BS EN 123000-1989 Harmonized system of quality assessment for electronic components - Generic specification printed boards《电子元器件质量评定协调体系 通用规范 印制电路板》.pdf

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1、BRITISH STANDARD BS EN 123000:1992 Incorporating Amendment No. 1 to BS CECC23000:1989 (renumbers BS as BSEN123000:1992) and Amendment No. 1 and Addendum No. 1 to BSEN123000:1992 Harmonized system of quality assessment for electronic components Generic specification: Printed boards The European Stand

2、ard EN123000:1991 together with its amendments A1:1995 and A2:1996 has the status of a British Standard ICS 31.180BSEN123000:1992 This British Standard, having been prepared under the directionof the Electronic Components Standards PolicyCommittee, was publishedunder the authorityofthe Board of BSIa

3、ndcomes into effect on 29September1989 BSI 04-2000 The following BSI references relate to the work on this standard: Committee reference ECL/19 Draft for comment 86/31647 DC ISBN 0 580 17482 4 Committees responsible for this BritishStandard The preparation of this British Standard was entrusted by t

4、he Electronic Components Standards Policy Committee (ECL/-) to Technical Committee ECL/19 upon which the following bodies were represented: British Telecommunications plc ERA Technology Ltd. Electrical and Electronic Insulation Association (BEAMA Ltd.) Electronic Components Industry Federation Elect

5、ronic Engineering Association GAMBICA (BEAMA Ltd.) Institute of Circuit Technology Institute of Metal Finishing Institution of Production Engineers Ministry of Defence National Supervising Inspectorate Printed Circuit Association Telecommunication Engineering and Manufacturing Association (TEMA) Ame

6、ndments issued since publication Amd. No. Date of issue Comments 7145 May 1992 9249 September 1996 Indicated by a sideline in the margin Addendum No. 1 August 1997BSEN123000:1992 BSI 04-2000 i Contents Page Committees responsible Inside front cover National foreword ii Foreword 2 Text of EN 123000 5

7、 Publications referred to Inside back coverBSEN123000:1992 ii BSI 04-2000 National foreword This British Standard has been prepared by Technical Committee EPL/501 (formerly known as ECL/19), and is the English language version of EN123000:1991 Generic specification: Printed boards, including amendme

8、nts A1:1995 and A2:1996, published by the European Committee for Electrotechnical Standardization (CENELEC). This standard is a harmonized specification within the CECC system. In1991 theCENELEC Electronic Components Committee (CECC) accepted CECC23000:1985 as European Standard EN123000:1991. The re

9、lated BS9760:1977 specification is now declared obsolescent. Cross-references. The British Standard which implements CECC00100 is BS9000 “General requirements for a system for electronic components of assessed quality” Part2 “Specification for national implementation of CECC basic rules and rules of

10、 procedure”. CECC 00107-I and CECC00107-III have been replaced by EN10114-1:1994 and CECC00114-3:1994 respectively, and are also implemented by BS9000-2:1996. There is no British Standard equivalent to CECC00010:1980 which comprises only a list of the tests in IEC326-2:1976 and its supplement IEC326

11、-2A. The Technical Committee has reviewed the provision of IEC194:1988, IEC410:1973 and CECC00007:1978, to which reference is made in the text, and has decided that they are acceptable for use in conjuction with this standard. A related British Standard to IEC410:1973 and CECC00007:1978 is BS6001“Sa

12、mpling procedures for inspection by attributes” Part1:1972“Specification for sampling plans indexed by acceptable quality level (AQL) for lot by lot inspection”. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for

13、their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. International Standard Corresponding British Standard IEC 249 BS EN 60249 Base materials for printed circuits IEC 326-2:1976 BS 6221: Printed wiring boards Part 2:1982 Methods of

14、test (Technically equivalent) Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, theEN title page, pages 2 to 34, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will

15、 be indicated in the amendment table on the inside front cover.EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 123000 April 1991 + A1 August 1995 + A2 November 1996 ICS 31.180 Descriptors: Printed boards, generic specification, capability approval, quality conformance inspection, preparation of

16、 detail specifications English version Generic Specification: Printed boards (includes amendment A1:1995 and amendment A2:1996) Spcification gnrique: Cartes imprimes (inclutlamendementA1:1995 et lamendement A2:1996) Fachgrundspezifikation: Leiterplatten (enthltnderungA1:1995undnderung A2:1996) This

17、European Standard was approved by the CENELEC Electronic Components Committee (CECC) on 1991-18-04. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

