BS CECC 23600-801-1998 Harmonized system of quality assessment for electronic components - Capability detail specification flex-rigid multilayer printed boards with through connect.pdf

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1、BRITISH STANDARD BS CECC 23600-801: 1998 Harmonized system of quality assessment for electronic components Capability detail specification: Flex-rigid multilayer printed boards with through connections ICS 31.180BSCECC 23600-801:1998 This British Standard, having been prepared under the directionof

2、the Electrotechnical Sector Board, was published underthe authority of the Standards Board and comes intoeffect on 15June1998 BSI 05-1999 ISBN 0 580 29890 6 National foreword This British Standard is the English language version of CECC23600-801:1998 published by the European Eelectronic Components

3、Committee (CECC) of the European Committee for Electrotechnical Standardization (CENELEC). This standard should be read in conjunction with the most recent editions of BSEN123000 and BSEN123600. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly

4、 technology, which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments an

5、d promulgate them in the UK. A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under

6、 the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct app

7、lication. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, theCECC title page, pages 2 to 19 and a back cover. This standard has been updated (see copyright dat

8、e) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No. Date CommentsBSCECC 23600-801:1998 BSI 05-1999 i Contents Page National foreword Inside front cover Foreword 2 Text of CECC 23 600-801 3i

9、i blankDETAIL SPECIFICATION SPCIFICATION PARTICULIRE BAUARTSPEZIFIKATION CECC 23 600-801 February 1998 English version Capability Detail Specification: Flex-rigid multilayer printed boards with through connections Spcification particulire dAgrment: Cartes imprimes multicouches flexorigides avec conn

10、exions transversales Bauartspezifikation zur Anerkennung der Befhigung: Starr-flexible Mehrlagen-Leiterplatten mit Durchverbindungen This Capability Detail Specification was approved on1997-08-06. Up-to-date lists and bibliographical references of other detail specifications relating to EN123000:199

11、1 and EN123600:1996 may be obtained on application to the Central Secretariat or to any CENELEC member. This CECC Detail Specification exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into it

12、s own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway,

13、Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1998 CENELEC All rights o

14、f exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. CECC 23 600-801:1998 ECECC 23 600-801:1998 BSI 05-1999 2 Foreword This Capability Detail Specification has been prepared by CENELEC/TC CECC/SC52, Printed Boards (formerly designated CECC Working Group23). It

15、 was approved as CECC 23600-801 on1997-08-06. It should be read in conjunction with EN123000:1991 and EN123600:1996 and with the current regulations for the CECC System. Contents Page Foreword 2 1 General 3 1.1 Scope 3 1.2 Object 3 2 Capability qualifying component 3 2.1 Materials 3 2.2 Surface fini

16、shes 4 2.2.1 Metallic finishes 4 2.2.1.1 Accelerated ageing 4 2.2.2 Organic finishes 4 2.3 Variant designation 5 3 Capability approval 5 3.1 Range of capability approval 5 3.2 QPL information 5 4 Capability test programme 5 4.1 Capability demonstration 5 4.1.1 Other metallic surface finishes 5 4.1.2

17、 Organic surface finishes 6 5 Additional capability 6 6 Traceability 6 Annex A Edge connector imperfections 18 Annex B Circumferential defects in plated-through holes 19 Table I Capability approval test schedule 7 Table IIa Additional metallic conductor finishes 12 Table lIb Additional contact finis

18、hes 15 Table III Permanent organic finishes 16CECC 23 600-801:1998 BSI 05-1999 3 1 General 1.1 Scope This Capability Detail Specification (CapDS) is based upon EN123600. It relates to flex-rigid multilayer printed boards with through connections, made with materials and surface finishes as specified

19、 in clause2. 1.2 Object To specify the Capability Qualifying Component (CQC), its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and extended capability. 2 Capability Qualifying Component (CQC) Test boards to be used

20、 as CQCs for basic capability shall: be made from a combination of the materials specified in 2.1 of this CapDS. The construction shall be as given in 8.3 of EN123600. bear the composite test pattern (CTP) specified in 8.3 of EN123600 (or equivalent CTP), for basic and other metallic finishes. CTPs

21、as specified in 8.2 of EN123200 (or equivalent CTP) shall be used to demonstrate organic surface finishes and external bonded heat sinks. have one of the surface finishes specified by groups11, 12, 13, 14, 15, 16, or18 in 2.2 of this CapDS. Requirements for test boards to be used as modified CQCs fo

