BS DD IEC TS 62610-1-2010 Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Design guide - Interf.pdf

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1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationMechanical structures for electronic equipment Thermalmanagement for cabinets inaccordance with IEC 60297 and IEC 60917 series Part 1: Design guide: Interface dimension and provi

2、sionfor thermoelectrical cooling systems (Peltier effect)DD IEC/TS 62610-1:2009National forewordThis Draft for Development is the UK implementation of IEC/TS 62610-1:2009.This publication is not to be regarded as a British Standard.It is being issued in the Draft for Development series of publicatio

3、ns and is of a provisional nature. It should be applied on this provisional basis, so that information and experience of its practical application can be obtained.Comments arising from the use of this Draft for Development are requested so that UK experience can be reported to the international orga

4、nization responsible for its conversion to an international standard. A review of this publication will be initiated not later than three years after its publication by the international organization so that a decision can be taken on its status. Notification of the start of the review period will b

5、e made in an announcement in the appropriate issue of Update Standards.According to the replies received by the end of the review period, the re-sponsible BSI Committee will decide whether to support the conversion into an international Standard, to extend the life of the Technical Specification or

6、to withdraw it. Comments should be sent to the Secretary of the responsible BSI Technical Committee at British Standards House, 389 Chiswick High Road, London W4 4AL.The UK participation in its preparation was entrusted to Technical Committee EPL/48, Electromechanical components and mechanical struc

7、tures for elec-tronic equipment.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. BSI 2010ISBN 978 0 580 66986 6

8、ICS 31.240Compliance with a British Standard cannot confer immunity from legal obligations.This Draft for Development was published under the authority of the Standards Policy and Strategy Committee on 31 January 2010 Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDDD I

9、EC/TS 62610-1:2009IEC/TS 62610-1Edition 1.0 2009-09TECHNICAL SPECIFICATIONMechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Pel

10、tier effect) INTERNATIONAL ELECTROTECHNICAL COMMISSION TICS 31.240 PRICE CODEISBN 2-8318-1061-1 Registered trademark of the International Electrotechnical Commission colourinsideDD IEC/TS 62610-1:2009 2 TS 62610-1 IEC:2009(E) CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope.7 2 Normative references .7 3 A

11、rrangement overview7 4 Mounting location 1: cabinet with inside or outside mounted thermoelectrical cooling system in a vertical alignment 8 4.1 Cabinet with inside mounted thermoelectrical cooling system in a vertical alignment 8 4.1.1 General .8 4.1.2 Overview .8 4.1.3 Performance guideline for ca

12、binets with inside or outside mounted thermoelectrical cooling system.10 4.2 Cabinet with inside mounted thermoelectrical cooling system in a horizontal alignment 12 5 Mounting location 2: cabinet with top mounted thermoelectrical cooling system for the cooling of a whole cabinet 13 5.1 Overview .13

13、 5.2 Cooling performance in cabinets with top mounted thermoelectrical cooling systems.14 6 Mounting location 3: cabinet with inbuilt thermoelectrical cooling system for hot spot cooling14 6.1 Overview .14 6.2 Cooling performance for an inbuilt thermoelectrical cooling system for hot spot cooling.16

14、 7 Remark 16 Annex A (informative) Heat management under environmental aspects .18 Bibliography23 Figure 1 Arrangement overview .8 Figure 2 Mounting location 19 Figure 3 Mounting location 1: arrangement of two cabinets with inside mounted Peltier system and minimized distance W110 Figure 4 Performan

15、ce guideline for cabinets with inside mounted thermoelectrical cooling system11 Figure 5 Mounting location 1a: cabinet with side mounted thermoelectrical cooling system in a horizontal alignment.12 Figure 6 Mounting location 2: cabinet with top mounted thermoelectrical cooling system13 Figure 7 Perf

16、ormance guideline for a top mounted thermoelectrical cooling system .14 Figure 8 Mounting location 315 Figure 9 Performance guideline for inbuilt thermoelectrical cooling system for hot spot cooling 16 Figure A.1 Current CO2emission situation.19 Figure A.2 Changes in greenhouse gases from ice-core a

17、nd modern data 5 19 Figure A.3 Radiative forcing of climate between 1750 and 2005 420 DD IEC/TS 62610-1:2009TS 62610-1 IEC:2009(E) 3 Figure A.4 Coefficient of performance depending on the cooling power at the boundary conditions of Ta= 50 C 21 Figure A.5 Electrical power usage of compressor cooling

18、unit versus Peltier cooling unit at given ambient temperature and given heating dissipation to keep the internal temperature fixed22 Table A.1 Advantages and disadvantages of different cooling systems 22 DD IEC/TS 62610-1:2009 4 TS 62610-1 IEC:2009(E) INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECH

19、ANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE WITH IEC 60297 AND IEC 60917 SERIES Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect) FOREWORD 1) The International Electrotechnical Commission (IEC) i