18、 Standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language an

19、d notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerl

20、and and UnitedKingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1995 Copyright reserved to CENELEC members Ref.No. EN123000

21、:1991 + A1:1995 + A2:1996 EEN123000:1991 BSI 04-2000 2 Foreword The CENELEC Electronic Components Committee (CECC) is composed of those member countries of the European Committee for Electrotechnical Standardization (CENELEC) who wish to take part in a harmonized System for electronic components of

22、assessed quality. The object of the System is to facilitate international trade by the harmonization of the specifications and quality assessment procedures for electronic components, and by the grant of an internationally recognized Mark, or Certificate, of Conformity. The components produced under

23、 the System are thereby accepted by all member countries without further testing. The specification has been formally approved by the CECC, and has been prepared for those countries taking part in the System who wish to issue national harmonized GENERIC SPECIFICATIONS for PRINTED BOARDS. It should b

24、e read in conjunction with the current regulations for the CECC System. At the date of printing of this specification the member countries of the CECC are Austria, Belgium, Denmark, Finland, France, Germany, Ireland, Italy, the Netherlands, Norway, Portugal,Spain, Sweden, Switzerland and the UnitedK

25、ingdom, and copies of it can be obtained from the addresses shown on the blue fly sheet. Preface This generic specification was prepared by CECC Working Group23: Printed Circuits. It is based on the publications of the International Electrotechnical Commission (IEC). The text of this specification w

26、as circulated to the CECC for voting in the documents indicated below and was ratified by the President of the CECC for printing as a CECC Specification. SECRETARIAT NOTE: DUE TO THE URGENT INDUSTRIAL NEED FOR THIS SPECIFICATION, THE PRESIDENT OF THE CECC HAS RULED THAT IT BE PUBLISHED WITHOUT THE F

27、ULL EDITORIAL PROCEDURE BEING APPLIED. USERS OF THE SPECIFICATION ARE ASKED TO REPORT TO THE CECC GENERAL SECRETARIAT ANY ERRORS THEY FIND SO THAT AMENDING ACTION CAN BE INITIATED. The text is published initially in English and German. The French version will follow as soon as it has been prepared.

28、Foreword to amendment A1 This amendment was prepared by CLC/TC CECC/WG 23. The text of the draft was submitted to the Unique Acceptance Procedure and was approved by CENELEC as amendment A1 to EN123000:1991 on1995-07-04. The following dates were fixed: Foreword to amendment A2 This amendment was pre

29、pared by CLC/TC CECC/SC 52 (former WG 23). The text of the draft was submitted to the Unique Acceptance Procedure and was approved by CENELEC as amendment A2 to EN 123000:1991 on1996-10-01. This document is a guide to the preparation of a Capability Manual for Printed Boards and has been prepared in

30、 accordance with the requirements of CECC 00114-III, Appendix B. The following dates were fixed: Document Voting date Report on the Voting CECC (Secretariat)1003 February 1981 CECC (Secretariat) 1210 CECC (Secretariat)1507 March 1984 CECC (Secretariat) 1579 latest date by which the amendment has to

31、be implemented at national level by publication of an identical national standard or by endorsement (dop) 1996-07-01 latest date by which the national standards conflicting with the amendment have to be withdrawn (dow) 1996-07-01 latest date by which the amendment has to be implemented at national l

32、evel by publication of an identical national standard or by endorsement (dop) 1997-03-01 latest date by which the national standards conflicting with the amendment have to be withdrawn (dow) 1997-03-01EN123000:1991 BSI 04-2000 3 Contents Page Foreword 2 1 General 5 1.1 Scope 5 1.2 Object 5 1.3 Relat

33、ed documents 5 1.4 General consideration 5 1.5 Specification structure 5 2 Particular stipulations 6 2.1 Primary stage of manufacture 6 2.2 Structurally similar printed boards 6 2.3 Certified test records 6 2.4 Delayed delivery 6 2.5 Release for delivery before the completion ofGroup B tests 6 2.6 R

34、esubmission of rejected lots 6 2.7 Marking of printed board and package 6 2.8 Ordering information 6 3 Capability approval and maintenance of capability approval 7 3.1 General 7 3.2 Capability approval requirements 7 3.3 Description of capability 7 3.4 QPL-information 7 3.5 Demonstration of capabili