22、r the demonstration of additional capability are detailed in clause5 of this CapDS. 2.1 Materials Material group designation Specification Base Material Base material (thickness range) Cu thickness Type Grade (4m) A EN 60249-2-11 Epoxide woven glass General purpose 0,05 0,8mm 18, 35 70, 105 EN 60249

23、-2-12 Epoxide woven glass Defined flammability $ 0,05mm EN 60249-3-1G Prepreg General purpose EN 60249-3-1GF Prepreg Defined flammability $ 0,05mm n.a. B EN 60249-2-8 Polyester (PETP) film General Purpose 12,5 125 4m EN 60249-2-13 Polyimide film General purpose 12,5 125 4m 18, 35, 70 EN 60249-2-15 P

24、olyimide film Defined flammability 12,5 125 4mCECC 23 600-801:1998 4 BSI 05-1999 2.2 Surface finishes 2.2.1 Metallic finishes The demonstration of metallic group finishes21, 22, 23 or 24 shall be combined with a finish from groups11, 12, 13, 14, 15, 16 or18. Each claimed combination of metallic fini

25、shes shall be tested separately. Selective and non-selective finishes of the same material, where claimed, shall be demonstrated separately. 2.2.1.1 Accelerated ageing The ability of finish groups11, 12, 13, 14, 15, 16 or18 to solder after extended or adverse storage conditions is demonstrated using

26、 accelerated ageing. This test shall be carried out on those finishes where accelerated ageing is claimed. Each finish that has complied with the requirements of the ageing test is highlighted by the inclusion of an asterisk (*) adjacent to that finish in the manufacturers abstract of capability as

27、published in the QPL. 2.2.2 Organic finishes (where claimed) The demonstration of organic finish groupsa, b, c,d, e, f org shall be over a finish from groups11, 12, 13, 14, 15, 16, or18. All claimed types of solder resist shall be tested separately. Finish group Designation Surface finish Abbreviati

28、on for QPL Remarks 11 Bare copper Cu 12 Copper with solderable organic protective coating Cu(opc) 13 Copper with oxide Cu(CuO) 14 Tin, Tin-Lead Sn, SnPb 15 Tin-Lead (fused) SnPb(f) 16 Tin-Lead (dipped and levelled) SnPb(dl) 17 not assigned 18 Immersion Gold over Electroless Nickel AuNi(smt) 19 not a

29、ssigned 20 not assigned 21 Specimen K 5 4m, gold plated on copper, remainder using finish group 1117 (see below) 5AuCu 22 Specimen K 0,7 4m, gold plated on nickel, remainder using finish group 1117 (see below) 0,7AuNi 23 Specimen K2,5 4m, gold plated on copper, remainder using finish group 1117 (see

30、 below) 2,5AuCu 24 Specimen K2,5 4m, gold plated on nickel, remainder using finish group 1117 (see below) 2,5AuNi Finish group designation Organic finish Abbreviation for QPL a Adhesive Coated film coverlayer AFC b Dry film solder mask DSM c Wet resist solder mask/coverlayer WSM d Liquid photopolyme

31、r solder mask LSM e Liquid Photopolymer coverlayer LPC f Marking inks MI g Conductive Ink CICECC 23 600-801:1998 BSI 05-1999 5 2.3 Variant designation The combination of any material group designated in 2.1 and any of the surface finishes designated in 2.2 constitutes a variant. The variant is desig

32、nated by the combination of both material and finish group designations. e.g. A12(b) or A12/21(c). 3 Capability approval 3.1 Range of capability approval Capability approval granted on the testing of one variant is valid within the limits specified in 3.7 of EN123000 for metal clad base material wit

33、hin one group designation, all base material thicknesses and all foil thicknesses of the material in accordance with 2.1 of this CapDS; and all metallic surface finishes within one surface finish group as given in 2.2.1 of this CapDS, that is 3.2 QPL information Information for the QPL (published as

34、 CECC00200) shall be given in accordance with 3.4 of EN123000, and shall contain the following details relative to the CapDS: 4 Capability test programme NOTEIn all cases the number of failures permitted is zero. 4.1 Capability demonstration Capability shall be demonstrated using 9CTPs, of one varia

