BS CECC 23300-801-1998 Harmonized system of quality assessment for electronic components - Capability detail specification multi-layer printed boards《电子元器件用质量评估协调体系 性能详细规范 多层印刷电路板》.pdf

《BS CECC 23300-801-1998 Harmonized system of quality assessment for electronic components - Capability detail specification multi-layer printed boards《电子元器件用质量评估协调体系 性能详细规范 多层印刷电路板》.pdf》由会员分享，可在线阅读，更多相关《BS CECC 23300-801-1998 Harmonized system of quality assessment for electronic components - Capability detail specification multi-layer printed boards《电子元器件用质量评估协调体系 性能详细规范 多层印刷电路板》.pdf（34页珍藏版）》请在麦多课文档分享上搜索。

1、BRITISH STANDARD BS CECC 23300-801:1998 Harmonized system of quality assessment for electronic components Capability detail specification: Multi-layer printed boards ICS 31.180BS CECC23300-801:1998 This British Standard, having been prepared under the direction of the Electrotechnical Sector Board,

2、was published under the authority of the Standards Board and comes into effect on 15June1998 BSI 06-1999 ISBN 0 580 29891 4 National foreword This British Standard is the English language version of CECC23300-801:1998 published by the European Electronic Components Committee (CECC) of the European C

3、ommittee for Electrotechnical Standardization (CENELEC). It supersedes BS EN123300-800:1992 which is withdrawn. This standard should be read in conjunction with the most recent editions of BS EN123000 and BS EN123300. The UK participation in its preparation was entrusted to Technical Committee EPL/5

4、01, Electronic assembly technology, which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and E

5、uropean developments and promulgate them in the UK. A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI St

6、andards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsibl

7、e for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, the CECC title page, pages2 to28 and a back cover. This standard has been upda

8、ted (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No. Date CommentsBS CECC23300-801:1998 BSI 06-1999 i Contents Page National foreword Inside front cover Foreword 2 Text

9、 of CECC 23 300-801 3ii blankDETAIL SPECIFICATION SPCIFICATION PARTICULIRE BAUARTSPEZIFIKATION CECC 23 300-801 February 1998 Supersedes EN 123300-800:1992 English version Capability Detail Specification: Multi-layer printed boards Spcification particulire dAgrment: Cartes imprimes multicouches Bauar

10、tspezifikation zur Anerkennung der Befhigung: Mehrlagen-Leiterplatten This CECC Detail Specification was approved on 1997-08-06. Up-to-date lists and bibliographical references of other detail specifications relating to EN123000:1991 and EN123300:1992may be obtained on application to the Central Sec

11、retariat or to any CENELEC member. This CECC Detail Specification exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same s

12、tatus as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC Euro

13、pean Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1998 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CE

14、NELEC members. Ref. No. CECC 23 300-801:1998 ECECC23 300-801:1998 BSI 06-1999 2 Foreword This Capability Detail Specification has been prepared by CENELEC/TC CECC/SC52, Printed Boards (formerly designated CECC Working Group 23). It was approved as CECC23 300-801 on1997-08-06. This Capability Detail

15、Specification replaces EN123300-800:1992. It should be read in conjunction with EN123000:1991 and EN123300:1992 and with the current regulations for the CECC System. Contents Page Foreword 2 1 General 3 1.1 Scope 3 1.2 Object 3 2 Capability qualifying component 3 2.1 Materials 3 2.2 Surface finishes

16、 4 2.2.1 Metallic finishes 4 2.2.1.1 Accelerated ageing 4 2.2.2 Organic finishes 4 2.3 Variant designation 4 3 Capability approval 5 3.1 Range of capability approval 5 3.2 QPL information 5 4 Capability test programme 5 4.1 Capability demonstration 5 4.1.1 Other metallic surface finishes 5 4.1.2 Org

17、anic surface finishes 5 4.1.3 External bonded heatsinks 5 4.1.4 Demonstration of impedance control 5 5 Additional capability 6 6 Traceability 6 Annex A Suitable test pattern for marking inks 18 Annex B Suitable test pattern for solder masks 19 Annex C Suitable test pattern for bonded heatsinks 20 An

18、nex D Edge connector imperfections 21 Annex E CTP subdivision for thermal shock 22 Annex F Circumferential defects in plated-through holes 22 Page Annex G Determination of characteristic impedance by TDR 23 Figure G.1 Possible Equipment Configuration(seeG.4.2) 26 Figure G.2 Schematic showing undistu

