BS EN 123100-1989 Harmonized system of quality assessment for electronic components Sectional specification Single and double sided printed boards with plain holes《电子元器件质量评定统一体系 分规.pdf

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1、BRITISH STANDARD BSEN 123100:1992 Incorporating Amendment No. 1 BSCECC23100:1989 renumbered Harmonized system of quality assessment for electronic components Sectional specification: Single and double sided printed boards with plain holes The European Standard EN123100:1992 has the status of a Briti

2、sh Standard ICS 31.180BSEN 123100:1992 This British Standard, having been prepared under the directionof the Electronic Components Standards Policy Committee, was published underthe authority of the BoardofBSI and comes intoeffecton 29September1989 BSI 05-1999 The following BSI references relate to

3、the work on this standard: Committee reference ECL/19 Draft for comment 86/31648 DC ISBN 0 580 17481 6 Committees responsible for this British Standard The preparation of this British Standard was entrusted by the Electronic Components Standards Policy Committee (ECL/-) to Technical Committee ECL/19

4、, upon which the following bodies were represented: British Telecommunications plc ERA Technology Ltd. Electrical and Electronic Insulation Association (BEAMA Ltd.) Electronic Components Industry Federation Electronic Engineering Association GAMBICA (BEAMA Ltd.) Institute of Circuit Technology Insti

5、tute of Metal Finishing Institution of Production Engineers Ministry of Defence National Supervising Inspectorate Printed Circuit Association Telecommunication Engineering and Manufacturing Association (TEMA) Amendments issued since publication Amd. No. Date of issue Comments 7358 November 1992 9250

6、 September 1996 Indicated by a sideline in the marginBSEN 123100:1992 BSI 05-1999 i Contents Page Committees responsible Inside front cover National foreword ii Foreword 2 Text of EN123100 5 Publications referred to Inside back coverBSEN 123100:1992 ii BSI 05-1999 National foreword This British Stan

7、dard has been prepared under the direction of the Electronics Components Standards Policy Committee. It is identical with CENELEC Electronic Components Committee (CECC) 23100:1985 “Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided pri

8、nted boards with plated through holes”. This standard is a harmonized specification within the CECC system and should be read in conjunction with BSCECC23000. In1992the CENELEC Electronic Components Committee (CECC) accepted CECC23100:1985 as European Standard EN123100:1992. Cross-references. The Br

9、itish Standard which implements CECC00100 is BS9000 “General requirements for a system for electronic components of assessed quality” Part 2: “Specification for national implementation of CECC basic rules and rules of procedure”. There is no British Standard equivalent to CECC00010:1980 which compri

10、ses only a list of the tests in IEC326-2 and its supplement IEC326-2A. The Technical Committee has reviewed the provisions of IEC194:1975, IEC321:1970 and IEC326-3:1980 to which reference is made in the text, and has decided that they are acceptable for use in conjunction with this standard. A Briti

11、sh Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. International standard Corresponding British Sta

12、ndard CECC 23000:1985 BS CECC 23000:1989 Harmonized system of quality assessment for electronic components: Generic specification: Printed boards (Identical) IEC 68 BS 2011 Basic environmental testing procedures (MostParts are identical) IEC 249 BS EN 60249 Base materials for printed circuits (MostP

13、arts are identical) BS 6221: Printed wiring boards IEC 326-2:1976 Part 2:1982 Methods of test (Technically equivalent) IEC 326-4:1980 Part 4:1982 Method for specifying single and double sided printed wiring boards with plain holes (Identical) Summary of pages This document comprises a front cover, a

14、n inside front cover, pagesi andii, theENtitle page, pages2 to20, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on theinside front cover.EUROPEAN STANDARD NORME EUROPE

15、NNE EUROPISCHE NORM EN123100 May1992 +A1 August1995 ICS 31.180 Descriptors: Printed boards, single and double sided, plain holes, test specimens, capability test, quality conformance inspection, test patterns English version Sectional Specification: Singleanddoublesidedprintedboards with plain holes

16、 (includes amendment A1:1995) Spcification intermdiaire: Cartes imprimes simples et doubles faces trous mtalliss (inclut lamendement A1:1995) Rahmenspezifikation: Leiterplatten mit Leiterbildern auf einer oder auf beiden Seiten ohne metallisierte Lcher (enthlt nderung A1:1995) This European Standard