20、s a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to

21、 other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in

22、the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with condit

23、ions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC Natio

24、nal Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way

25、 in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC

26、Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should en

27、sure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of

28、 any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the r

29、eferenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. Th

30、e main task of IEC technical committees is to prepare International Standards. In exceptional circumstances, a technical committee may propose the publication of a technical specification when the required support cannot be obtained for the publication of an International Standard, despite repeated

31、efforts, or the subject is still under technical development or where, for any other reason, there is the future but no immediate possibility of an agreement on an International Standard. Technical specifications are subject to review within three years of publication to decide whether they can be t

32、ransformed into International Standards. IEC 62610-1, which is a technical specification, has been prepared by subcommittee 48D: Mechanical structures for electronic equipment, of IEC technical committee 48: Electromechanical components and mechanical structures for electronic equipment. DD IEC/TS 6

33、2610-1:2009TS 62610-1 IEC:2009(E) 5 The text of this technical specification is based on the following documents: Enquiry draft Report on voting 48D/393/DTS 48D/405/RVC Full information on the voting for the approval of this technical specification can be found in the report on voting indicated in t

34、he above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of the IEC 62610 series can be found, under the general title Mechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC 6

35、0917 series, on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be

36、transformed into an International standard, reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this standard may be issued at a later date. IMPORTANT The “colour inside” logo on the cover page of this publication indicates that it contains colours which are con

37、sidered to be useful for the correct understanding of its contents. Users should therefore print this publication using a colour printer. DD IEC/TS 62610-1:2009 6 TS 62610-1 IEC:2009(E) INTRODUCTION According to the Kyoto Protocol and to the directives of the European Parliament and of the Council,

38、the usage of coolants with high potential for environmental pollution and global warming (Global Warming Potential (GWP) factor) is to be avoided. The most promising alternatives to compressor cooling with e.g. R 134a are compressor cooling with CO2, active cooling based on the Peltier effect and ab

39、sorption cooling systems. Each of these techniques has its advantages and disadvantages. The compressor cooling with CO2at the current state is more or less efficient, but high installation costs due to working pressures up to 100 bars makes this technique less interesting. Another disadvantage of C

40、O2cooling systems occurs out of the physical properties of this coolant and requires additional cooling power to run this process. This fact reduces the degree of efficiency enormously. The Peltier-effect seems to be very promising as the cooling effect is highly dependent of the properties of the m

41、aterial. Newly tested materials based on either porous materials or nano-structures show an improvement of the degree of efficiency. Furthermore, Peltier techniques do not need any kind of coolant and the only moving parts are the fans. The absorption technique is a very intelligent way for cooling,

42、 but it is only profitable in combination with a heat-regenerator what makes absorption cooling system only feasible in very few applications. For more details on mentioned alternatives for cooling, please see Annex A. With respect to the demands of industry concerning high heat density/hotspots coo

43、ling, available space for the cooling systems, adapting to existing infrastructures, noise emission and respectively to the fact that conventional coolants like R 134a need to be replaced, this technical specification was initiated for the definition of dimensional interfaces and performances guidel

44、ines for thermoelectrical cooling systems based on the Peltier effect. Three different arrangements for thermoelectrical cooling systems within cabinets, called “mounting locations”, have been regarded where locations 1 and 2 are feasible for cooling a whole cabinet and location 3 is for hotspot coo

45、ling inside the cabinet. Below is the definition of each mounting location for thermoelectrical cooling systems within cabinets: mounting location 1: cabinet with inside or outside mounted thermoelectrical cooling system for the cooling of a whole cabinet; mounting location 2: cabinet with top mount

46、ed thermoelectrical cooling system for the cooling of a whole cabinet; mounting location 3: cabinet with inbuilt thermoelectrical cooling system in form of a subrack for hot spot cooling. For a clear definition of interface dimensions and cooling performance guidelines, only cabinets from the IEC 60

47、297 (19 inch) and IEC 60917 (25 mm) series have been regarded. DD IEC/TS 62610-1:2009TS 62610-1 IEC:2009(E) 7 MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE WITH IEC 60297 AND IEC 60917 SERIES Part 1: Design guide: Interface dimension and provision for t

48、hermoelectrical cooling systems (Peltier effect) 1 Scope This Technical Specification provides guidelines for the installation of thermoelectrical cooling systems (Peltier effect) within cabinets of the IEC 60297 (19 inch) and IEC 60917 (25 mm) series. The cooling performance is in direct relation w

49、ith the mounting location within a cabinet. Three typical mounting locations are identified: mounting location 1: cabinet with inside or outside mounted thermoelectrical cooling system for the cooling of a whole cabinet; mounting location 2: cabinet with top mounted thermoelectrical cooling system for the cooling of a whole cabinet; mounting location 3: cabinet with inbuilt thermoelectrical cooling system in form of a subrack for hot spot cooling.