BS EN 60512-12-6-1997 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Soldering tests - Test 12f - Sealing against flux and.pdf

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1、BRITISH STANDARD BS EN 60512-12-6: 1997 IEC512-12-6: 1996 Electromechanical components for electronic equipment Basic testing procedures and measuring methods Part 12: Soldering tests Section 6: Test 12f: Sealing against flux and cleaning solvents in machine soldering The European Standard EN60512-1

2、2-6:1996 has the status of a BritishStandard ICS 31.220.01BS EN60512-12-6:1997 This British Standard, having been prepared under the directionof the Electrotechnical Sector Board, was published underthe authority of the Standards Board and comes intoeffect on 15 April1997 BSI 07-1999 The following B

3、SI references relate to the work on this standard: Committee reference EPL/48/2 Announced in BSI Update February 1997 ISBN 0 580 27314 8 Committees responsible for this British Standard The preparation of this British Standard was entrusted by Technical Committee EPL/48, Electromechanical components

4、 for electronic equipment, to Subcommittee EPL/48/2, Connectors for electronic equipment, upon which the following bodies were represented: Association of Manufacturers Allied to the Electrical and Electronic Industry (BEAMA Ltd.) British Telecommunications plc BSI Quality Assurance Federation of th

5、e Electronics Industry Ministry of Defence Premises Cabling Association Amendments issued since publication Amd. No. Date CommentsBS EN60512-12-6:1997 BSI 07-1999 i Contents Page Committees responsible Inside front cover National foreword ii Foreword 2 Text of EN60512-12-6 3 List of references Insid

6、e back coverBSEN60512-12-6:1997 ii BSI 07-1999 National foreword This Section of BS EN60512 has been prepared by Subcommittee EPL/48/2, and is the English language version of EN60512-12-6:1996 Electromechanical components for electronic equipment Basic testing procedures and measuring methods Part12

7、: Soldering tests Section6: Test12f: Sealing against flux and cleaning solvents in machine soldering, published by the European Committee for Electrotechnical Standardization (CENELEC). It is identical with IEC512-12-6:1996, published by the International Electrotechnical Commission (IEC). A British

8、 Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Cross-references Publication referred to Correspon

9、ding British Standard EN60068-1:1994 BS EN60068 Environmental testing (IEC68-1:1988) Part1:1995 General and guidance HD323.2.20 S3:1988 (IEC68-2-20:1979) BS2011 Environmental testing Part2.1T:1981 Test T. Soldering Summary of pages This document comprises a front cover, an inside front cover, pages

10、i and ii, theEN title page, pages2 to6, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover.EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN605

11、12-12-6 March1996 ICS 31.220.00 Descriptors: Testing procedures, soldering tests, test12f, sealing against flux English version Electromechanical components for electronic equipment Basic testing procedures and measuring methods Part12:Soldering tests Section6: Test12f: Sealing against flux and clea

12、ning solvents in machine soldering (IEC512-12-6:1996) Composants lectromcaniques pour quipements lectroniques Procdures dessai de base et mthodes de mesure Partie12: Essais de soudure Section6: Essai12f: Etanchit aux flux et solvants de nettoyage dans une machine souder (CEI512-12-6:1996) Elektrisch

13、-mechanische Bauelemente fr elektronische Einrichtungen Me- und Prfverfahren Teil12: Prfungen der Ltbarkeit Hauptabschnitt6: Prfung12f: Dichtheit gegen Flu- und Reinigungsmittel bei maschinellem Lten (IEC512-12-6:1996) This European Standard was approved by CENELEC on 1996-03-05. CENELEC members are

14、 bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to t

15、he Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the

16、same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Commi

17、ttee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1996 Copyright reserved to CENELEC members Ref. No. EN60512-12-6:1996 EEN60512-12-6:1996 BSI 07-1999 2 F

18、oreword The text of document48B/420/FDIS, as prepared by SC48B, Connectors, of IEC TC48, Electromechanical components and mechanical structures for electronic equipment, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN60512-12-6 on1996-03-05. The following dates were

