BS EN 190000-1996 Harmonized system of quality assessment for electronic components - Generic specification monolithic integrated circuits《电子元器件的质量评估协调体系 一般规范 单片集成电路》.pdf

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1、BRITISH STANDARD BS EN 190000:1996 Harmonized system of quality assessment for electronic components Generic specification: Monolithic integrated circuits The European Standard EN190000:1995 has the status of a British StandardBSEN190000:1996 This British Standard, having been prepared under the dir

2、ectionof the Electrotechnical Sector Board, was published underthe authority of the Standards Board and comes intoeffect on 15March1996 BSI 02-2000 The following BSI references relate to the work on this standard: Committee reference EPL/47/5 Draft for comment 92/27858 DC ISBN 0 580 25211 6 Committe

3、es responsible for this British Standard The preparation of this British Standard was entrusted by Technical Committee EPL/47, Semiconductors, to Subcommittee EPL/47/5, Performance of semiconductor, upon which the following bodies were represented: British Telecommunications plc Federation of the El

4、ectronics Industry Ministry of Defence National Supervising Inspectorate (BSI PC) Amendments issued since publication Amd. No. Date CommentsBSEN190000:1996 BSI 02-2000 i Contents Page Committees responsible Insidefrontcover National foreword ii Foreword 2 Text of EN 190000 7 List of references Insid

5、e back coverBSEN190000:1996 ii BSI 02-2000 National foreword This British Standard has been prepared by Subcommittee EPL/47/5 and is the English language version of EN190000:1995, Generic specification: Monolithic integrated circuits published by the European Committee for Electrotechnical Standardi

6、zation (CENELEC). It supersedes BS CECC90000:1991 which is declared obsolescent; BS CECC90000:1991 remains valid for existing approvals, but may not be used for any new approvals. Cross-references Publication referred to Corresponding British Standard ISO 1000:1973 a BS 5555:1993 Specification for S

7、I units and recommendations for the use of their multiples and certain other units IEC 50 BS 4727 Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms IEC 68 BS 2011 Environmental testing BS EN 60068 Environmental testing IEC 148:1969 BS 3363:1980 Specificat

8、ion for letter symbols for semiconductor devices and integrated microcircuits IEC 191 BS 3934 Mechanical standardization of semiconductor devices IEC 617 BS 3939 Graphical symbols for electrical power, telecommunications and electronics diagrams IEC 617-12:1991 Part 12:1991 Guide for binary logic el

9、ements BS EN 60617 Graphical symbols for diagrams IEC 617-13:1993 BS EN 60617-13:1993 Analogue elements IEC 747 BS 6493 Semiconductor devices IEC 747-1:1983 Part 1 Discrete devices Section 1.1:1984 General IEC 747-10:1991 QC 700000:1991 BS QC 700000:1991 Harmonized system of quality assessment for e

10、lectric components. Semiconductor devices. Generic specification for discrete devices and integrated circuits IEC 748 BS 6493 Semiconductor devices IEC 748-1:1984 Part 2 Integrated circuits Section 2.1:1985 General IEC 748-2:1985 Section 2.2:1986 Recommendations for digital integrated circuits IEC 7

11、48-3:1986 Section 2.3:1987 Recommendations for analogue integrated circuits IEC 748-4:1987 Section 2.4:1989 Recommendations for interface integrated circuits IEC 749:1984 Part 3:1985 Mechanical and climatic test methods CECC 00007:1978 BS E9007:1975 Specification for harmonized system of quality ass

12、essment for electronic components: Basic specification: Sampling plans and procedures for inspection by attributes CECC 00114 BS EN 100114:1992 Rule of procedure 14. Quality assessment procedures ENV 190000-6:1993 DD ENV 190000 Generic specification: monolithic integrated circuits DD ENV 190000-6:19

13、94 Procedure for approval and quality management a Supersedes by ISO 1000:1992.BSEN190000:1996 BSI 02-2000 iii A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a Britis

14、h Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i to iv, theENtitle page, pages 2 to 198, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have

15、 had amendments incorporated. This will be indicated in the amendment table on the inside front cover.iv blankEUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 190000 June 1995 Supersedes CECC 90000:1990 Descriptors: Quality, electronic components, monolithic integrated circuits English version G

16、eneric specification Monolithic integrated circuits Spcification gnrique: Circuits intgrs monolithiques Fachgrundspezification: Monolitische integrierte Schaltungen This European Standard was approved by CENELEC on 1992-11-28. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulat

17、ions which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This

18、European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members

19、are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europe

20、n de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1995 Copyright reserved to CENELEC members Refs. No. EN 190000:1995 EEN190000:1995 BSI 02-2000 2 Foreword This European Standard was prepared by Working Group