35、ty 7 3.6 Capability approval test report 8 3.7 Range of capability approval 8 3.8 Maintenance of capability approval 9 3.9 Suspension and withdrawal of capability approval 9 3.10 Capability approval testing, sample size and number of failures 9 3.1 Inspection information in the Cap DS 7 4 Quality co

36、nformance inspection 9 4.1 Inspection lot 9 4.2 Small lots and/or expensive printed boards 9 4.3 Grouping of tests 9 4.4 Inspection information in the CDS 11 4.5 In-process testing 11 4.6 Indirect measuring methods 11 5 Rules for the preparation of Detail Specifications 11 5.1 Capability Detail Spec

37、ification (Cap DS) 11 5.2 Customer Detail Specification (CDS) 12 Page Appendix A Example of a CDS 14 Appendix B Specification structure 15 Appendix C Example of QPL entries 16 Appendix D Survey of abbreviations 17 Appendix E Guide to the preparation of a CapabilityManual for printed boards 18 E.0 Ge

38、neral requirements 18 E.0.1 Form of the capability manual 18 E.0.1.1 Definitions and abbreviations 18 E.0.2 Introductory pages 19 E.1 Scope of capability approval 20 E.2 Technology (process description) 20 E.3 Subcontracting 20 E.4 Limits of capability 21 E.5 Description of capability 21 E.6 Manufac

39、turer to customer interface 21 E.7 Design rules 22 E.8 Materials list 22 E.9 Manufacture 22 E.9.1 Manufacturing methods 22 E.9.2 Process flow charts 22 E.9.3 Rework policy 22 E.10 Procedure in the event of CQC or productfailure 22 E.11 Test programme for capability approval 22 E.11.1 CQC details 22

40、E.11.1.1 Guidance 22 E.11.2 Total CQC test programme 23 E.11.3 Capability Approval Test Report 23 E.12 Maintenance of capability approval 23 E.13 Modifications to the capability approval 24 E.13.1 Modifications to established capability 24 E.13.2 Significant changes 24 E.14 Test methods and inspecti

41、on 24 Appendix F Process Description 24 Appendix G Limits of Approval 25 Appendix H Description of Capability 26 Appendix J Manufacturer to Customer Interface 27 Appendix K CQC Detail Specification(s) 27 Appendix L Test Programme Matrix 32 Appendix M Maintenance Test Programme 33 Figure 1 27 Figure

42、2 28 Figure 3 30 Figure 4 31 Table 1 Content of a capability manual 194 blankEN123000:1991 BSI 04-2000 5 1. General 1.1 Scope This document is a Generic Specification (GS) applying to printed boards within the CENELEC system for Electronic Components of Assessed Quality. It relates to printed boards

43、 irrespective of their method of manufacture, when they are ready for mounting of the components. 1.2 Object To define system and procedure for approval of manufacturers and products and to provide rules for the preparation of specifications for printed boards. 1.3 Related documents IEC 194, Terms a

44、nd definitions for printed boards. IEC 249, Metal-clad base materials for printed boards. IEC 326-2, Printed circuits Test methods. IEC 410, Sampling plans and procedures for inspection by attributes. CECC 00007, Sampling plans and procedures for inspection by attributes. CECC 00010, Printed board T

45、est methods. 1.4 General considerations Printed boards differ from most other electronic components in important factors, such as there are no standard boards with standard patterns and dimensions but an infinite variety of shapes and circuit configurations, they are “custom tailored”, i.e.all detai

46、ls for a particular board must be agreed between customer and manufacturer, although they are made in considerable total quantities, the production quantity of a particular printed board may be small. Therefore, the CECC Qualification Approval Procedure as detailed in CECC00107-1 cannot be applied.

47、Instead of this, it is necessary to use the CECC Capability Approval Procedure as laid down in CECC00107-III. In case of printed boards capability approval is based on the use of composite test patterns as capability qualifying components with an appropriate selection of test methods and requirement

48、s for each type of printed board, e.g. single/double sided, with plain holes single/double sided, with plated-through holes multilayer printed boards flexible printed boards. NOTEThis list is not intended to be exhaustive. An important requirement of capability approval is that a manufacturer shall

49、demonstrate the claimed capability of his facilities and processes. In the case of printed boards “basic” and “additional” capability are distinguished (see also3.1, 3.5.2, and3.5.3 of this GS). Basic capability is the capability defined in a CECC or ONH.Cap DS. The term “basic” is not intended to indicate any minimum level of assessment, testing or requirement. Additional capability is any capability in addition to the basic capability. Examples of additional capability: maximum size of printed boards that can be processed minimu