19、fixed: Annexes designated “normative” are part of the body of the standard. In this standard, Annex ZA is normative. Annex ZA has been added by CENELEC. Contents Page Foreword 2 1 Scope and object 3 2 Normative references 3 3 Preparation of the specimen 3 4 Test equipment 3 5 Test procedure 3 5.1 Im

20、mersion of the specimen 3 5.2 Soldering 3 5.3 Cleaning solvents 3 5.4 Printed board test specimen 5 6 Preparation for testing 5 7 Requirements 5 7.1 Initial measurements 5 7.2 Conditioning 5 7.3 Recovery 5 7.4 Final measurements 5 7.5 Visual examination 5 8 Details to be specified 5 Annex ZA (normat

21、ive) Normative references to international publications with their corresponding European publications 6 Table 1 3 Table 2 4 Table 3 4 Table 4 5 latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 1996-12-01 lat

22、est date by which the national standards conflicting with the EN have to be withdrawn (dow) 1996-12-01EN60512-12-6:1996 BSI 07-1999 3 1 Scope and object This section of IEC512-12, when required by the detail specification, is to be used for testing electromechanical components within the scope of te

23、chnical committee48 1) . This test may also be used for similar components when specified in a detail specification. The object of this test is to detail a standard test method to verify the effectiveness of the sealing of a component against flux and cleaning solvents during the machine soldering p

24、rocess. The results of this test may not be represent active for other fluxes; e.g.resin-reduced foam flux, other fluxing and cleaning methods as prescribed herein. 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provision

25、s of this section of IEC512-12. At the time of publication, the editions indicated were valid. All normative documents are subject to revision, and parties to agreements based on this section of IEC512-12 are encouraged to investigate the possibility of applying the most recent editions of the norma

26、tive documents indicated below. Members of IEC and ISO maintain registers of currently valid International Standards. IEC68-1:1988, Environmental testing Part1: General and guidance. IEC68-2-20:1979, Environmental testing Part2:Tests Test T: Soldering. 3 Preparation of the specimen The specimen shal

27、l be preconditioned, wired and mounted as specified in the detail specification. 4 Test equipment A typical wave-soldering machine with foam flux pre-heating and single- or double-wave shall be used. NOTEThere are small machines by different manufacturers on the market which are well suited for the

28、required test purpose. The foam-wave shall be adjusted such that, with a printed board test specimen without components, the flux just reaches the upper brim of the plated-through holes. Pre-heating:70 C to90 C The flux shall be dry at the end of the pre-heating zone. If the resistance against clean

29、ing solvents, has to be tested, a cleaning equipment shall be used. It may be separate from the soldering machine. The cleaning, however, shall be performed immediately after the soldering. 5 Test procedure The test specimen shall be equipped as described in the detail specification. 5.1 Immersion o

30、f the specimen The test specimen shall be immersed in the solution of flux in accordance with IEC68-2-20. Non-activated flux is preferred. To improve the detection, it is recommended to add to the flux one of the additives in Table 1. Table 1 A better determination is possible if a flux with a fluor

31、escent additive according to Table 1 is used and the specimen is inspected in ultraviolet light. 5.2 Soldering Solder according to IEC68-2-20, Annex B is preferred. Solder temperature:260 C 5 C Soldering time:5 s 1 s 5.3 Cleaning solvents When cleaning is required by the detail specification, the cl

32、eaning solvent shall be defined or chosen from Table 2. Also the test procedure shall be described in the detail specification or chosen from Table 3. Possible combinations are stated in Table 4. 1) Scope of technical committee48: Standardization of electric connectors, connecting devices and mechan

33、ical structures for electronic and electrical equipment. Additives Flux concentration Remarks Brilliant-blue Malachite-green Fuchsine # 1,4g/l # 2,6g/l 1g/l Suited for optical proof of ingressed flux in liquid state EN60512-12-6:1996 4 BSI 07-1999 Table 2 Table 3 Numeral Cleaning solvents 1 Distille

34、d water +10% wetting (vol. %)45 % ethylene glycol monobutyl ether (2-butoxyethyl) 45 % mono-ethanolamine 10 % water 2 Isopropyl alcohol (2-propanol) specific gravity of0,785 kg/dm 3 4 Ethyl alcohol Code Qualification/test method A Immersion of the printed board mounting plane up to2mm Immersion time