35、nt from each material group claimed. Testing shall be in accordance with Table I. 4.1.1 Other metallic surface finishes If claimed, other metallic surface finishes, as designated in 2.2.1 shall be demonstrated by the manufacture and testing of 3CTPs plus sufficient extra A and H specimens to meet th

36、e requirements of Table II. The maximum active board size for the finish shall be demonstrated. See also clause5. finish group 11 covers finish group 11 only finish group 12 covers finish group 11 and 12 finish group 13 covers finish group 11 and 13 finish group 14 covers finish group 11 and 14 fini

37、sh group 15 covers finish group 11 and 15 finish group 16 covers finish group 11 and 16 finish group 18 covers finish group 18 only finish group 21 covers finish group 21 only finish group 22 covers finish group 22 and 24 finish group 23 covers finish group 21 and 23 finish group 24 covers finish gr

38、oup 24 only w reference to the CECC Generic Specification EN 123000 w reference to the CECC Sectional Specification EN 123600 w reference to the CECC CapDS CECC 23 600-801 w base material for which approval is granted as given in 2.1 of this CapDS w the surface finishes for which approval is granted

39、 as given in 2.2 of this CapDS w any additional capability 3.5.3 of EN123000 refersCECC 23 600-801:1998 6 BSI 05-1999 4.1.2 Organic surface finishes Each claimed organic surface finish, as designated in 2.2.2, shall be demonstrated by the manufacture and testing of 3CTPs using the pattern specified

40、in Annex A (marking inks) or Annex B (solder masks) of CECC23200-801. Testing shall be in accordance with Table III of this CapDS. 5 Additional capability 6 Traceability Traceability of all specimens to the original product shall be maintained. The method used to identify individual test specimens s

41、hall not prejudice the test result. Maximum active board size see 8.3 of EN123000 Minimum conductor width and spacing Specimen F of the CTP to be modified to provide additionally 5 conductors and 4 spacings, each of the claimed minimum. Initial foil thickness of less than 35 4m may be used for this

42、demonstration, but the thickness used shall be declared. Metallic conductor finishes Manufacturers are permitted to demonstrate conductor finishes other than those detailed in 2.2.1. The finish shall be demonstrated in accordance with Table IIa and detailed in the manufacturers Capability Manual.CEC

43、C 23 600-801:1998 BSI 05-1999 7 Table I Capability approval test schedule Characteristics Test No. IEC60326-2 Specimen of Composite Test Pattern Requirements Remarks General examination Visual examination Conformity and identification 1 All CQCs Pattern, marking, identification, material and finishe

44、s shall comply with this CapDS. There shall be no apparent defects. Any identification for traceability purposes shall be verified. Appearance and workmanship 1a All CQCs The boards shall appear to have been processed in a careful and workmanlike manner, in accordance with good current practice. The

45、 base materials, conductors, surface finishes shall be of uniform appearance and free from cracks, burns, pits, nodules and blisters. Metallic surface finishes shall be free from scratches which penetrate to an underlying surface. Plated-through holes All CQCs Plated-through holes shall be clean and

46、 free from inclusions of any sort that could affect component insertion and solderability, Total area of the voids shall not exceed 10 % of the total wall area. The largest dimension shall not exceed 25 % of the hole circumference in the horizontal plane and 25 % of the thickness of the board in the

47、 vertical plane. Plated-through holes shall have no plating voids at the interface of the hole wall and the conductive pattern or internal layer ring. The interface shall be considered to extend into the hole below the surface of the board a distance of 1,5times the total copper thickness on the sur

48、face or to be two times the inner layer thickness at the level of contact ring. See Annex B 1c Resin smear at the edge of the clad copper and the continuous plated copper is permitted provided the smear does not interrupt electrical continuity. 1a There shall be no circumferential cracks of the copp

49、er, or circumferential separation of the copper from the wall of the plated-through hole Holes with plating voids shall not exceed 5 % of the total number of plated-through holes Board edges All CQCs The edges of the board and internal cut-outs shall be clean cut without tears or nicks Eyelets All CQCs Eyelets shall be firmly secured. Plated eyelets shall not have exposed bare metal. Eyelets shall not have cracked flanges. There shall be no damage to conductors or substrate around the eyelet. Bonding Conductor to substrate 1a All CQCs T