19、rbedinterval (seeG.4.3) 26 Figure G.3 Schematic showing undisturbedinterval; in situ method (seeG.4.3) 27 Figure G.4 Incident Wave Voltage showing(2x)Air Line delay (seeG.4.3) 27 Figure G.5 Test specimen details (seeG.4.4.2) 28 Table I Capability approval test schedule 6 Table IIa Additional metalli

20、c conductor finishes 11 Table IIb Additional contact finishes 14 Table III Permanent organic finishes 15 Table IV Bonded heatsinks 16CECC23300-801:1998 BSI 06-1999 3 1 General 1.1 Scope This Capability Detail Specification (CapDS) is based upon EN123300. It relates to rigid multilayer printed boards

21、, made with materials and surface finishes as specified inclause2. 1.2 Object To specify the Capability Qualifying Component (CQC), its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and extended capability. 2 Capabi

22、lity Qualifying Component (CQC) Test boards to be used as CQCs for basic capability shall: be made from a combination of the materials specified in2.1 of this CapDS. The construction shall be as given in8.3 of EN123300. bear the composite test pattern (CTP) specified in 8.2 of EN123300 (or equivalen

23、t CTP), for basic and other metallic finishes. CTPs as specified in 8.2 of EN123200 (or equivalent CTP) shall be used to demonstrate organic surface finishes and external bonded heat sinks. have one of the surface finishes specified by groups11, 12, 13, 14, 15, 16, or 18 in2.2 of this CapDS. Require

24、ments for test boards to be used as modified CQCs for the demonstration of additional capability are detailed inclause5 of this CapDS. 2.1 Materials Material Group designation Specification Base Material Base material thickness range Cu thickness Type Grade (mm) (4m) A EN 60249-2-11 Epoxide WovenGla

25、ss General purpose 18, 35, 0,05 0,8 70, 105 EN 60249-2-12 Epoxide WovenGlass Defined flammability EN 60249-3-1G Pre-preg General purpose EN 60249-3-1GF Pre-preg Defined flammability $ 0,05 n.a.CECC23300-801:1998 4 BSI 06-1999 2.2 Surface finishes 2.2.1 Metallic finishes The demonstration of metallic

26、 group finishes21, 22, 23 or24 shall be combined with a finish from groups11, 12, 13, 14, 15, 16 or 18. Each claimed combination of metallic finishes shall be tested separately. Selective and non-selective finishes of the same material, where claimed, must be demonstrated separately. 2.2.1.1 Acceler

27、ated ageing The ability of finish groups11, 12, 13, 14, 15, 16 or 18 to solder after extended or adverse storage conditions is demonstrated using accelerated ageing. This test shall be carried out on those finishes where accelerated ageing is claimed. Each finish that has complied with the requireme

28、nts of the ageing test is highlighted by the inclusion of an asterisk (*) adjacent to that finish in the manufacturers abstract of capability as published in the QPL. 2.2.2 Organic finishes (where claimed) The demonstration of organic finish groupsa, b, c or d shall be over a finish from groups11, 1

29、2, 13, 14, 15, 16 or 18. All claimed types of solder resist shall be tested separately. 2.3 Variant designation The combination of any material group designated in2.1 and any of the surface finishes designated in2.2 constitutes a variant. The variant is designated by the combination of both material

30、 and finish group designations, e.g. A12(b) or A12/21(c). Finish group Designation Surface finish Abbreviation for QPL Remarks 11 Bare copper Cu 12 Copper with solderable organic protective coating Cu(opc) 13 Copper with oxide Cu(CuO) 14 Tin, Tin-Lead Sn, SnPb 15 Tin-Lead (fused) SnPb(f) 16 Tin-Lead

31、 (dipped and levelled) SnPb(dl) 17 not assigned 18 Immersion Gold over Electroless Nickel AuNi(smt) 19 not assigned 20 not assigned 21 Specimen K 5 4m, gold plated on copper, remainder using finish group 1117 (see below) 5AuCu 22 Specimen K 0,7 4m, gold plated on nickel, remainder using finish group

32、 1117 (see below) 0,7AuNi 23 Specimen K 2.,5 4m, gold plated on copper, remainder using finish group 1117 (see below) 2,5AuCu 24 Specimen K 2,5 4m, gold plated on nickel, remainder using finish group 1117 (see below) 2,5AuNi Finish group designation Organic finish Abbreviation for QPL a Dry film sol

33、der mask DSM b Wet resist solder mask WSM c Liquid photopolymer solder mask LSM d Marking ink MI e Conductive ink CICECC23300-801:1998 BSI 06-1999 5 3 Capability approval 3.1 Range of capability approval Capability approval granted on the testing of one variant is valid within the limits specified i