35、 () min Temperature of cleaning solvent(23 5) C Permitted pollution of cleaning solvent 1 mg flux (solid content) per litre No movement of the printed board during immersion time B Immersion of the printed board25mm, single chamber procedure Immersion time(2 0,2)min Temperature of cleaning solvent(2

36、3 5) C Permitted pollution of cleaning solvent 1mg flux (solid content) per litre No movement of the printed board during immersion time C Immersion of the printed board25mm, multi-chamber procedure No movement of the printed board during immersion time Under consideration: three or four chamber pro

37、cedure; design of test chambers (cooled, heated); cleaning solvent in each chamber; cleaning solvent temperature in each chamber; immersion time in each chamber. D AS C, however with additional ultrasonic influence, of 35 kHz to 40 kHz. Under consideration (additional): duration of ultrasonic exposu

38、re; designation of chambers having ultrasonic sources; position of specimens with respect to ultrasonic sources. 205 , + 0 EN60512-12-6:1996 BSI 07-1999 5 Table 4 5.4 Printed board test specimen The printed board test specimen shall be specified in the detail specification. Preferably a customary st

39、andard board shall be used, double-sided, with plated-through holes: size:100mm 160mm; thickness:1,5mm; material: see detail specification; basic grid:2,50mm or2,54mm, as appropriate for the component to be tested; hole diameter: see detail specification. Where necessary, additional perforations sha

40、ll be provided to accommodate special component mounting means. Holes outside the area used for components may be covered by suitable adhesive tape or foil. Holes below the component shall remain open, unless otherwise specified in the detail specification. 6 Preparation for testing The specimens sh

41、all be installed on the printed board test specimen for machine soldering, without preconditioning. The specimens shall rest upon the printed board. Special mounting means, if prescribed for the specimens, shall be used. The detail specification shall specify if the specimens shall be tested singly

42、or at a minimum distance from each other. 7 Requirements 7.1 Initial measurements At least one electrical as well as one mechanical feature shall be measured, e.g.contact resistance, operating force or torque, operating characteristic, and these measurements shall be carried out according to the det

43、ail specification. 7.2 Conditioning Conditioning includes fluxing, pre-heating and soldering with the wave-soldering machine according to clause4 and, if cleaning is prescribed, cleaning with the degree of severity as laid down in the detail specification. Cleaning shall begin within3 min after the

44、soldering; additional cooling is not permitted. 7.3 Recovery After cleaning, the printed boards shall be stored for24h at standard atmospheric conditions for testing as per IEC68-1. 7.4 Final measurements The same measurements as specified for initial measurements shall be carried out. The detail sp

45、ecification shall state the limiting values for the inspection. 7.5 Visual examination After completion of both the electrical and mechanical tests, the specimens shall be checked, by means of appropriate optical methods, for residues of flux and, if applicable, for cleaning solvents in areas specif

46、ied in the detail specification. In the specified areas no residues are permitted. 8 Details to be specified When this test is required by the detail specification, the following details shall be specified: a) number of specimens; b) layout of printed board for testing, if applicable; c) specificati

47、on for the masking and fitting of holes beneath the specimen(s), if applicable; d) position of the specimen(s) on the printed board; e) cleaning solvent(s) and cleaning procedure, if applicable; f) requirements for initial and final measurements; g) definition of flux-free and, if applicable, cleani

48、ng-solvent-free areas; h) any deviation from the standard test method. Cleaning solvent (number) Test procedure (code) A B C D 1 X X 2 X X X X 4 X X NOTEPossible combinations are marked by an “X”. EN60512-12-6:1996 6 BSI 07-1999 Annex ZA (normative) Normative references to international publications

49、 with their corresponding European publications This European Standard incorporates by dated or undated reference, provisions from other publications. These normative references are cited at the appropriate places in the text and the publications are listed hereafter. For dated references, subsequent amendments to or revisions of any of these publications apply to this European Standard only when incorporated in it by amendment or revision. For undated references the latest e