21、 CLC/TC CECC/WG9, “Integrated circuits”. The text of the draft based on CECC90000:1990 (Issue4) and documents CECC(Secretariat)2739, 2740, 2741, 2567, 2565, 2570, 2644, 2668, 2669, 2566, 2645, 2646 and 3117 was submitted to the formal vote. Together with the voting reports, circulated as documents C

22、ECC(Secretariat)3187, 2632, 2631, 2674, 2784, 2790, 3189, 2726, 2785, 2786 and 3251, it was approved as EN190000 on1992-11-28. This European Standard supersedes CECC90000:1990. latest date by which the ENhas to be implemented by publication of an identicalnational standard or by endorsement (dop) 19

23、96-01-11 latest date by which national standards conflicting with the EN haveto be withdrawn (dow) 2004-01-11EN190000:1995 BSI 02-2000 3 Contents Page Foreword 2 1 Scope 7 2 General 7 2.1 Order of precedence 7 2.2 Related documents 7 2.3 Units, symbols and terminology 8 2.3.1 General 8 2.3.2 General

24、 terms for integrated circuits 8 2.4 Standard and preferred values 8 2.5 Marking of component and package 8 2.5.1 Terminal identification 9 2.5.2 Factory identification code 9 2.5.3 Precautions for Electrostatic Sensitive Devices 9 2.5.4 Optional tests 9 2.5.5 Marking symbols location 9 2.6 Ordering

25、 information 11 3 Quality assessment procedures 11 3.1 Primary stage of manufacture and subcontracting 11 3.2 Structural similarity procedures 12 3.2.1 General rules 12 3.2.2 Test dependent criteria for structural similarity 12 3.3 Qualification approval procedure 16 3.3.1 Definition of production l

26、ot and inspection lot 16 3.3.2 Approval procedure 16 3.3.3 Major alterations 17 3.3.4 Examples of major alterations 17 3.4 Quality conformance inspection 18 3.4.1 Division into Groups and Sub-Groups 18 3.4.2 Quality inspection testing 18 3.4.3 Sampling procedures for small lots 18 3.4.4 Supplementar

27、y procedure for reduced inspection 18 3.4.5 Re-submission of rejected lots 19 3.4.6 Certified test records 19 3.4.7 Delayed delivery 19 Page 3.4.8 Delivery of devices subjected to destructive or non-destructive test 19 3.4.9 Supplementary procedure for deliveries 19 3.4.10 Supplementary information

28、19 3.5 Capability approval 19 3.6 Inspection requirements 19 3.7 Statistical Process Control (SPC) 27 4 Test and measurement procedures 27 4.1 Standard conditions for testing 27 4.1.1 Standard atmospheric conditions for reference 27 4.1.2 Standard atmospheric conditions for referee tests 27 4.1.3 St

29、andard atmospheric conditions for testing 27 4.1.4 Standard atmospheric conditions for electrical measurements 27 4.1.5 Standard recovery conditions 28 4.2 Visual examination 28 4.2.1 Internal visual examination (pre-cap inspection) 28 4.2.2 External visual examination 28 4.3 Dimensions 28 4.4 Immer

30、sion in cleaning solvents 29 4.5 Electrical measurement procedure 30 4.5.1 Ratings 30 4.5.2 Equilibrium conditions 30 4.5.3 Temperature 30 4.5.4 Precautions 30 4.5.5 Measurement circuit requirements 30 4.5.6 Multiple integrated circuits 31 4.5.7 Unspecified connections to terminals 31 4.5.8 Electric

31、al measuring methods 31 4.5.9 Transient energy test 31 4.5.10 Correlated measurements 32 4.5.11 Die attach 33 4.5.12 Latch-up 34 4.6 Environmental testing procedures 44 4.6.1 Storage at high and low temperatures 44 4.6.2 Damp heat, steady-state 45 4.6.3 Damp heat 46 4.6.4 Shock 49EN190000:1995 4 BSI

32、 02-2000 Page 4.6.5 Vibrations (sinusoidal) 49 4.6.6 Vibration, fixed frequency 50 4.6.7 Acceleration, steady-state 50 4.6.8 Change of temperature 50 4.6.9 Sealing 51 4.6.10 Solderability of terminations 53 4.6.11 Resistance of components to soldering heat 58 4.6.12 Robustness of terminations and in

33、tegral mounting devices 59 4.6.13 Industrial atmosphere 60 4.6.14 Salt mist 60 4.6.15 Flammability test of plastic encapsulated devices 60 4.6.16 Moisture induced cracking test 60 4.6.17 Internal wire pull test 60 4.6.18 Die shear strength test 61 4.7 Definition of axes for mechanical tests 63 4.8 E

34、lectrical endurance testing 64 4.8.1 General conditions 64 4.8.2 Test temperature and duration 65 4.8.3 Operating modes and specific conditions for testing 65 4.8.4 Initial and end point tests 65 4.9 Accelerated test procedures 65 4.9.1 Requirements for eligibility in periodic testing 66 4.9.2 Therm

