BS EN 160200-2-1998 Harmonized system of quality assessment for electronic components - Sectional specification - Microwave modular electronic units of assessed quality - Index of .pdf

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1、BRITISH STANDARD BS EN 160200-2:1998 Harmonized system of quality assessment for electronic components Sectional specification: Microwave modular electronic units of assessed quality Part 2: Index of test methods The European Standard EN 160200-2:1997 has the status of a British Standard ICS 31.020B

2、SEN 160200-2:1998 This British Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards Board and comes into effect on 15 March 1998 BSI 04-1999 ISBN 0 580 28453 0 National foreword This British Standard is the Englis

3、h language version of EN160200-2:1997 published by the European Electronic Components Committee (CECC) of the European Committee for Electrotechnical Standardization (CENELEC). The UK participation in its preparation was entrusted to Technical Committee EPL/500, Modular Electronic Units (MEUs), whic

4、h has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them

5、 in the UK. A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section enti

6、tled “International Standards Correspondence Index” or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Complian

7、ce with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, theEN title page, pages 2 to 50 and a back cover. This standard has been updated (see copyright date) and may have had

8、amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No. Date CommentsBSEN160200-2:1998 BSI 04-1999 i Contents Page National foreword Inside front cover Foreword 2 Text of EN 160200-2 3ii blankEUROPEAN STANDARD NOR

9、ME EUROPENNE EUROPISCHE NORM EN 160200-2 December 1997 ICS 31.020 Descriptors: Modular electronic units, microwave, assessed quality, test, measurement procedures, index of special test methods English version Sectional specification: Microwave modular electronic units of assessed quality Part 2: In

10、dex of test methods Rahmenspezifikation: Elektronische Mikrowellenmodule mit bewerteter Qualitt Teil 2: Verzeichnis der Prfverfahren This European Standard was approved by CENELEC on 1997-07-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditi

11、ons for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in thre

12、e official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnica

13、l committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisati

14、on Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1997 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN160200-2:1997 EEN160200-2:1997 BSI 04-1999 2 Foreword

15、This sectional specification has been prepared by the United Kingdom under the single originator procedure for approval and publication of CECC specifications (see RP 11-V). It is to be used for the assessment of Microwave Modular Electronic Units (MMEUs) within the CECC capability approval scheme.

16、The content is in accordance with the generic specification for Modular Electronic Units (MEUs) EN160000 and meets the requirements of Rules of Procedure 14 (RP14). This part 2 is to be read in conjunction with Part 1 of EN160200, which details the requirements for obtaining Capability Approval and

17、Specification of MMEUs. It is based wherever possible, on the publications of the International Electrotechnical Commission. The text of the draft was submitted to the Unique Acceptance Procedure and was approved by CENELEC as EN160200-2 on 1997-07-01. The following dates were fixed: Contents Page F

18、oreword 2 Section 1. General matters 3 1.1 Scope 3 1.2 Related documents 3 Section 2. Test and measurement procedures 4 2.1 General 4 2.2 Special conditions for testing 4 2.3 Selection guide 5 2.4 Standard test methods 6 2.5 Special test methods 8 2.6 Alternative test methods 50 Figure 1 10 Figure 2

19、 11 Page Figure 3 12 Figure 4 13 Figure 5 14 Figure 6 15 Figure 7 16 Figure 8 17 Figure 9 18 Figure 10 19 Figure 11 20 Figure 12 20 Figure 13 22 Figure 14 23 Figure 15 25 Figure 16 26 Figure 17 28 Figure 18 30 Figure 19 32 Figure 20 33 Figure 21 35 Figure 22 36 Figure 23 37 Figure 24 38 Figure 25 39

20、 Figure 26 39 Figure 27 40 Figure 28 41 Figure 29 42 Figure 30 43 Figure 31 45 Figure 32 46 Figure 33 47 Figure 34 49 Figure 35 50 Table 1 Test group selection matrix 6 Table 2 Index of special test methods 9 latest date by which the EN has to be implemented at national level by publication of an id