17、 EN123100:1992 was approved by the CENELEC Electronic Components Committee (CECC) on 1995-07-04. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up

18、-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

19、 under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Ita

20、ly, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-10

21、50 Brussels 1995 Copyright reserved to CENELEC members Ref. No. EN123100:1992+A1:1995 EEN 123100:1992 BSI 05-1999 2 Foreword The CENELEC Electronic Components Committee (CECC) is composed of those member countries of the European Committee for Electrotechnical Standardization (CENELEC) who wish to t

22、ake part in a harmonized System for electronic components of assessed quality. The object of the System is to facilitate international trade by the harmonization of the specifications and quality assessment procedures for electronic components, and by the grant of an internationally recognized Mark,

23、 or Certificate, of Conformity. The components produced under the System are thereby accepted by all member countries without further testing. This specification has been formally approved by the CECC, and has been prepared for those countries taking part in the System who wish to issue national har

24、monized SECTIONAL SPECIFICATIONS FOR SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLES. It should be read with the current regulations for the CECC System. At the date of printing of this document the member countries of the CECC are Austria, Belgium, Denmark, Finland, France, Germany, Ireland

25、, Italy, the Netherlands, Norway, Portugal, Spain, Sweden, Switzerland, and the United Kingdom, and copies of it can be obtained from the addresses shown on the blue fly sheet. Preface This Sectional Specification was prepared by CECC Working Group 23: Printed Circuits. It is based on publications o

26、f the International Electrotechnical Commission (IEC). The text of this specification was circulated to the CECC for voting in the documents indicated below and was ratified by the President of the CECC for printing as a CECC Specification. SECRETARIAT NOTE: DUE TO THE URGENT INDUSTRIAL NEED FOR THI

27、S SPECIFICATION, THE PRESIDENT OF THE CECC HAS RULED THAT IT BE PUBLISHED WITHOUT THE FULL EDITORIAL PROCEDURE BEING APPLIED. USERS OF THE SPECIFICATION ARE ASKED TO REPORT TO THE CECC GENERAL SECRETARIAT ANY ERRORS THEY FIND SO THAT AMENDING ACTION CAN BE INITIATED. The text is published initially

28、in English and German. The French version will follow as soon as it has been prepared. Foreword to amendment A1 This amendment was prepared by CLC/TC CECC/WG23. The text of the draft was submitted to the Unique Acceptance Procedure and was approved by CENELEC as amendment A1 to EN123100:1992 on 1995

29、-07-04. The following dates were fixed: Schriftstcke Date of Voting Report on the Voting CECC(Secretariat) 1052/1052A November 1981 CECC(Secretariat)1250 CECC(Secretariat) 1547 August 1984 CECC(Secretariat)1621 latest date by which the amendment has to be implemented at national level by publication

30、 of an identical national standard or by endorsement (dop) 1996-07-01 latest date by which the national standards conflicting with the amendment have to be withdrawn (dow) 1996-07-01EN 123100:1992 BSI 05-1999 3 Contents Page Foreword 2 Preface 2 1 Introduction 5 1.1 Scope and object 5 1.2 Related do

31、cuments 5 2 General 5 3 Test specimens 5 3.1 Capability approval 5 3.2 Quality conformance inspection 6 4 Relevant specification 6 5 Characteristics of printed boards 6 6 Capability test programme 13 7 Quality conformance inspection 14 8 Test patterns 18 8.1 Application of test patterns and test boa

32、rds 18 8.2 Composite test pattern (CTP) 18 8.3 Multiple arrangements of the CTP 18 Figure 1 Length of defect 17 Figure 2 Composite test pattern 20 Table I Basic characteristics 7 Table II Additional Characteristics (tobeassessedonlywhen specifically required) 12 Table III 14 Table IV 154 blankEN 123

33、100:1992 BSI 05-1999 5 1 Introduction IEC326-4 is the IEC-Standard for single and double sided printed boards with plain holes. The following document comprises this IEC-Standard and in accordance with the generic specification CECC23000 the information additionally necessary for printed boards inte