34、n 3.7 of EN123000 for metal clad base material within one group designation, all base material thicknesses and all foil thicknesses of the material in accordance with2.1 of this CapDS; and all metallic surface finishes within one surface finish group as given in2.2.1 of this CapDS, that is: 3.2 QPL

35、information Information for the QPL (published as CECC 00 200) shall be given in accordance with 3.4 of EN123000, and shall contain the following details relative to the CapDS: 4 Capability test programme NOTEIn all cases the number of failures permitted is zero. 4.1 Capability demonstration Capabil

36、ity shall be demonstrated using9 CTPs of one variant from each material group claimed. Testing shall be in accordance withTable I. 4.1.1 Other metallic surface finishes If claimed, other metallic surface finishes, as designated in2.2.1 shall be demonstrated by the manufacture and testing of3 CTPs pl

37、us sufficient extra A and H specimens to meet the requirements ofTable II. The maximum active board size for the finish shall be demonstrated. Seealsoclause5. 4.1.2 Organic surface finishes Each claimed organic surface finish, as designated in2.2.2, shall be demonstrated by the manufacture and testi

38、ng of3 CTPs using the pattern specified inAnnex A (marking inks) orAnnex B (solder masks). Testing shall be in accordance withTable III. 4.1.3 External bonded heatsinks Where claimed, each bonded heatsink and adhesive system shall be demonstrated by the manufacture of three CTPs complying with8.2 of

39、 EN123200 (pth), since it is anticipated that manufacturers will also claim capability to that CapDS. Testing shall be in accordance withTable IV of this CapDS. 4.1.4 Demonstration of impedance control Special CQCs shall be constructed in accordance withFigure G.5, configured as either a “stripline”

40、 or “microstrip”. Demonstrations shall be made for the following variants, as required and defined by the approved manufacturer: each base material type (e.g. woven glass epoxide); finish group 11 finish group 12 finish group 13 finish group 14 finish group 15 finish group 16 finish group 18 finish

41、group 21 finish group 22 finish group 23 finish group 24 Covers finish group 11 only Covers finish group 11 and 12 Covers finish group 11 and 13 Covers finish group 11 and 14 Covers finish group 11 and 15 Covers finish group 11 and 16 Covers finish group 18 only Covers finish group 21 only Covers fi

42、nish group 22 and 24 Covers finish group 21 and 23 Covers finish group 24 only reference to the CECC Generic Specification reference to the CECC Sectional Specification reference to the CECC CapDS base material for which approval is granted the surface finishes for which approval is granted any addi

43、tional capability EN 123000 EN 123300 CECC 23 300-801 as given in 2.1 of this CapDS as given in 2.2 of this CapDS 3.5.3 of EN 123000 refersCECC23300-801:1998 6 BSI 06-1999 each impedance geometry (microstrip, stripline); each impedance extreme, and a 50 7 mandatory demonstration; conductor width and

44、 lateral separation minima; each metallic surface finish. Tolerances at 50 7 and each impedance extreme shall be claimed prior to demonstration, and achieved. For each solder resist type and thickness claimed, impedance value derating factors shall be declared. Impedance control shall be shown on th

45、e Capability Approval certificate as a separate annex. 5 Additional capability 6 Traceability Traceability of all specimens to the original product shall be maintained. The method used to identify individual test specimens shall not prejudice the test result. Table I Capability approval test schedul

46、e Maximum number of layers For boards with more than six layers; the construction shall be equivalent to that given for six layers with thicknesses and tolerances altered in proportion to the number of layers claimed. Maximum active board size see 8.3 of EN 123000 Plated through hole diameters Speci

47、men C (microsection coupon) of CTP employed minimum drilled hole diameter; use 2,0 mm pads minimum clearance diameter; use 2,5 mm pads Maximum aspect ratio Minimum conductor width and spacing Specimen F of the CTP to be modified to provide additionally5conductors and 4 spacings, each of the claimed

48、minimum. Initial foil thickness of less than 35 4m may be used for this demonstration, but the thickness used shall be declared. Metallic conductor finishes Manufacturers are permitted to demonstrate conductor finishes other than those detailed in2.2.1. The finish shall be demonstrated in accordance

49、 with Table IIa and detailed in the manufacturers Capability Manual. (Table I) Characteristics Test No. IEC60326-2 Specimen of Composite Test Pattern Requirements Remarks General examination Visual examination Conformity and identification 1 All CQCs Pattern, marking, identification, material and finishes shall comply with this CapDS. There shall be no apparent defects. Any identification for traceability purposes shall be verified. Appearance and workmanship 1a All CQCs The boards shall appear to ha