BS EN 60512-27-100-2012 Connectors for electronic equipment Tests and measurements Signal integrity tests up to 500 MHz on IEC 60603-7 series connectors《电子设备连接器 测验和测量 小于等于500 MHz的I.pdf

《BS EN 60512-27-100-2012 Connectors for electronic equipment Tests and measurements Signal integrity tests up to 500 MHz on IEC 60603-7 series connectors《电子设备连接器 测验和测量 小于等于500 MHz的I.pdf》由会员分享，可在线阅读，更多相关《BS EN 60512-27-100-2012 Connectors for electronic equipment Tests and measurements Signal integrity tests up to 500 MHz on IEC 60603-7 series connectors《电子设备连接器 测验和测量 小于等于500 MHz的I.pdf（70页珍藏版）》请在麦多课文档分享上搜索。

1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationConnectors for electronic equipment Tests and measurementsPart 27-100: Signal integrity tests up to 500 MHz on IEC 60603-7 series connectors Tests 27a to 27gBS EN 60512-27-100:20

2、12National forewordThis British Standard is the UK implementation of EN 60512-27-100:2012. It is identical to IEC 60512-27-100:2011.The UK participation in its preparation was entrusted to Technical Committee EPL/48, Electromechanical components and mechanical structures for electronic equipment.A l

3、ist of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2012Published by BSI Standards

4、Limited 2012 ISBN 978 0 580 57942 4 ICS 31.220.10Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 March 2012.Amendments issued since publicationAmd. No. Date T

5、ext affectedBRITISH STANDARDBS EN 60512-27-100:2012EUROPEAN STANDARD EN 60512-27-100 NORME EUROPENNE EUROPISCHE NORM February 2012 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Manageme

6、nt Centre: Avenue Marnix 17, B - 1000 Brussels 2012 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60512-27-100:2012 E ICS 31.220.10 English version Connectors for electronic equipment - Tests and measurements - Part 27-100: Sign

7、al integrity tests up to 500 MHz on IEC 60603-7 series connectors - Tests 27a to 27g (IEC 60512-27-100:2011) Connecteurs pour quipements lectroniques - Essais et mesures - Partie 27-100: Essais dintgrit des signaux jusqu 500 MHz sur les connecteurs de la srie CEI 60603-7 - Essais 27a 27g (CEI 60512-

8、27-100:2011) Steckverbinder fr elektronische Einrichtungen - Mess- und Prfverfahren - Teil 27-100: Signalintegrittsprfungen bis 500 MHz an Steckverbindern der Reihe IEC 60603-7 - Prfungen 27a bis 27g (IEC 60512-27-100:2011) This European Standard was approved by CENELEC on 2012-01-11. CENELEC member

9、s are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application

10、 to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC M

11、anagement Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Lux

12、embourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. BS EN 60512-27-100:2012EN 60512-27-100:2012 Foreword The text of document 48B/2262/FDIS, future edition 1 of IEC 60512-27-100, prepared by SC 48B, “Conne

13、ctors“, of IEC TC 48, “Electromechanical components and mechanical structures for electronic equipment“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60512-27-100:2012. The following dates are fixed: latest date by which the document has to be implemented at national l

14、evel by publication of an identical national standard or by endorsement (dop) 2012-10-11 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2015-01-11 Attention is drawn to the possibility that some of the elements of this document may be the subject

15、 of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60512-27-100:2011 was approved by CENELEC as a European Standard without any modification. In the official version, for Bib

16、liography, the following notes have to be added for the standards indicated: IEC 60603-7-4 NOTE Harmonized as EN 60603-7-4. IEC 60603-7-5 NOTE Harmonized as EN 60603-7-5. BS EN 60512-27-100:2012EN 60512-27-100:2012 Annex ZA (normative) Normative references to international publications with their co

17、rresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (includin

18、g any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60050-581 - International Electrotechnical Vocabulary - Part 581: Electromechanical components for electr

19、onic equipment - - IEC 60512-1 - Connectors for electronic equipment - Tests and measurements - Part 1: General EN 60512-1 - IEC 60512-1-100 - Connectors for electronic equipment - Tests and measurements - Part 1-100: General - Applicable publications EN 60512-1-100 - IEC 60512-26-100 - Connectors f

20、or electronic equipment - Tests and measurements - Part 26-100: Measurement setup, test and reference arrangements and measurements for connectors according to IEC 60603-7 - Tests 26a to 26g EN 60512-26-100 - IEC 60603-7 Series Connectors for electronic equipment EN 60603-7 Series IEC 60603-7 2008 C

21、onnectors for electronic equipment - Part 7: Detail specification for 8-way, unshielded, free and fixed connectors EN 60603-7 2009 IEC 61076-1 - Connectors for electronic equipment - Product requirements - Part 1: Generic specification EN 61076-1 - IEC 61156 Series Multicore and symmetrical pair/qua

22、d cables for digital communications - Part 1: Generic specification - - IEC 61169-16 - Radio-frequency connectors - Part 16: Sectional specification - RF coaxial connectors with inner diameter of outer conductor 7 mm (0,276 in) with screw coupling - Characteristics impedance 50 ohms (75 ohms) (type

23、N) EN 61169-16 - IEC 62153-4-12 - Metallic communication cable test methods - Part 4-12: Electromagnetic compatibility (EMC) - Coupling attenuation or screening attenuation of connecting hardware - Absorbing clamp method - - BS EN 60512-27-100:201260512-27-100 IEC:2011 CONTENTS 1 Scope and object .