21、entical national standard or by endorsement (dop) 1998-06-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 1998-06-01EN160200-2:1997 BSI 04-1999 3 Section 1. General matters 1.1 Scope This Part 2 of the Sectional Specification EN160200 defines standar

22、d/reference test methods for Electrical, Mechanical and Visual Inspection as prescribed in Part 1 of the Sectional Specification EN160200 and Blank Detail Specification EN160201 for Microwave Modular Electronic Units (MMEUs). Section 3 of EN160200-1 details general requirements for test and measurem

23、ent procedures (including environmental test requirements). This Standard specifies a wide range of documents which relate to microwave test methods. Many of which are not covered by IEC or CECC specifications. Although a number of test methods are under preparation by IEC and CECC they are consider

24、ed acceptable for use in this Standard. Where test methods have been considered suitable for insertion into this Standard they are either referenced under clause2.4 Standard Test Methods or detailed in full under clause2.5 Special Test Methods. Examples of MMEUs which are covered by these test metho

25、ds are: Guidance on the prime electrical characteristics to be measured is given in AnnexC of the Blank Detail Specification (BDS) EN160201. This Part 2 of EN160200 will be reviewed as other test methods become available. 1.2 Related documents See clause1.2 of EN160 000 and1.2 of EN160200-1. Latest

26、issue of the following documents applies unless otherwise stated: 1.2.1 IEC specifications Proposed IEC Documents Waveguides and their accessories: Prepared by IEC TC 46B Amplifiers Attenuators Couplers/Power dividers Filters Isolators/Circulators Limiters Mixers Noise Sources Oscillators Phase Shif

27、ters Switches Transmitters (e.g.Integrated Multichannel) IEC 154-1:1982 Flanges for waveguides: IEC 169 (Part 1 to 22) Radio frequency connectors CECC 22000 also relates 46B(Secretariat)161 Electromagnetic Compatibility Measurement to be made on Waveguide and Waveguide Assemblies 46B(Secretariat)162

28、 Measurement of Return Loss on Waveguide and Waveguide Assemblies 46B(Secretariat)163 Graphical Method for the Determination of Waveguide Performance 46B(Secretariat)164 Waveguide and Waveguide Assembly Attenuation 46B(Secretariat)165 Waveguide Power Holding Capability 46B(Secretariat)166 Variation

29、of Group Delay 46B(Secretariat)167 Level of Intermodulation Products 46B(Secretariat)168 Decoupling and Rotation of the Plane of Polarization 46B(Secretariat)169 Reflection Coefficient at Rectangular Waveguide Interfaces 46B(Secretariat)170 RF Gaskets and Metallic Shims 46B(Secretariat)171 Revised P

30、roposal for “B” Type Flanges Employing Circular Positional Tolerancing Method of DimensioningEN160200-2:1997 4 BSI 04-1999 1.2.2 CECC specifications 1.2.3 Specification sources IEC and CECC Specifications: for more information contact the relevant National Authorized Institution (ONH). Section 2. Te

31、st and measurement procedures 2.1 General This section contains test methods which are applicable to MMEUs. The Standard conditions of test and general requirements for environmental, visual, mechanical and electrical test methods are given in Section 3 of EN160200-1. It is permissible to sub-contra

32、ct testing to a CECC approved laboratory seeclause3.1.2 of CECC00114-III. For the selections of other test methods not specified in this Standard see guidance given in clause3.1 of EN160200-1. When performing tests, the conditions of clause3.2 of EN160200-1 shall be met. It should be noted that basi

33、c testing procedures and measuring methods for Electromechanical Components and Component Boards (Printed Wiring Boards) are detailed in CECC00009 and CECC00010 respectively. Handling components and electronic assemblies shall be controlled to prevent contamination. As a general rule solderable surf

34、aces shall not be handled with bare hands or fingers. Gloves, if worn, shall be changed as often as necessary to avoid handling parts with dirty or worn gloves. When components are present which may be damaged by electrical overstress (EOS) or electrostatic discharge (ESD), all handling assembly, in

