BS EN 160100-1998 Harmonized system of quality assessment for electronic components - Sectional specification capability approval of manufacturers of printed board assemblies of as.pdf

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1、BRITISH STANDARD BS EN 160100:1998 Harmonized system of quality assessment for electronic components Sectional specification: Capability approval of manufacturers of printed board assemblies of assessed quality The European Standard EN 160100:1997 has the status of a British Standard ICS 31.180BSEN

2、160100:1998 This British Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards Board and comes into effect on 15 February 1998 BSI 04-1999 ISBN 0 580 29214 2 National foreword This British Standard is the English l

3、anguage version of EN160100:1997 published by the European Electronic Components Committee (CECC) of the European Committee for Electrotechnical Standardization (CENELEC). The UK participation in its preparation was entrusted to Technical Committee EPL/500, Modular electronic units (MEUs), which has

4、 the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in t

5、he UK. A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references Attention is drawn to the fact that CEN and CENELEC standards normally include an annex which lists normative references to international publications with their corresponding E

6、uropean publications. The British Standards which implement these international or European publications may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A

7、 British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a

8、 front cover, an inside front cover, pages i and ii, the EN title page, pages2 to 37 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since public

9、ation Amd. No. Date CommentsBSEN160100:1998 BSI 04-1999 i Contents Page National foreword Inside front cover Foreword 2 Text of EN 160100 5ii blankEUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN160100 August1997 ICS31.180 Descriptors: Printed board assemblies, quality assessment, capability app

10、roval, test, measurement procedures English version Sectional Specification: Capability approval of manufacturers of printed board assemblies of assessed quality Rahmenspezifikation: Befhigungsanerkennung fr Hersteller von bestckten Leiterplatten mit bewerteter Qualitt This European Standard was app

11、roved by CENELEC on 1996-12-09. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such nat

12、ional standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own langua

13、ge and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Swi

14、tzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1997 CENELEC All rights of exploitation in any form a

15、nd by any means reserved worldwide for CENELEC members. Ref. No. EN160100:1997 EEN160100:1997 BSI 04-1999 2 Foreword This European Standard was prepared by the British ONH under the CECC Single Originator Procedure. The text of the draft was submitted to the formal vote and was approved by CENELEC a

16、s EN160100 on 1996-12-09. The following dates were fixed: Contents Page Foreword 2 1 General 5 1.1 Scope 5 1.2 Related documents 5 1.3 Units, symbols and terminology 5 1.3.1 Printed circuit (IEC 194) 5 1.3.2 Printed board (IEC 194) 5 1.3.3 Printed board assembly (IEC 194) 6 1.3.4 Pin-in-hole assembl

17、y (PIH) 6 1.3.5 Surface mounting assembly (SMA) or surface mounting technology (SMT) 6 1.3.6 Rework (RP14-III and RP14-1.4) 6 1.3.7 Rework (RP14-III and RP14-1.5) 6 1.4 Marking of the printed board assembly and package 6 2 Quality assessment procedures 6 2.1 General 6 2.1.1 Eligibility for capabilit

18、y approval (subsection 2.1 RP 14-III) 6 2.1.2 Primary stage of manufacture 6 2.1.3 Structural similarity 6 2.1.4 Subcontracting 6 2.1.5 Incorporated components (subsection 2.3 RP 14-III) 7 2.1.6 Validity of release 7 Page 2.2 Procedures for capability approval 8 2.2.1 Application for capability appr

19、oval (subsection 2.4 RP 14-III) 8 2.2.2 Granting of capability approval 8 2.2.3 Description of capability (subsection 2.5 RP 14-III) 8 2.2.4 Capability qualifying components (CQCs) 9 2.2.5 Demonstration and verification of capability 10 2.2.6 Procedure to be followed in the event of CQC failures (su

20、bsection 2.6 and subsection 2.10 RP 14-III) 16 2.2.7 Abstract of description of capability 16 2.3 Procedures following the granting of capability approval 16 2.3.1 Maintenance of capability approval (see subsection 2.9 of RP 14-III) 16 2.3.2 Modifications likely to affect the validity of the capabil