34、nded to be handled within the CENELEC system for Electronic Components of Assessed Quality. 1.1 Scope and object This document is a Sectional Specification (SS) relating to single and double sided printed boards with plain holes irrespective of their method of manufacture, when they are ready for mo

35、unting of the components. It defines the characteristics to be assessed and the test methods to be used for capability approval testing and for quality conformance inspection (lot-by-lot and periodic inspection). 1.2 Related documents IEC68, Basic environmental testing procedures. IEC194, Terms and

36、definitions for printed circuits. IEC249, Metal-clad base materials for printed circuits. IEC321, Guidance for the design and use of components intended for mounting on printed boards. IEC326-2, Printed boards test methods. IEC326-3, Design and use of printed boards. IEC326-4, Specification for sing

37、le and double sided printed boards with plain holes. CECC00010, Printed boards test methods. CECC23000, Generic Specification Printed boards of assessed quality. 2 General This Sectional Specification (SS) applies to single and double sided printed boards with plain holes and is intended as a basis

38、for the preparation of Capability Detail Specification (Cap DS) applying to specific materials, e.g. according to IEC249-2, and to be used for capability approval procedures. It may be necessary to have a Cap DS for each type of material. A Cap DS may be prepared by an international or a national bo

39、dy or by a manufacturer (see also CECC00111). Customer Detail Specification (CDS) for the custom built printed boards, according to 5of CECC23000. The CDS will normally be written by the customer and allocated a number within his own system. Further details are also given in CECC 23000 and in CECC00

40、107 Part III. Table I contains the basic characteristics that will normally be important for single and double sided printed boards with plain holes and makes reference to the appropriate tests to verify these characteristics. Table II contains the additional characteristics that may be important fo

41、r certain single and double sided printed boards with plain holes and/or certain applications and makes reference to the appropriate tests to verify these characteristics. Where necessary, the relevant specification may quote characteristics and tests from this Table II. Where additional details for

42、 a test have to be specified in the relevant specification, this is indicated by an asterisk in the relevant column. These details shall then be specified in accordance with CECC00010(IEC326-2). Table III contains the capability test programme. A specified composite test pattern (CTP) is used as cap

43、ability qualifying component. Table IV contains the information for the quality conformance inspection. The tables are not intended to prescribe a test sequence, the tests may be carried out in any sequence, unless otherwise specified. 3 Test specimens 3.1 Capability Approval 3.1.1 Basic Capability

44、The test shall be carried out on the composite test pattern given in 8. 3.1.2 Additional Capability 3.5.3 of CECC23000shall apply. For multiple arrangements see also 8. 3.1.3 Maintenance of Capability Approval 3.8 of CECC23000shall apply.EN 123100:1992 6 BSI 05-1999 3.2 Quality conformance inspectio

45、n Unless otherwise specified production boards and/or specially designed test patterns may be used for carrying out tests for the lot-by-lot and the periodic inspection. Where specially designed test patterns shall be used they may be included in the panel. They may be based on the appropriate patte

46、rn of the composite test pattern clause 8. Consultation between manufacturer and customer will usually be necessary. 4 Relevant specification The term “Relevant Specification” means a product specification for an actual printed board, i.e. a CDS as well as a Cap DS applied to a specific material and

47、 technique, as applicable. The relevant specification shall contain all information necessary to define the printed board clearly and completely. The recommendations given in IEC326-3 shall preferably be followed. Care should be taken to avoid unnecessary prescriptions. Permissible deviations shall

48、be stated where necessary, nominal values without tolerances or simple maxima or minima shall be given where sufficient. Where tolerances are necessary for certain areas or parts of the printed board only, they shall be applied and restricted to those areas or parts. If there are several possibiliti

49、es of presentation, of tolerance classes etc., the selections given in IEC326-3 shall preferably be applied. In case of discrepancy between the CDS and any other pertinent specification (e.g. BS, GS, or SS), the CDS shall prevail. 5 Characteristics of printed boards Basic characteristics of single and double sided printed boards with plain holes are given in Table I. Additional characteristics of single and double sided printed boards with plain holes are given in Table II.EN 123100:1992 BSI 05-1999 7 Table IBasic characteristics Charact