BS DD IEC PAS 61249-3-1-2007 Materials for printed boards and other interconnecting structures - Copper-clad laminates for flexible boards (adhesive and non-adhesive types)《印制板和其他互.pdf

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1、 g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58structures Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)ICS

2、 31.180Materials for printed boards and other interconnecting DRAFT FOR DEVELOPMENTDD IEC/PAS 61249-3-1:2007DD IEC/PAS 61249-3-1:2007This Draft for Development was published under the authority of the Standards Policy and Strategy Committee on 31 October 2007 BSI 2007ISBN 978 0 580 59472 4of the PAS

3、 should be extended for a further 3 years or what other action should be taken and pass their comments on to the relevant international committee.Observations which it is felt should receive attention before the official call for comments will be welcomed. These should be sent to the Secretary of th

4、e responsible BSI Technical Committee at British Standards House, 389 Chiswick High Road, London W4 4AL.The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology.A list of organizations represented on this committee can be obtained on reques

5、t to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Amendments issued since publicationAmd. No. Date Commentsstandard, but made available to the public and established in an organization operati

6、ng under a given procedure.A review of this Draft for Development will be carried out not later than 3 years after its publication.Notification of the start of the review period, with a request for the submission of comments from users of this Draft for Development, will be made in an announcement i

7、n the appropriate issue of Update Standards. According to the replies received, the responsible BSI Committee will judge whether the validity National forewordThis Draft for Development is the UK implementation of IEC/PAS 61249-3-1:2007.This publication is not to be regarded as a British Standard.It

8、 is being issued in the Draft for Development series of publications and is of a provisional nature. It should be applied on this provisional basis, so that information and experience of its practical application can be obtained.A PAS is a Technical Specification not fulfilling the requirements for

9、a PUBLICLY AVAILABLE SPECIFICATION IECPAS 61249-3-1Pre-Standard First edition2007-05Materials for printed boards and other interconnecting structures Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types) Reference number IEC/PAS 61249-3-1:2007(E) DD IEC/PAS 61249-3-1:

10、2007CONTENTS 1 Scope 4 2 Normative references .4 3 Terms and definitions4 4 Designation of copper-clad laminates4 4.1 Copper-clad laminate5 4.2 Base materials5 4.3 Thickness of the base material5 4.4 Types of adhesives.6 4.5 Thickness of base materials and adhesives.6 4.6 Type of copper foil 7 4.7 G

11、rade of copper foil7 4.8 Copper-foil thickness 7 4.9 Types of profiles 8 4.10 Surface treatment to increase copper adhesivity and anti-rust .8 4.11 Symbol for flammability.8 5 Observation8 5.1 Base film 8 5.2 Copper foil .9 5.3 CCL .9 6 Size .10 6.1 Base film 10 6.1.1 Thickness and its allowance.10

12、6.2 Copper foil .10 6.2.1 Thickness and its allowance.10 6.3 Adhesives 11 6.3.1 Adhesives11 6.4 Copper-clad laminates 11 6.4.1 Thickness and its allowance.11 6.4.2 Sheet dimension and its allowance.11 6.4.3 Role dimension and its allowance.11 7 Properties 11 7.1 Base film 11 7.2 Copper foil .13 7.3

13、CCL .15 8 Package and labelling.23 Annex A (normative) Roughness test.24 Annex B (normative) Dimensional stability test 25 Appendix.28 Figure B.1 Test pattern for the dimensional stability test 25 Table 1 Copper-clad laminates5 Table 2 Base materials .5 Table 3 Thickness of base material .6 Table 4

14、Adhesives 6 DD IEC/PAS 61249-3-1:2007 2 Table 5 Thickness of adhesives 7 Table 6 Grade of copper foil7 Table 7 Thickness of copper foil (Types E and R) 8 Table 8 Types of profiles.8 Table 9 Appearance of CCL 9 Table 10 Thickness and its allowance of base film.10 Table 11 Thickness and its allowance

15、of copper foil (Types E and R) .10 Table 12 Thickness and its allowance of adhesives .11 Table 13 Properties of polyimide film.12 Table 14 Properties of copper foil (type E) 13 Table 15 Properties of copper foil (type R) 14 Table 16 Properties of CCL Adhesive type (three layers)/polyimide film base

16、.15 Table 17 Properties of CCL Non-adhesive type (two layers)/polyimide film base + copper foil (casting) 17 Table 18 Properties of CCL Non-adhesive type (two layers)/polyimide film base + copper foil (sputter/plating) .19 Table 19 Properties of CCL Non-adhesive type (two layers)/polyimide film base

17、 + copper foil (laminate) 21 DD IEC/PAS 61249-3-1:2007 3 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES Part 3-1: Copper-clad laminates for flexible boards (Adhesive and non-adhesive types) 1 Scope This PAS specifies the properties of copper-clad laminates used for flexible boards

