BS DD IEC TS 62610-2-2011 Mechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Design guide Method for t.pdf

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1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationMechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 seriesPart 2: Design guide: Method for determination of

2、forced air-cooling structureDD IEC/TS 62610-2:2010National forewordThis Draft for Development is the UK implementation of IEC/TS 62610-2:2010.The UK participation in its preparation was entrusted to Technical CommitteeEPL/48, Electromechanical components and mechanical structures for elec-tronic equ

3、ipment.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2011 ISBN 978 0 580 66987 3 ICS 31.240Compliance with

4、 a British Standard cannot confer immunity from legal obligations.This Draft for Development was published under the authority of the Standards Policy and Strategy Committee on 31 August 2011.Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDDD IEC/TS 62610-2:2010IEC/TS 6

5、2610-2Edition 1.0 2011-07TECHNICALSPECIFICATIONSPCIFICATIONTECHNIQUEMechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Part 2: Design guide: Method for the determination of forced air-cooling structure Structures mcaniques

6、 pour quipements lectroniques Gestion thermique pour les armoires conformes aux sries CEI 60297 et CEI 60917 Partie 2: Guide de conception: Mthode pour la dtermination de la structure de refroidissement par ventilation force INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTER

7、NATIONALE QICS 31.240PRICE CODECODE PRIX Registered trademark of the International Electrotechnical CommissionMarque dpose de la Commission Electrotechnique Internationale DD IEC/TS 62610-2:2010 2 TS 62610-2 IEC:2011 CONTENTS FOREWORD . 3 INTRODUCTION . 5 1 Scope and object 6 2 Thermal interfaces 6

8、2.1 Baseline thermal conditions . 6 2.2 Reference temperature 6 2.3 Syntax of surfaces of a generic subrack, chassis or cabinet 7 2.4 Preferred airflow conditions . 8 2.5 Cabinet airflow volume and temperature rise management 9 3 Forced air thermal flow chart for cabinet equipment 10 3.1 General . 1

9、0 3.2 Evaluation of the actual thermal performance of subrack or chassis 11 3.3 Cabinet airflow considerations . 11 3.4 Arrangement of subracks and/or chassis equipment within the cabinet 11 3.5 Selection of cabinet mounted forced air device(s) 12 3.6 Thermal operating environment . 12 Annex A (info

10、rmative) Limitation of application and background information 14 Bibliography 16 Figure 1 Syntax of surfaces of a forced air cooled generic subrack or chassis to be mounted into a cabinet 7 Figure 2 Syntax of surfaces of a forced air cooled generic cabinet . 7 Figure 3 Preferred air flow patterns 9

11、Figure 4 Air flow volume management . 10 Figure 5 Forced air thermal flow chart for cabinet equipment . 11 Figure 6 Thermal operating environment (Cabinet sectional side view) 12 Figure 7 Example of effect of reference temperature on cabinet operating temperature range 13 Figure A.1 Thermal network

12、model for a plug-in unit in subrack or chassis . 15 Table 1 Preferred airflow pattern 8 DD IEC/TS 62610-2:2010TS 62610-2 IEC:2011 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE WITH IEC 60297 AND IEC 60917 SE

13、RIES Part 2: Design guide: Method for the determination of forced air-cooling structure FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is

14、to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and

15、Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the I

16、EC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as

17、 possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sens

18、e. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees unde

19、rtake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any att

20、estation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition

21、 of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct

22、 or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensabl

23、e for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. The main task of IEC technical committee

24、s is to prepare International Standards. In exceptional circumstances, a technical committee may propose the publication of a technical specification when the required support cannot be obtained for the publication of an International Standard, despite repeated efforts, or the subject is still under

25、 technical development or where, for any other reason, there is the future but no immediate possibility of an agreement on an International Standard. Technical specifications are subject to review within three years of publication to decide whether they can be transformed into International Standard

26、s. IEC 62610-2 TS Ed.1.0, which is a technical specification, has been prepared by subcommittee 48D: Mechanical structures for electronic equipment, of IEC technical DD IEC/TS 62610-2:2010 4 TS 62610-2 IEC:2011 committee 48: Electromechanical components and mechanical structures for electronic equip

27、ment. The text of this technical specification is based on the following documents: Enquiry draft Report on voting 48D/459/DTS 48D/470/RVC Full information on the voting for the approval of this technical specification can be found in the report on voting indicated in the above table. This publicati

28、on has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of IEC 62610 series, under the general title Mechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series, can be found on the IEC website. T

29、he committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be transformed into an International standard,

30、 reconfirmed, withdrawn, replaced by a revised edition, or amended. DD IEC/TS 62610-2:2010TS 62610-2 IEC:2011 5 INTRODUCTION Power dissipation of high-end servers, telecommunication equipment and electronic controllers has been increasing rapidly (Moores law). Thermal management for electronic syste

31、ms has become critical to maintain performance and reliability. For a long time convection air cooling was an adequate and reliable solution. Typically, the cooled air entered a system on the bottom and the heated air exits at the top. However, with increasing packaging density heat dissipation of c