21、ity approval (subsection 2.11 of RP 14-III) 17 2.4 Release for delivery 17 2.4.1 Quality conformance inspection requirements (subsection 3.1 of RP 14-III) 17 2.4.2 Customer detail specification 18 2.4.3 Detail specifications for standard catalogue items to be included in the qualified products list

22、(QPL) 18 3 Test and measurement procedures 18 3.1 Test and measurement conditions 18 3.1.1 Standard atmospheric conditions for testing and for electrical measurements 18 3.1.2 Standard atmospheric conditions for referee tests 18 3.2 Measurement uncertainty 18 3.3 Alternative test methods including t

23、he use of production tests 18 3.3.1 Analogous tests 18 3.3.2 Referee tests 18 3.4 Visual inspection 19 3.4.1 General 19 3.4.2 Mechanical component mounting acceptability requirements 19 3.4.3 Lead forming 20 3.4.4 Component orientation and alignment 22 latest date by which the EN has to be implement

24、ed at national level by publication of an identical national standard or by endorsement (dop) 1998-03-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 1998-03-01EN160100:1997 BSI 04-1999 3 Page 3.4.5 Soldering acceptability conventional components and

25、 terminals 24 3.4.6 Surface mount assemblies 27 3.4.7 Soldering acceptability surface mounted components 30 3.4.8 Cleanliness 32 3.4.9 Conformal coatings and encapsulants 32 3.4.10 Solder resists and markings 33 3.5 Dimensioning and gauging 33 3.6 Electrical test procedures 33 3.6.1 Cleanliness test

26、ing 34 3.7 Mechanical test procedures see also 3.8 34 3.8 Environmental and endurance testing and screening 34 3.8.1 Temperature 35 3.8.2 Damp heat, cyclic 35 3.8.3 Shock 35 3.8.4 Vibration (sinusoidal) 35 3.8.5 Other tests 35 Annex A (informative) Sample flow chart and general plan for selection of

27、 CQCs 36 Annex B (normative) Example layout of an abstract of description of capability for inclusion in CECC00200 37 Figure 1 Test plan for terminal pin CQCs 11 Figure 2 Test plan for adhesive bonding CQCs 11 Figure 3 Test plan for cleaning CQCs 11 Figure 4 Test plan for conformal coating and encap

28、sulant CQCs 12 Figure 5 Test plan for maximum size CQCs 13 Figure 6 Test plan for component assembly CQCs 14 Figure 7 Lead bend radius (r) and minimum distance from the component body 21 Figure 8 Strain relief 21 Figure 9 Forming damage to leads 22 Figure 10 Side-mounted radial leaded components 23

29、Figure 11 Vertically mounted components 23 Figure 12 For coated or dipped components “H” shall lie between 0.25 mm and 2.3 mm 24 Figure 13 Fillet shape as a guide to wetting of solder 25 Page Figure 14 Preferred PTH joint 26 Figure 15 Minimum acceptable PTH joint 26 Figure 16 Preferred placement 27

30、Figure 17 Acceptable displacement 28 Figure 18 Mounting leaded devices 29 Figure 19 Butt joints 31 Table 1 Test schedule for initial capability approval 15 Table 2 Periodic tests for maintenance of capability approval 174 blankEN160100:1997 BSI 04-1999 5 1 General 1.1 Scope This document is a sectio

31、nal specification relating to printed board assemblies (as defined in1.3.2 below) of assessed quality which meet the criteria for a modular electronic unit as defined in the generic specification EN160000. It applies to both custom built products and to standard catalogue items and defines the chara

32、cteristics to be assessed and the test methods to be used for capability approval, for quality conformance inspection (lot-by-lot) and maintenance of approval. Acceptance criteria for specific printed board assemblies will be given in the relevant detail specifications in accordance with blank detai

33、l specification EN160101. This sectional specification is to be read in conjunction with EN160000. It invokes all of the requirements of CECC00114-III in addition to meeting the requirements of Annex A of EN160000. 1.2 Related documents IEC publication 68, Basic environmental testing procedures. IEC