18、 for both adhesive and non-adhesive types. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amen

19、dments) applies. JPCA-TD01, Terms and definition for printed circuits JIS C 5603, Terms and definition for printed circuits JIS C 6471, Test methods of copper-clad laminates for flexible printed wiring boards JIS C 6472, Copper-clad laminates for flexible printed wiring boards (Polymer film, Polyimi

20、de film) JIS C 6515, Copper foil for printed wiring boards IEC 60194, Printed board design, manufacture and assembly Terms and definitions IPC-4204, Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry ASTM D149, Standard Test Method for Dielectric Breakdown Voltage a

21、nd Dielectric Strength of Solid Electrical Insulating Materials at Commercial Power Frequencies ASTM D150, Standard Test Methods for AC Loss Characteristics and Permittivity (Dielectric Constant) of Solid Electrical Insulation ASTM D882, Standard Test Method for Tensile Properties of Thin Plastic Sh

22、eeting 3 Terms and definitions For the purposes of this document, the following terms and definitions, as well as those mentioned in IEC 60194, JIS C 5603 and JPCA-TD01, apply. 3.1 machine direction (MD) longitudinal direction in production of film, copper foil, and copper-clad laminate 3.2 transver

23、se direction (TD) transverse direction in production of film, copper foil, and copper-clad laminate 4 Designation of copper-clad laminates The designation of types of laminates shall be made in the following way. Constituent designations are connected by hyphens. DD IEC/PAS 61249-3-1:2007 4 (3.1) (3

24、.2) (3.4) (3.6) (3.9) (3.11)(3.3) (3.5) (3.7) (3.10) (3.8) Example: ADF - E6 - TA - E1/12/12 - V1 - F 4.1 Copper-clad laminate The symbol to show the types of flexible printed wiring boards (hereinafter called CCL) shall be as given in Table 1. Table 1 Copper-clad laminates Symbol Copper-clad lamina

25、te ADF Adhesive type (3-layer) CCL ALF Non-adhesive type (2-layer) CCL 4.2 Base materials The symbol to designate the base material shall be as given in Table 2. Table 2 Base materials Symbol Base material E Polyimide B Polyethylene telephthalate (PET) A Polyvinyl fluoride (PVF） C Ethylene fluoride-

26、propylene copolymer (FEP） D Polytetra fluoroethylene (PTFE） F Aramid G Polyamide-imide H Epoxy J Polyether imide K PolysulfoneL Polyethylene naphthalate (PEN） M Liquid crystal polymer (LCP) X Others 4.3 Thickness of the base material The symbol to designate the thickness of base material shall be as

27、 given in Table 3. Symbol for identifying copper-clad laminate Symbol for base material and its thickness Symbol for adhesive and its thickness Symbol for type and grade of copper-foil and thickness Symbol for flammabilitySymbol for profile and treatment DD IEC/PAS 61249-3-1:2007 5 Table 3 Thickness

28、 of base material 4.4 Types of adhesives The symbol to designate the adhesive shall be as given in Table 4. Table 4 Adhesives Symbol Adhesive L Epoxy resin M Acrylate N Polyester O No adhesive P Butyl phenolR Ethylene fluoridepropylene copolymer (FEP) S Nitrile phenol T PolyimideU Polyether W Perflu

29、oroalkoxy (PFA) Y Cyanate ester X Other thickness 4.5 Thickness of base materials and adhesives The symbol to designate the thickness of base material and adhesives shall be as given in Table 5. Symbol Thickness of base material m 0 No base material 1 25 2 50 3 75 4 100 5 125 6 12,5 7 38 8 17,5 9 10

30、 10 7,5 11 20 12 40 X Other thickness NOTE A thickness of 15 m is an example of another thickness. DD IEC/PAS 61249-3-1:2007 6 Table 5 Thickness of adhesives Symbol Thickness of adhesive m O No adhesiveA 2,5 B 5C 7,5 D 10 E 13 F 15 H 18 J 20 K 23 L 40 M 25 X Other thickness 4.6 Type of copper foil T

31、he symbol to designate the type of copper foil shall be as follows. Type E: Electrodeposited copper foil Type R: Rolled copper foil Type O: Other type 4.7 Grade of copper foil The symbol to designate the grade of copper foil shall be as given in Table 6. A slash shall be used between the symbols of

32、grade and the thickness of the copper foil. Table 6 Grade of copper foil Symbol Type of copper foil E1 Standard electrodeposited copper foil E2 High-ductility electrodeposited copper foil E3 High temperature elongation electrodeposited copper foil R1 As-rolled wrought copper foil R2 Light cold-rolle