32、omponents required “compartmentalizing” of functions within a cabinet. Individual subracks and chassis require their own individual cooling solutions often enhanced by forced air devices such as fans. In the absence of any guide, subrack and chassis designers typically find their cooling solutions b

33、est suited for their specific application leaving the cabinet system integrator with a mix of incompatible subrack and/or chassis cooling concepts to deal with. An improper arrangement of multiple subracks and/or chassis (the equipment) in a cabinet may cause a severe imbalance of airflow and/or unw

34、anted temperature rises preventing effective cooling of the cabinet installed equipment. Two typical undesirable factors may be triggered by such an imbalanced airflow and/or unwanted temperature rise(s) within a cabinet. The required airflow volume to each individual cabinet mounted equipment may f

35、all short. The air-intake temperature of each cabinet mounted subrack and/or chassis may increase as exhaust air of one equipment may increase the air-intake temperature of another equipment. As a result, unwanted temperature rise of components may occur. The intention of this guide is to educate th

36、e subrack and/or chassis system designer and the cabinet integrator to provide for compatible forced air cooling solutions. This guide is based on the mechanical structures as defined in the IEC 60297 and IEC 60917 series of standards. DD IEC/TS 62610-2:2010 6 TS 62610-2 IEC:2011 MECHANICAL STRUCTUR

37、ES FOR ELECTRONIC EQUIPMENT THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE WITH IEC 60297 AND IEC 60917 SERIES Part 2: Design guide: Method for the determination of forced air-cooling structure 1 Scope and object This part of IEC 62610 provides for compatible methods of forced air cooled cabinets ass

38、embled with associated subracks and/or chassis in accordance with the IEC 60297 and IEC 60917 series. This design guide contains the following: a) Thermal interfaces of subrack and/or chassis based equipment in a cabinet Reference temperature Preferred airflow conditions Airflow volume conditions St

39、andard air b) Procedures for determining compatible forced airflow conditions in a cabinet by applying typical thermal interface conditions The drawings used are not intended to indicate product design. They are only explanatory indications for determining forced air-cooling structure. The terminolo

40、gy used complies with IEC 60917-1. 2 Thermal interfaces 2.1 Baseline thermal conditions In order to enable reproducible and comparable values, standard air is defined at the air inlet to be used for the determination of the thermal capability and requirement parameters of products. NOTE Standard air

41、 as defined for this purpose has a density of 1,2 kg/m3, a relative humidity of 50 %, a temperature of 20 C, a pressure of 1,013 105Pa. A specified heat capacity is 1 005 J/kgK at these conditions. These values are aligned with the fan industry specifications, common test practices and electronic in

42、dustry expectations. 2.2 Reference temperature The thermal operating temperature of subrack and chassis in the cabinet should be defined at the air inlet, and this temperature is called reference temperature in this technical specification. Reference temperature is defined as the temperature of an o

43、bjective ambient air of the equipment in the cabinet which is a starting point for a rise in internal temperatures of the equipment, and, at the same time, influences internal temperatures of it. At one typical equipment which consists of a subrack and a forced air-cooling device, temperatures of in

44、ternal air and inside components of the subrack are determined as certain DD IEC/TS 62610-2:2010TS 62610-2 IEC:2011 7 values from “reference temperature”. And, “reference temperature” of the equipment cabinet can be considered as equivalent with its intake air temperature, because the heat dissipati

45、ng path of the forced air-cooling is dependent on ventilation characteristics of the equipment. (see Clause A.2) The air intake is the initial point of an upstream airflow where air flows into the equipment to cool its inside. The intake air temperature of the equipment (T3-nr) as supplied by the am

46、bient temperature (T4) could be identical (see Figure 6). NOTE Generally, the intake air temperature is measured at the positions from 30 mm to 50 mm away from the outline of the equipment to avoid the influence of heat radiation. At the air intake opening, if the temperature is not considered as ho

47、mogeneous because the opening is so wide, several positions (3 to 5) should be defined as reference temperature positions, and the average temperature should be taken as the intake air temperature. 2.3 Syntax of surfaces of a generic subrack, chassis or cabinet In order to define airflow patterns of

48、 subrack and/or chassis based equipment mounted within a cabinet the syntax of the outer surfaces is defined as in Figure 1. SL (side-left) T (top) R (rear) F (front) B (bottom) SR (side-right) IEC 1700/11 Figure 1 Syntax of surfaces of a forced air cooled generic subrack or chassis to be mounted in

49、to a cabinet SL (side-left) SR (side-right) T (top) R2 (upper-rear) R1 (lower-rear) F (front) B (bottom) IEC 1701/11 Figure 2 Syntax of surfaces of a forced air cooled generic cabinet DD IEC/TS 62610-2:2010 8 TS 62610-2 IEC:2011 2.4 Preferred airflow conditions In order to facilitate an efficient cabinet airflow design, it is necessary to define the preferred airflow pattern of the cabinet mounted equipment. It is important that the cold air e