34、 publication 194, Terms and definitions for printed circuits. IEC publication 321-2, Auxiliary printed board information Part 2: Rework, repair, modifications. IEC publication 410, Sampling procedures. IEC publication 589, Methods of test for determination of ionic impurities in electrical insulatin

35、g materials by extraction with liquids. CECC 00 400-IV, Preparation of capability approval generic, sectional and blank detail specifications. EN 100 114-1, Quality assessment procedures Approval of manufacturers and other organisations. CECC 00 114-III, Capability approval of an electronic componen

36、t manufacturing activity. CECC00200, Register of firms products and services approved under the CECC system. CECC 00 802, CECC standard method for the specification of surface mounting components (SMDs) of assessed quality. CECC 00 803, Guidance document: Visual inspection of soldered surface mounte

37、d assemblies. EN 123000, Generic specification: printed boards. EN 100015, Basic specification: Protection of electrostatic sensitive devices. EN 160000, Generic specification: modular electronic units. EN 160101, Blank detail specification: Printed board assembly modular electronic units of assesse

38、d quality (capability approval). NOTEThe above references apply to the current editions except for parts of IEC68 where the referenced edition applies. 1.3 Units, symbols and terminology Units, graphical symbols, letter symbols and terminology shall, whenever possible, be taken from the following do

39、cuments: ISO 1000, SI units and recommendations for the use of their multiples and of certain other units. IEC 27, Letter symbols to be used in electrical technology. IEC 50, International electrotechnical vocabulary. IEC 617, Graphical symbols for diagrams. All other units, symbols and terminology

40、peculiar to printed board assemblies, shall be taken from the relevant IEC or ISO documents, listed under “Related documents”. When none in the standard are suitable, appropriate ones shall be devised and shall be listed in the detail specification for the printed board assembly. General dimensionin

41、g and tolerancing procedures used for production of drawings shall be in accordance with the relevant ISO standards. Other terms are in accordance with EN100114-1 and EN160000. For the purpose of this sectional specification the following additional definitions apply: 1.3.1 printed circuit (IEC 194)

42、 this term is in common use with at least three meanings: a) A generic term to describe a certain technique; b) Circuit obtained by printing and comprising printed components, printed wiring, or a combination thereof, all formed in a predetermined design in, or attached to, a surface or surfaces of

43、a common base; c) Circuit obtained by printing and comprising printed wiring and conventional components, all arranged in a predetermined design in, or attached to a surface or surfaces of a common base. 1.3.2 printed board (IEC 194) base material cut to size containing all holes and bearing at leas

44、t one conductive pattern printed boards are typically subdivided according to: their structure (e.g. single and double sided, multilayers);EN160100:1997 6 BSI 04-1999 the nature of the base material (e.g. rigid, flexible). 1.3.3 printed board assembly (IEC 194) printed board with electrical and mech

45、anical components and/or other printed boards attached to it with all manufacturing processes, soldering, coating, etc. completed. The completed assembly may be supplied with or without an individual housing relevant to the structure and performance of the unit and must meet the criteria for a Modul

46、ar Electronic Unit set down in CECC60000 1.3.4 pin-in-hole assembly (PIH) components have wire or tape leads which are inserted into holes in the mounting substrate and soldered to connect the lead mechanically and electrically to the conductors on the substrate 1.3.5 surface mounting assembly (SMA)

47、 or surface mounting technology (SMT) components which may or may not have wire or tape terminations are mounted on the surface of the substrate. They may be held initially by adhesive or by a solder paste but are finally soldered to the pads on the substrate surface to provide electrical and mechan

48、ical connections to the circuit 1.3.6 rework (RP14-111:subsection 1.4) rework is the rectification, of processing errors prior to release of the printed board assembly by means not differing from those used in the current process or the rework process described by the approved manufacturer in his qu

49、ality manual or referenced therein. 1.3.7 repair (RP14-III:subsection 1.5) repair is the making good of an approved printed board assembly which has been damaged or has become defective after release. In accordance with RP 14-III:subsection 7.2, printed board assemblies which have been repaired shall not be released under the CECC system 1.4 Marking of the printed board assembly and package Marking materials used shall be resistant to discoloration, abrasion and to common solvents employed for fluxes and