and flow charts.15 3.3 Interfaces 16 3.4 Validations and control of the processes .18 4 Mask manufacture 20 4.1 Scope20 4.2 Description of activities and flow charts.20 4.3 Validation and control of the processes .20 4.4 Subcontractor

19、s, vendors and internal suppliers .20 5 Wafer fabrication of MMICs 20 5.1 Scope20 5.2 Description of activities and flow charts.21 5.3 Equipment.23 5.4 Materials .23 5.5 Re-work 23 5.6 Validation methods and control of the processes.24 5.7 Interrelationship 25 6 Wafer probing of MMICs.27 6.1 Scope27

20、 6.2 Description of activities and flow charts.27 6.3 Equipment.27 6.4 Test procedures 27 6.5 Interrelationship 27 7 Back-side process for bare chip delivery 29 7.1 Scope29 7.2 Description of activity and flow charts29 7.3 Equipment.30 7.4 Materials .30 7.5 Validation methods and control of the proc

21、esses.30 7.6 Interrelationship 30 7.7 Validity of release31 8 Assembly of MMICs33 Page3 EN607471610:20048.1 Scope33 8.2 Description of activities and flow charts.33 8.3 Materials, inspection and handling.34 8.4 Equipment.34 8.5 Re-work 34 8.6 Validation and control of the processes .34 8.7 Interrela

22、tionships.35 9 Testing of MMICs .37 9.1 Scope37 9.2 Description of activities and flow charts.37 9.3 Equipment.37 9.4 Test procedures 38 9.5 Interfaces 39 9.6 Validation and control of the processes .40 9.7 Process boundary verification43 9.8 Product verification47 10 Process characterization 47 10.

23、1 Identification of process characteristics .47 10.2 Description of activities .48 10.3 Characterization procedures49 11 Packaging and shipping50 11.1 Description of activities and flow charts.50 11.2 Interfaces 51 11.3 Validity of release51 12 Withdrawal of Technology Approval53 Figure 1 Example fl

24、ow chart of design/manufacture/test.14 Figure 2 Example flow chart of a design.19 Figure 3 Technology flow chart of the process .26 Figure 4 Example flow chart for a wafer probing. .28 Figure 5 Example flow chart for a back-side process for bare chip delivery32 Figure 6 Example flow chart for an ass

25、embly .36 Figure 7 Example flow char for a testing 42 Figure 8 Typical flow chart for packaging and shipping 52 Page4 EN607471610:2004INTRODUCTION The requirements for Technology Approval for manufacturers of electronic and electro- mechanical components are given in QC 001002-3, Clause 6. The proce

26、dures for approval defined in that clause require the manufacturer to have available an appropriate Technology Approval Schedule (TAS). This schedule defines how the principles and requirements of QC 001002-3, Clause 6 are applied to monolithic microwave integrated circuits. Page5 EN607471610:2004SE

27、MICONDUCTOR DEVICES Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits 1 General 1.1 Scope This TAS specifies the terms, definitions, symbols, quality system, test, assessment and verification methods and other requirements relevant to the design, manufacture

28、 and supply of monolithic microwave integrated circuits in compliance with the general requirements of the IECQ-CECC System for electronic components of assessed quality. 1.2 Normative documents The following referenced documents are indispensable for the application of this document. For dated refe

29、rences, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60027 (all parts): Letter symbols to be used in electrical technology IEC 60050: International Electrotechnical Vocabulary IEC 60068 (all parts): Envi

30、ronmental testing IEC 60191-2: Mechanical standardisation of semiconductor devices Part 2: Dimensions IEC 60617-DB 1(all parts): Graphical symbols for diagrams IEC 60747-1: Semiconductor devices Discrete devices and integrated circuits Part 1: General IEC 60747-16-1: Semiconductor devices Part 16-1:

31、 Microwave integrated circuits Amplifiers IEC 60747-16-2: Semiconductor devices Part 16-2: Microwave integrated circuits Frequency prescalers IEC 60747-16-3: Semiconductor devices Part 16-3: Microwave integrated circuits Frequency converters IEC 60747-16-4: Semiconductor devices Part 16-4: Microwave

32、 integrated circuits Switches 2IEC 60748-1: Semiconductor devices Integrated circuits Part 1: General ISO 1000: SI units and recommendations for the use of their multiples and certain other units 1“DB” refers to the IEC on-line database. 2 To be published. Page6 EN607471610:20041.3 Units, symbols an

33、d terminology Units, graphical symbols, letter symbols and terminology shall, whenever possible, be taken from the following documents: IEC 60027: Letter symbols to be used in electrical technology IEC 60050: International electrotechnical vocabulary IEC 60617-DB: Graphical symbols for diagrams ISO