35、ally accelerated electrical endurance testing 66 4.9.3 Level of activation energy for thermally accelerated tests 67 4.10 Screening 68 4.10.1 Screening procedures 69 4.10.2 Screens and tests description 71 4.10.3 Specified conditions 74 Annex A Internal visual examination and alternate method 75 Ann

36、ex B Comparison between IEC and CECC documents (environmental and endurance testing procedures) 119 Annex C Capability approval 122 Annex D CQC specification writers guide 133 Annex E Guide for application of structural similarity procedures described in clause 3.2 133 Page Annex F Statistical proce

37、ss control (SPC) 137 Annex G EQML for integrated circuits 144 Figure 1 10 Figure 2 10 Figure 5a 62 Figure 5b 62 Figure 5c 62 Figure 5d 63 Figure 6a Dual-in-line package 64 Figure 6b Flat package 64 Figure 6c Cylindrical package 64 Figure 1 Scratch criteria 95 Figure 2 Void criteria 96 Figure 3 Mos s

38、cratch and void criteria 97 Figure 4 Bonding pad areas 98 Figure 5 Mos gate alignment 99 Figure 6 Diffusion faults 100 Figure 7 Passivation faults 100 Figure 8 Scribing and die defects 101 Figure 9 Beam lead die faults 102 Figure 10 bond dimensions 103 Figure 11 Bonds at metallization exit 104 Figur

39、e 12 Beam lead bond area 105 Figure 13 Beam lead bond location 105 Figure 14 Dielectric isolation defects 106 Figure 15 Thin film resistor contact area 107 Figure 16 Scratch criteria 108 Figure 17 Termination ends 109 Figure 18 Mos scratch and void criteria 110 Figure 19 Void criteria 111 Figure 20

40、Diffusion fault 112 Figure 21 Passivation fault 112 Figure 22 Scribing and die defects 113 Figure 23 Balling of die attach material 114 Figure 24 Laser trimmed glassivation defects 115 Figure 25 Laser trimmed thin film resistor 116 Figure 26 Scratch and void criteria for untrimmed resistors 117 Figu

41、re 27a Scratch and void criteria for trimmed resistors 117EN190000:1995 BSI 02-2000 5 Page Figure 27b Scratch and void criteria for trimmed resistors 118 Figure 28 Block resistor criteria 119 Figure 1 IC design flow (example) 166 Table 1 Test dependent criteria for structural similarity 1366 blankEN

42、190000:1995 BSI 02-2000 7 1 Scope This specification specifies the terms, definitions, symbols, test methods and other material for monolithic integrated (micro)circuits 1) , as defined in IEC747, necessary to prepare appropriate detail specifications (DS) in the CECC System. Supplementary requireme

43、nts for different families of integrated microcircuits are included in separate specifications. 2 General 2.1 Order of precedence Where any discrepancies occur for any reason, documents shall rank in the following order of authority: the detail specification (DS) the sectional specification (SS) the

44、 generic specification (GS) the internal regulation of the FENe.V. any other international documents to which reference is made. The same order of precedence shall apply to equivalent national documents. 2.2 Related documents In each case the latest issue of the documents prior to the date of issue

45、of this document is valid. ISO 1000, SI units and recommendations for the use of their multiples and of certain other units. IEC 27-1, Letter symbols to be used in electrical technology. General. IEC 50, International Electrotechnical Vocabulary. IEC 68, Basic environmental testing procedures. IEC 1

46、34, Rating systems for electronic tubes and valves and analogous semiconductor devices. IEC 148, Letter symbols for semiconductor devices and integrated microcircuits (Chapter X). IEC 617, Graphical symbols for diagrams. IEC 617-12, Part 12: Binary logic elements. IEC 617-13, Part 13: Analogue eleme

47、nts. IEC 747, Semiconductor devices Discrete devices and integrated circuits. IEC 747-1, Part 1: General. IEC 747-10, Part 10: Generic specification for discrete devices and integrated circuits. IEC 748, Semiconductor devices Integrated circuits. IEC 748-1, Part 1: General. IEC 748-2, Part 2: Digita

48、l integrated circuits. IEC 748-3, Part 3: Analogue integrated circuits. IEC 748-4, Part 4: Interface integrated circuits. IEC 749, Semiconductor devices: Mechanical and climatic test methods. IEC 191, Mechanical standardization of semiconductor devices. CECC 00007, Basic specification: Sampling plan

49、s and procedures for inspection and attributes. CECC 00114, Quality Assessment Procedures. Internal Regulations of the FENe.V. and CECC Rules of Procedure. 1) In the following the term “integrated circuits” is used.EN190000:1995 8 BSI 02-2000 2.3 Units, symbols and terminology 2.3.1 General Units, graphical symbols, letter symbols and terminology shall, whenever possible, be taken from the following documents: Any other units, symbols, and terminology required shall be deriv