24、8 2 Normative references . 8 3 Terms, definitions, acronyms and symbols . 9 Terms and definitions . 9 3.1Test Free Connector (TFC) . 9 3.1.1 Acronyms . 9 3.2Symbols . 10 3.34 Overall test arrangement . 10 Test instrumentation . 10 4.1Coaxial cables and interconnect for network analysers . . 11 4.2Me

25、asurement precautions . 11 4.3Balun requirements . . 11 4.4Interfacing 12 4.5Reference components for calibration . 13 4.6Reference loads for calibration 13 4.6.1Reference cables for calibration . 14 4.6.2 Termination loads for termination of conductor pairs 14 4.7General . 14 4.7.1Resistor terminat

26、ions . . 14 4.7.2Balun terminations . 15 4.7.3Termination types 15 4.7.4 Termination of screens . 15 4.8Test specimen and reference planes . 15 4.9General . 15 4.9.1Interconnections between device under test (DUT) and the 4.9.2calibration plane . . 16 5 Connector measurement up to 500 MHz . 17 Gener

27、al . . 17 5.1Insertion loss, Test 27a . 17 5.2Object . 17 5.2.1Free connector for insertion loss. 17 5.2.2Test method . 17 5.2.3Test set-up . 17 5.2.4Procedure 18 5.2.5Test report . 18 5.2.6Accuracy . 19 5.2.7 Return loss, Test 27b . 19 5.3Object . 19 5.3.1Free connector for return loss 19 5.3.2Test

28、 method . 19 5.3.3Test set-up . 19 5.3.4Procedure 19 5.3.5Test report . 19 5.3.6Accuracy . 19 5.3.7 Near-end crosstalk (NEXT), Test 27c 20 5.4BS EN 60512-27-100:201260512-27-100 IEC:2011 Object . 20 5.4.1Free connector for NEXT 20 5.4.2Test method . 20 5.4.3Test set-up . 20 5.4.4Procedure 21 5.4.5Te

29、st report . 24 5.4.6Accuracy . 24 5.4.7 Far-end crosstalk (FEXT), Test 27d . 24 5.5Object . 24 5.5.1Free connector for FEXT 24 5.5.2Test method . 24 5.5.3Test set-up . 24 5.5.4Procedure 25 5.5.5Test report . 25 5.5.6Accuracy . 26 5.5.7 Transfer impedance (Zt) . . 26 5.6Transverse conversion loss (TC

30、L), Test 27f . 26 5.7Object . 26 5.7.1Free connector for TCL . 26 5.7.2Test method . 26 5.7.3Test set-up . 26 5.7.4Procedure 27 5.7.5Test report . 30 5.7.6Accuracy . 30 5.7.7 Transverse conversion transfer loss (TCTL), Test 27g 30 5.8Object . 30 5.8.1Free connector for TCTL 30 5.8.2Test method . 30

31、5.8.3Test set-up . 30 5.8.4Procedure 31 5.8.5Test report . 32 5.8.6Accuracy . 32 5.8.7 Coupling attenuation 32 5.96 Construction and qualification of TFCs for NEXT, FEXT and return loss measurements . 32 General . . 32 6.1Introductory remarks 32 6.1.1Delay measurements . . 33 6.1.2 TFC near-end cros

32、stalk (NEXT) 36 6.2General . 36 6.2.1Procedure for mating a TFC to the direct fixture . . 36 6.2.2TFC NEXT loss measurement 37 6.2.3TFC NEXT loss requirements 38 6.2.4 TFC far-end crosstalk (FEXT) . 39 6.3TFC FEXT loss measurement 39 6.3.1TFC FEXT loss requirements . 39 6.3.2 TFC return loss . 40 6.

