BS CECC 123400-003-1994 Specification for harmonized system of quality assessment for electronic components - Capability detail specification flexible printed boards without throug.pdf

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1、BRITISH STANDARD BS CECC 123400-003: 1994 Incorporating Amendment No.1 Specification for Harmonized system of quality assessment for electronic components: Capability detail specification: Flexible printed boards without through-connectionsBSCECC123400-003:1994 This British Standard, having been pre

2、pared under the directionof the Electronic Components Standards PolicyCommittee, was publishedunder the authority ofthe Standards Board and comesinto effect on 15 February1994 BSI09-1999 The following BSI references relate to the work on this standard: Committee reference ECL/19 Draft for comment93/

3、206142 DC ISBN 0 580 22731 6 Committees responsible for this British Standard The preparation of this British Standard was entrusted by the Electronic Components Standards Policy Committee (ECL/-) to Technical Committee ECL/19, upon which the following bodies were represented: British Telecommunicat

4、ions plc EEA (the Association of Electronics, Telecommunications and Business Equipment Industries) Electrical and Electronic Insulation Association (BEAMA Ltd.) Electronic Components Industry Federation GAMBICA (BEAMA Ltd.) Institute of Metal Finishing Ministry of Defence National Supervising Inspe

5、ctorate Printed Circuit Interconnection Federation Surface Mount and Related Technologies (Smart Group) Ltd. Amendments issued since publication Amd. No. Date Comments 9198 December 1996 Indicated by a sideline in the marginBSCECC123400-003:1994 BSI 09-1999 i Contents Page Committees responsible Ins

6、ide front cover Foreword ii 1 General 1 2 Capability qualifying component (CQC) 1 3 Capability approval 3 4 Capability test programme 3 5 Traceability 4 Appendix A Untitled 19 Appendix B Untitled 21 Appendix C Untitled 22 Appendix D Untitled 23 Appendix E Edge connector imperfections 25 Appendix F A

7、dhesion of plating: tape method 25 Appendix G Porosity of platings method of test 26 Appendix H Solvent resistance of organic coatings 27 Appendix J Solder resistance of organic coatings 28 Figure 1a Composite test pattern for flexible printed boards without through connections 19 Figure 1b Detailed

8、 dimensions of specimens shown in Figure 1a 20 Figure 2 Test pattern for marking inks 21 Figure 3 Test pattern for solder mask or coverlayer 22 Figure 4a Assembly of test pattern for rigidizers or stiffeners 23 Figure 4b Component parts of test pattern for rigidizers or stiffeners 24 Table I Capabil

9、ity approval test schedule 5 Table IIa Additional metallic conductor finishes 9 Table IIb Additional contact finishes 12 Table III Permanent organic finishes 13 Table IV Bonded stiffeners and rigidizers 16 List of references Inside back coverBSCECC123400-003:1994 ii BSI 09-1999 Foreword This British

10、 Standard has been prepared under the direction of the Electronic Components Standards Policy Committee. It is a capability detail specification (Cap DS) within the BSCECC system and should be read in conjunction with BS EN123400. It has been produced to reflect the capability level established in t

11、he UnitedKingdom for the supply of printed boards to the defence, computer, communications and similar industries over many years. It is generally equivalent to that defined by BS9000 General requirements for a system for electronic components of assessed quality and, in particular, by BS9761 Sectio

12、nal specification for capability approval of manufacturers of multilayer rigid printed wiring boards of assessed quality with plated through holes. The capability level defined is enhanced compared to that described by BS EN123400-800. In particular capability has been extended to include the follow

13、ing: a) more surface finishes, now split into two groups and referred to the connector area and the remainder of the board respectively; b) more metallic finishes; c) organic finishes used as solder resist; d) marking inks; e) bonded heatsinks; f) accelerated ageing; g) additional capability in the

14、definition of minimum conductors and spacing widths; h) traceability. There is no British Standard equivalent to CECC00010:1980 which comprises a list of the tests in IEC326-2 and its supplement IEC326-2A. A related British Standard to IEC326-2 and its supplements is BS6221-2 and its amendments. Cro

15、ss-references International Standard Corresponding British Standard EN123000:1991 BS EN123000:1992 Harmonized system of quality assessment for electronic components. Generic specification: printed boards (Identical) EN123400:1992 BS EN123400:1992 Harmonized system of quality assessment for electroni

16、c components. Sectional specification: flexible printed boards without through connections (Identical) IEC68 BS2011 Environmental testing (Most Parts are identical) IEC249 BS4584 Metal-clad base materials for printed wiring boards (Most Parts are identical) ISO1463:1982 BS EN ISO1463:1995 Metallic a

17、nd oxide coatings. Measurement of coating thickness. Microscopical method (Identical) ISO3543:1981 BS EN ISO3543:1995 Metallic and non-metallic coatings. Measurement of thickness. Beta backscatter method (Identical)BSCECC123400-003:1994 BSI 09-1999 iii The Technical Committee has reviewed the provis

18、ions of ISO3542:1982, to which reference is made in the text, and has decided that they are acceptable for use in conjunction with this standard. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct ap

19、plication. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pagesi to iv, pages1 to28, an inside back cover and a back cover. This standard has been updated (see copyright date

20、) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover.iv blankBSCECC123400-003:1994 BSI 09-1999 1 1 General 1.1 Scope This Capability Detail Specification is based on BS EN123400. It relates to single and double-sided flexible printed boa

