BS DD IEC TS 61334-5-4-2002 Distribution automation using distribution line carrier systems - Lower layer profiles - Multi-carrier modulation (MCM) profile《使用配线配电线路载波系统的配电自动化 低层轮廓 .pdf
《BS DD IEC TS 61334-5-4-2002 Distribution automation using distribution line carrier systems - Lower layer profiles - Multi-carrier modulation (MCM) profile《使用配线配电线路载波系统的配电自动化 低层轮廓 .pdf》由会员分享,可在线阅读,更多相关《BS DD IEC TS 61334-5-4-2002 Distribution automation using distribution line carrier systems - Lower layer profiles - Multi-carrier modulation (MCM) profile《使用配线配电线路载波系统的配电自动化 低层轮廓 .pdf(40页珍藏版)》请在麦多课文档分享上搜索。
1、DRAFT FOR DEVELOPMENT DD IEC TS 61334-5-4:2001 Distribution automation using distribution line carrier systems Part 5-4: Lower layer profiles Multi-carrier modulation (MCM) profile ICS 33.200 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWDD IEC TS 61334-5-4:2001 This Draft fo
2、r Development, having been prepared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 25 April 2002 BSI 25 April 2002 ISBN 0 580 39598 7 National foreword This Draft for Development re
3、produces verbatim IEC TS 61334-5-4:2001. This publication is not to be regarded as a British Standard. It is being issued in the Draft for Development series of publications and is of a provisional nature because the source document is an IEC Technical Specification which is not an international sta
4、ndard. It should be applied on this provisional basis, so that information and experience of its practical application may be obtained. Comments arising from the use of this Draft for Development are requested so that UK experience can be reported to the international organization responsible for it
5、s conversion into an international standard. A review of this publication will be initiated 2 years after its publication by the international organization so that a decision can be taken on its status at the end of its three-year life. The commencement of the review period will be notified by an an
6、nouncement in Update Standards. According to the replies received by the end of the review period, the responsible BSI Committee will decide whether to support the conversion into an international standard. Comments should be sent in writing to the Secretary of BSI Technical Committee PEL/57, Power
7、system control and associated communications, at 389 Chiswick High Road, London W4 4AL, giving the document reference and clause number and proposing, where possible, an appropriate revision of the text. A list of organizations represented on this committee can be obtained on request to its secretar
8、y. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards El
9、ectronic Catalogue. Summary of pages This document comprises a front cover, an inside front cover, the IEC TS title page, pages 2 to 37 and a back cover. The BSI copyright date displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. Date C
10、ommentsTECHNICAL SPECIFICATION IECTS 61334-5-4 First edition 2001-06 Distribution automation using distribution line carrier systems Part 5-4: Lower layer profiles Multi-carrier modulation (MCM) profile Reference number IEC/TS 61334-5-4:2001(E) 1002:4543316STCEIDDDDIECTS6133454:2001CONTENTS FOREWORD
11、 4 1 Scope and object. 6 2 Normative references. 6 3 Definitions and abbreviations. 6 3.1 Definitions 6 3.2 Abbreviations 7 4 Lower layer profile structure. 8 4.1 Physical layer . 8 4.2 MAC sublayer . 9 5 Physical layer specification 9 5.1 Modulation 9 5.1.1 Purpose 9 5.1.2 The multicarrier modulati
12、on (MCM) principle. 9 5.2 Physical layer data format .10 5.2.1 Purpose.10 5.2.2 Transmission method, overview .10 5.2.3 Configuration parameters.11 5.2.4 PHY PDU format, CRC encoding and padding .12 5.2.5 Convolutional encoding13 5.2.6 Segmentation and interleaving.14 5.2.7 Preamble .14 5.2.8 Modula
13、tion.14 5.3 PHY services.15 5.3.1 PHY to MAC interface15 6 MAC sublayer protocol specification .17 6.1 Overview .17 6.1.1 MAC communication network architecture17 6.1.2 Features of the MAC sublayer17 6.2 Transmission procedures.17 6.3 MAC services 18 6.3.1 MAC to LLC interface.18 6.3.2 MAC layer man
14、agement interface 20 6.4 MAC PDU format .22 6.4.1 MAC control field .22 6.4.2 Address field23 6.4.3 LLC PDU .23 6.5 MAC addresses .24 6.6 Used MAC PDUs .25 6.6.1 Information PDU 25 6.6.2 Repetition control PDU 25 6.7 MAC invalid PDU.25 6.8 MAC procedures25 6.8.1 MACphy procedures 26 6.8.2 MACrore pr
15、ocedures26 DDIECTS6133454:2001 2002lirpA52ISB 2 DDIECTS6133454:2001 BSI25April2002 26.9 MAC timer values 30 6.10 MAC state transition diagrams/tables.30 6.10.1 Startup.30 6.10.2 MAC sublayer 31 6.10.3 Non-initiator MAC sublayer 34 Figure 1 Layered architecture of the DLC-M protocol stack . 8 Figure
16、2 Sample frequency representation of multicarrier modulation 9 Figure 3 Transmitter data flow diagram (one telegram).11 Figure 4 Block diagram of encoder.13 Figure 5 MAC transmission using MAC service class 0 (postponed confirmation).18 Figure 6 MAC transmission using MAC service class 1 or 2 (round
17、-trip delayed confirmation).18 Figure 7 Example for transmission of a MAC PDU with 1 repetition using MAC service class 1 or 2 .27 Figure 8 Time-sequence chart for (error-free) routing repeater procedure 28 Figure 9 MAC startup state diagram .30 Figure 10 Initiator MAC state diagram 31 Figure 11 Non
18、-initiator MAC state diagram.34 Table 1 MAC domain IDs24 Table 2 MAC node IDs .24 Table 3 MAC predefined addresses24 Table 4 Mapping to IEC 61334-4-1 predefined MAC addresses25 Table 5 MAC startup state table .31 Table 6 MAC startup state description31 Table 7 Initiator MAC state table 32 Table 8 In
19、itiator MAC state description.32 Table 9 Initiator MAC procedures .33 Table 10 Initiator MAC variables 33 Table 11 Initiator MAC conditions.33 Table 12 Non-initiator MAC state table.34 Table 13 Non-initiator MAC state description36 Table 14 Non-initiator MAC procedures36 Table 15 Non-initiator MAC v
20、ariables .37 Table 16 Non-initiator MAC conditions .37 1002:4543316STCEIDD 2002lirpA52ISB 3 DDIECTS6133454:2001 BSI25April2002 3INTERNATIONAL ELECTROTECHNICAL COMMISSION _ DISTRIBUTION AUTOMATION USING DISTRIBUTION LINE CARRIER SYSTEMS Part 5-4: Lower layer profiles Multi-carrier modulation (MCM) pr
21、ofile FOREWORD 1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-operation on all questions concerning standardizat
22、ion in the electrical and electronic fields. To this end and in addition to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. I
23、nternational, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2)
24、 The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested National Committees. 3) The documents produced have the form of rec
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