33、d wrought copper foil R3 Annealed wrought copper foil O Copper foil made by means other than rolling or electrolysis 4.8 Copper-foil thickness The symbol to designate the thickness of copper foil shall be as given in Table 7. The thicknesses of the copper foils on both surfaces of a base (double-sid

34、ed laminate) are expressed by two numbers separated by a slash. The thickness of copper foil of single-sided laminate is expressed with “0” after the slash. In the case of double-sided CCL with different copper foil thickness on both sides of the laminate, the thicker copper foil thickness shall be

35、stated first in front of the slash. The designation for type O is to be agreed upon between the supplier and the user. DD IEC/PAS 61249-3-1:2007 7 Table 7 Thickness of copper foil (Types E and R) Symbol Nominal thickness Mass designation g/m2Less than 5 Less than 5 To be agreed upon between the supp

36、lier and the user 9 9 76 12 12 107 18 18 152 25 25 230 35 35 305 50 50 445 70 70 610 4.9 Types of profiles The symbol to designate the profile of copper foil to increase the adhesivity of the copper surface shall be as given in Table 8. Table 8 Types of profiles Designation Type Ten-point height of

37、roughness profile (Rz) m Standard Less than 14* Flatter than (low profile) Less than 10 Flatter than L (very low profile) Less than 5 Flatter than Z (ultra low profile) Less than 2,5 * Applicable range: Thickness of less than 70 NOTE The measurement of the surface roughness is made by a stylus instr

38、ument. Use of an optical laser surface measurement is based on agreement between the user and the suppler. 4.10 Surface treatment to increase copper adhesivity and anti-rust The surface treatment for the purpose of increasing copper adhesivity and for anti-rusting may be applied on either both sides

39、 or a single side of the CCL. The symbol for the surface treatment shall be as follows. 0. No surface treatment for adhesivity increase, but both surfaces treated for anti-rusting. 1. Surface treatment for adhesivity increase on one surface, and treated for anti-rusting on both sides. 2. Surface tre

40、atment for adhesivity increase on both surfaces, and also treated for anti-rusting on both sides. 4.11 Symbol for flammability An English capital letter “F” shall be designated when CCL complies the requirement of flammability stated in 6.3 (properties of CCL). 5 Observation 5.1 Base film There shal

41、l be no break, hole, or wrinkle by folding in base film. There shall not be any defect that is harmful for the performance of CCL such as scratch, dent, surface damage, or any contamination. DD IEC/PAS 61249-3-1:2007 8 5.2 Copper foil The surface appearance shall comply with JIS C 6515, Clause 9. Th

42、e surface condition for type O shall be agreed upon between the user and the supplier. 5.3 CCL The appearance of the CCL shall comply with Table 9. Table 9 Appearance of CCL Appearance General purpose High-quality products (1) No swell nor wrinkle (2) Corrosion product, discoloration, or adhered for

43、eign substance on the surface shall be easily removed using diluted chloric acid of 1 mol/dm, or other appropriate solvent (3) There shall be no harmful scratches that may affect the performance of CCL (4) The number of pinholes with a diameter larger than 0,10 mm but smaller than 0,25 mm in the are

44、a specified in JIS C 6471, 6.1.2, shall be less than one. There shall be no pin hole with a diameter larger than 0,25 mm. The number of pinholes with a diameter smaller than 0,10 mm shall be agreed between user and supplier (4) The number of pinholes with a diameter larger than 0,10 mm but smaller t

45、han 0,15 mm in the area specified in JIS C 6471, 6.1.2, shall be less than one. There shall be no pin hole with a diameter larger than 0,15mm. The number of pinholes with a diameter smaller than 0,10mm shall be agreed between user and supplier (5) The dents in the area specified in JIS C 6471, 6.1.2

46、, are evaluated by the total points for dents according to the following table. The total points for dents shall be no greater than 35. The dents smaller than 0,25 mm shall be agreed between user and supplier (5) The dents in the area specified in JIS C 6471, 6.1.2, are evaluated by the total points

47、 for dents according to the following table. The total points for dents shall be no greater than 25. There shall be no dent with a diameter larger than 1,00 mm. The dents smaller than 0,10 mm shall be agreed between user and supplier Maximum diameter of dent and points Maximum diameter of dent and p

48、oints Maximum diameter of dent mm Point Maximum diameter of dent mm Point 0,25 0,50 2 0,10 0,25 1 0,50 0,75 4 0,25 0,50 2 0,75 1,00 7 0,50 0,75 4 Copper-foil surface 1,00 30 0,75 1,00 20 Base film surface The surface shall be flat, and there shall be no swell, crack, or foreign substance that affects the performance of the material, dirt, dust, colour non-uniformity, cut, unevenness, or striped pattern Copper foil removed surface There shall be no harmful cut, void, colour non-uniformity, nor striped pattern. Copper particles, foreign substances, and dust shall easily be removed by dilu