33、4General . 40 6.4.1TFC return loss reverse direction qualification procedure . . 40 6.4.2BS EN 60512-27-100:201260512-27-100 IEC:2011 Test plug return loss forward direction qualification procedure . 40 6.4.3TFC return loss requirements 46 6.4.4Test fixtures for TFC testing 47 6.5Requirements for TF

34、C direct fixtures . 47 6.5.1Annex A (informative) Impedance controlled measurement fixture . 49 Annex B (normative) Termination of balun 63 Bibliography . 65 Figure 1 180 hybrid used as a balun . . 11 Figure 2 Measurement configurations for test balun qualification . 13 Figure 3 Calibration of refer

35、ence loads . 14 Figure 4 Resistor termination networks . 14 Figure 5 Definition of reference planes. . 16 Figure 6 Measuring set-up . 18 Figure 7 Example for NEXT measurements . . 21 Figure 8 Example for FEXT measurements for DM and CM terminations . 25 Figure 9 Example of TCL measurement 27 Figure

36、10 Coaxial lead attenuation calibration. . 28 Figure 11 Back-to-back balun insertion loss measurement . . 28 Figure 12 Configuration for balun CM insertion loss calibration . . 29 Figure 13 Schematic for balun CM insertion loss calibration . . 29 Figure 14 Example of TCTL measurement . 31 Figure 15

37、Calibration and interface planes and port extensions . . 33 Figure 16 Examples of direct fixture short, open, load, and through artefacts . 35 Figure 17 Modular free connector placed into the free connector clamp 36 Figure 18 Guiding the free connector into position 37 Figure 19 TFC direct fixture .

38、 . 37 Figure 20 illustration of TFC NEXT measurement in the forward direction . . 38 Figure 21 Example of suitable return loss de-embedding reference socket. 42 Figure 22 Flow chart for determination of reference fixed connector S-parameters 43 Figure 23 Representation of a mated connection by two c

39、ascaded networks 43 Figure 24 Return loss de-embedding reference plug terminated with LOAD resistors . . 44 Figure 25 Return loss test plug calibration and interface planes . 44 Figure 26 Flow chart of determination of return loss test plug properties . 46 Figure 27 Direct fixture mating dimensions

40、A . 47 Figure 28 Direct fixture mating dimensions B . 48 Figure 29 Direct fixture mating dimension C . 48 Figure A.1 Test head assembly with baluns attached . 49 Figure A.2 Test balun interface pattern . 50 Figure A.4 Test head assembly showing shielding between baluns 51 Figure A.5 Balun test 2 fix

41、ture assembly . 52 Figure A.6 Free connector direct fixture, DPMF-2 view 1 53 Figure A.7 Free connector direct fixture, DPMF-2 view 2 53 Figure A.8 Exploded assembly of the direct fixture 54 BS EN 60512-27-100:201260512-27-100 IEC:2011 Figure A.9 PCB based free connector . 55 Figure A.10 TP6A PCB ba

42、sed free connector assembly with adapter . . 55 Figure A.11 An example of a connecting hardware measurement configuration. 56 Figure A.12 Test fixture interface . 57 Figure A.13 Open calibration standard applied to test interface . . 57 Figure A.14 Short calibration standard applied to test interfac

43、e . . 58 Figure A.15 Load calibration standard applied to test interface . . 58 Figure A.16 Back-to-back through standard applied to test interface . 59 Figure A.17 TFC attached to the test interface . 59 Figure A.18 Direct fixture mounted to the test head interface 60 Figure A.19 Calibration plane

44、60 Figure A.20 Through calibration . 61 Figure A.21 Test setup for twisted-pair return 2 loss measurement 61 Figure A.22 Method to minimize distance between planes. 62 Figure B.1 Balanced attenuator for balun centre tap grounded 63 Figure B.2 Balanced attenuator for balun centre tap open . 64 Table

45、1 Test balun performance characteristics . . 12 Table 2 Interconnection return loss 17 Table 3 Uncertainty band of return loss measurement at frequencies below 100 MHz . . 20 Table 4 Uncertainty band of return loss measurement at frequencies above 100 MHz. . 20 Table 5a Free connector TFC NEXT loss

46、limit vectors for connectors specified up to 100 MHz . . 23 Table 5b Free connector TFC NEXT loss limit vectors for connectors specified from 1-250 MHz and from 1 MHz to 500 MHz . 23 Table 6 connecting hardware NEXT loss for Case 1 and Case 4 . . 24 Table 7 TFC NEXT loss ranges . 39 Table 8 TFC FEXT

47、 loss ranges . 40 Table 9 De-embedding return loss reference fixed connector assembly standard vectors 42 Table 10 Return loss requirements for TFCs 47 Table 11 Direct fixture performance . 48 BS EN 60512-27-100:2012 8 60512-27-100 IEC:2011 CONNECTORS FOR ELECTRONIC EQUIPMENT TESTS AND MEASUREMENTS

48、Part 27-100: Signal integrity tests up to 500 MHz on 60603-7 series connectors Tests 27a to 27g 1 Scope and object This part of IEC 60512 specifies the test methods for transmission performance for IEC 60603-7 series connectors up to 500 MHz. It is also suitable for testing lower frequency connector

49、s if they meet the requirements of the detail specifications and of this standard. The test methods provided here are: insertion loss, test 27a; return loss, test 27b; near-end crosstalk (NEXT) test 27c; far-end crosstalk (FEXT), test 27d; transverse conversion loss (TCL), test 27f; transverse conversion transfer loss (TCTL), test 27g; For the transfer impedance (Zt) test, see IEC