35、spection and testing shall take place at an EOS/ESD safe work station see EN100015: Basic specification: Protection of electrostatic sensitive devices. 2.2 Special conditions for testing 2.2.1 Precautions Particular attention is drawn to the following hazards: a) RF burns. Personnel shall not be exp

36、osed to strong r.f.connectors or open waveguides that are transmitting power which may cause burns to the skin. CECC 00 009 Basic specification: Basic testing procedures and measuring methods for Electromechanical Components CECC 00 010 Basic specification: Printed Circuit Boards Test Methods CECC 0

37、0 803 Visual Inspection of Surface Mounted Assemblies EN 135000 Generic specification: Travelling Wave Amplifier Tubes EN 136000 Generic specification: Magnetrons CECC 45000 Generic specification: Space-Charge Controlled Tubes EN 160000 Modular Electronic Units (MEUs) prEN 160100 Printed Wiring Asse

38、mblies EN 160200-1 Sectional Specification: Microwave Modular Electronic Units of Assessed Quality Part 1: Capability Approval EN 160201 Blank Detail Specification; Microwave Modular Electronic Units of Assessed Quality Capability Approval CECC 63 000 Generic specification: Film and Hybrid Integrate

39、d Circuits EN 169000 Generic specification: Quartz Crystal Controlled OscillatorsEN160200-2:1997 BSI 04-1999 5 b) RF radiation. Components shall be so designed that personnel cannot come into contact with r.f.fields, even at relatively low frequencies. Absorption of r.f.energy by the human body is d

40、ependent on frequency and, although at frequencies below 30MHz most energy passes straight through the body with little heating effect, it still presents a hazard. To minimize leakage of r.f.energy all r.f.connectors, waveguide coupling flanges and cavities shall be correctly fitted and the transmis

41、sion lines efficiently coupled to a load, before the component is energized withr.f. In particular, care has to be taken to ensure that the eyes are not subjected to r.f.radiation. c) Beryllium oxide ceramics. This material may be used in some components (usually marked with a blue band or BeO). Ber

42、yllium oxide dust, or fumes containing it, are highly toxic if inhaled or if particles enter the body via a cut or abrasion. Avoid handling beryllium oxide ceramics; if they are touched, wash the hands before smoking or eating. Do nothing to beryllium oxide ceramics that may produce dust. Cleaning i

43、nformation is available from the manufacturer. d) Implosion and explosion. All evacuated or pressurized components store potential energy which is released if they are broken. The energy level is low in small devices, but may be considerable in large ones. Components shall be stored and transported

44、in their approved package. During installation or replacement any glass or ceramic seals should be treated with care and not subjected to scratching or physical force. The user shall be protected against implosion or explosion of the component when it is installed in test equipment. 2.2.2 Interface

45、devices Interface devices are usually necessary to provide for connection of the microwave item to the test equipment and to generate specialize test stimuli. Particular care is necessary to avoid hazards when flanges are disconnected. With Automatic Test Equipment (ATE) it may be necessary to disab

46、le the source as part of the programme before an operator instruction is given for such a disconnection. Provision may also be needed for supporting and moving microwave components at the heights required for testing. Some types of short circuits and shorting loops in microwave components can someti

47、mes be utilized for a d.c.continuity test to check system completeness. Where the power in the system is significant, an r.f.power flux density check for personnel safety should precede any other testing. 2.2.3 High power circuits In high power circuits such as those associated with transmitters, pa

48、rticular problems arise. The presence of high voltage, high thermal dissipation, etc. may limit the amount of safe direct test access. In some cases pick-up loops or similar devices may be provided for test sampling. It is important that the test access provisions for the earlier low power stages sh

49、ould be well thought out. Some characteristics of the high power stage may be measured by indirect methods, e.g.output power via a liquid or air-cooled artificial load equipped with suitable calorimetric or direct power indication. Test access provisions shall not be such that X-ray or r.f.radiation screens need to be removed unless some other adequate form of screening is substituted. Particular care is needed in providing as effective r.f.earth for test measurement. Test points shall be so positioned that r