34、1000: SI units and recommendations for the use of their multiples and certain other units Any other units, symbols and terminology specific to the scope of this TAS shall be taken from the relevant IEC or ISO documents listed under Normative documents. 1.4 Standard and preferred values Technology Ap

35、proval allows the customization of the component or process to suit each customer. The conventional concept of preferred values may thus have limited application. However, when internationally recognized preferred values apply these should be used, e.g. voltage, temperature and dimensions. Reference

36、 shall be made to the appropriate IEC or ISO publications, i.e.: voltage IEC 60747-1 temperature IEC 60747-1 dimensions IEC 60191-2. 1.5 Definitions For the purposes of this document, the following definitions apply. 1.5.1 General terms for monolithic microwave integrated circuits 1.5.1.1 microelect

37、ronics (IEC 60748-1, definition 4.1.5) 1.5.1.2 microcircuit (IEC 60748-1, definition 4.2.2) 1.5.1.3 integrated circuit (IEC 60748-1, definition 4.2.3) 1.5.1.4 integrated microcircuit microcircuit in which a number of circuit elements are inseparably associated and electrically interconnected such th

38、at for the purpose of specification and testing and commerce and maintenance, it is considered indivisible NOTE 1 For this definition, a circuit element does not have an envelope or external connection and is not specified or sold as a separate item. NOTE 2 Where no misunderstanding is possible, the

39、 term “integrated microcircuit“ may be abbreviated to “integrated circuit“. NOTE 3 Further qualifying terms may be used to describe the technique used in the manufacture of a specific integrated microcircuit. Examples to the use of qualifying terms: semiconductor monolithic integrated circuit; semic

40、onductor multi-chip integrated circuit; thin film integrated circuit; thick film integrated circuit; hybrid integrated circuit. Page7 EN607471610:20041.5.1.5 micro-assembly microcircuit consisting of various components and/or integrated microcircuits which are constructed separately and which can be

41、 tested before being assembled and packaged NOTE 1 For this definition, a component has external connections and possibly an envelope as well and it also can be specified and sold as a separate item. NOTE 2 Further qualifying terms may be used to describe the form of the components and/or the assemb

42、ly techniques used in the construction of a specific micro-assembly. Examples of use of qualifying terms: semiconductor multi-chip micro-assembly; discrete component micro-assembly. 1.5.2 List of abbreviations ASIC: Application Specific Integrated Circuit BDS: Blank Detail Specification BICMOS: Bipo

43、lar and Complementary Metal Oxide Silicon CAD: Computer Aided Design CAE: Computer Aided Engineering CECC: CENELEC Electronic Components Committee CMB: Contract Management Branch Cpk: Index of critical process capability Die Shear: Test on die attach DIL: Dual In Line Package DRC: Design Rules Check

44、 Dye Penetrant (ZYGLO): Seal test EDP: Electronic Data Processing EFR: Electrical Failure Rate ERC: Electrical Rules Check ESD: Electro Static Discharge GaAs: Gallium Arsenide HBT: Hetero-junction Bipolar Transistor HEMT: High Electron Mobility Transistor ISO 9000: ISO International Quality Rules JF

45、ET: Junction Field Effect Transistor LRM: Line Reflect Match LSSD: Level Sensitive Scan Design LVS: Layout Versus Schematics MESFET: Metal Semiconductor Field Effect Transistor MMIC: Monolithic Microwave Integrated Circuits MODFET: Modulation Doped Field Effect Transistor MTF: Mean Time to Failure M

46、TBF: Mean Time Between Failures MTTR: Mean Time To Repair NMOS: Metal Oxide Silicon N channel Page8 EN607471610:2004 OS: Operating System PAS: Publicly Available Specification PCM: Process Control Monitor PDA: Percentage Defectives Allowed PM: Parametric Monitor PMOS: Metal Oxide Silicon P channel P

47、OST CAP: Inspection after Encapsulation PRE CAP: Inspection before Encapsulation QA: Quality Assurance QCI: Quality Conformance Inspection QML: Qualified Manufacturer List RIE: Reactive Ion Etching SEC: Standard Evaluation Circuit SEM: Scanning Electron Microscope SI: Supervising Inspectorate SOI: S

48、ilicon on Insulator SOLT: Short Open Load Thru SOS: Silicon on Sapphire SPC: Statistical Process Control Si: Silicon TADD: Technology Approval Declaration Document TCI: Technology Conformance Inspection TCV: Technology Characterization Vehicle TDDB: Time Dependent Dielectric Breakdown TQM: Total Quality Management TRB: Technology Review Board TRL: Thru Reflect Line VT: Threshold Voltage for FET ZYGLO: see Dye Penetrant. NOTE PCM and PM have the same meaning; however, PCM is the term used in the following subclauses. 1.5.3 Definitions relevant to the scope of the TAS Se