21、rds without through connections made with materials and surface finishes as specified in2. 1.2 Object To specified the Capability qualifying Component “CQC”, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and add

22、itional capability. 2 Capability Qualifying Component (CQC) Test boards to be used as CQCs for basic capability shall be made of one of the copper-clad base materials specified in2.1 of this Cap DS, with a nominal base film thickness of754m Polyester film or504m Polyimide film, clad with354m copper

23、foil on one or both sides. bear the composite test pattern (CTP) specified in Appendix A of this document; have one of the surface finishes specified by groups11,12,13,14,15,16,17 or18 in2.2 of this Capability Detail Specification. Test boards to be used as CQCs for additional capability shall be mo

24、dified to demonstrate the claimed capability see3.5.3 of BS EN123000. 2.1 Materials Materials group designation Specification IEC Material (see footnote) Material thickness range 4m Cu thickness 4m Type Grade A 249-2-8 Polyester film General purpose 12.5.125 18, 35, 70 B 249-2-13 249-2-15 Polyimide

25、film Polyimide film General purpose Defined flammability (vertical) 12.5.125 18, 35, 70 C 249-2-8 Polyester film General purpose 12.5.125 0, 18, 35, 70 D 249-2-13 249-2-15 Polyimide film Polyimide film General purpose Defined flammability (vertical) 12.5.125 0, 18, 35, 70 E 249-2-1 249-2-2 249-2-6 2

26、49-2-7 249-2-14 249-2-3 Phenolic paper Phenolic paper Phenolic paper Phenolic paper Phenolic paper Epoxide paper High electrical Economic Defined flammability (horizontal) Defined flammability (vertical) Economic, Defined flammability (vertical) Defined flammability (vertical) 200.6,400 0, 18, 35, 7

27、0 F 249-2-4 249-2-5 Epoxide woven glass Epoxide woven glass General purpose Defined flammability (vertical) 200.6,400 0, 18, 35, 70 Material group designation A and B cover the base materials for flexible circuits; C and D cover materials for film stiffeners; E and F cover rigid board materials used

28、 for the fabrication of rigidizers.BSCECC123400-003:1994 2 BSI 09-1999 2.2 Surface finishes 2.2.1 Metallic finishes The demonstration of metallic finish group21, 22, 23 or24, if claimed, shall be combined with a finish from group11, 12, 13, 15, 16 or17. 2.2.1.1 Accelerated ageing The ability of fini

29、shes from group11, 12, 13, 14, 15, 16 or17 to solder after extended or adverse storage conditions is demonstrated using accelerated ageing. This test shall be carried out on those finishes where accelerated ageing is claimed. Each finish that has complied with the requirements of the accelerated age

30、ing test is highlighted by the inclusion of an asterisk (*) adjacent to that finish in the manufacturers abstract of capability as published in the QPL. 2.2.2 Organic finishes The demonstration of organic finish group a, b, c, d, or e shall be over one finish from group11, 12, 13, or one from group

31、14, 15, 16, 17 or18. All claimed types of solder mask/coverlayer and marking ink shall be tested separately. Film coverlayers having different adhesive types shall be tested separately. 2.3 Variant designation The combination of any material group designated in2.1 and any of the surface finishes as

32、designated in2.2 constitutes a variant. The variant is designated by the combination of material and finish group designations e.g.A12(b) or A12/21(c). Finish group designation Surface finish Abbreviation for QPL 11 Bare copper Cu 12 Copper with temporary protective coating Cu(tpc) 13 Copper with ox

33、ide Cu(CuO) 14 Tin, tin-lead (as plated) Sn, SnPb 15 Tin-lead (fused) SnPb(f) 16 Tin-lead (dipped and levelled) SnPb(dl) 17 Tin-lead (roller coated) SnPb(rt) 18 Immersion gold over electroless nickel AuNi (Smt) 21 Specimen K54m min. gold plated on copper, remainder using finish group1117 (see below)

34、 5 Au/Cu, Cu, Sn, SnPb 22 Specimen K0.74m min. gold plated on nickel, remainder using finish group1117 (see below) 0.7 Au/Ni Cu, Sn, SnPb 23 Specimen K2.54m min. gold plated on copper, remainder using finish group1117 (see below) 2.5 Au/Cu Cu, Sn, SnPb 24 Specimen K2.54m min. gold plated on nickel,

35、remainder using finish group1117 (see below) 2.5 Au/Ni Cu, Sn, SnPb Finish group designation Organic finish Abbreviation for QPL a Adhesive-coated film coverlayer AFC b Dry film solder mask DSM c Wet resist solder mask/coverlayer WRC d Liquid photopolymer solder mask/coverlayer WPC e Marking inks MI

36、BSCECC123400-003:1994 BSI 09-1999 3 3 Capability Approval 3.1 Range of capability approval Capability approval granted on the testing of one variant is valid within the limits specified in3.7 of BSEN123000 for metal-clad base material within one group designation, all base material thicknesses and a

37、ll foil thicknesses in accordance with2.1 as follows: approval for material group A covers material group A only; approval for material group B covers material groups A and B. all metallic surface finishes within one surface finish group as quoted in2.2.1, that is: finish group11 covers finish group

38、11 only finish group12 covers finish group11 and12 finish group13 covers finish group11 and13 finish group14 covers finish group11 and14 finish group15 covers finish group11 and15 finish group16 covers finish group11 and16 finish group17 covers finish group11 and17 finish group18 covers finish group

39、18 only finish group21 covers finish group21 only finish group22 covers finish group22 and24 finish group23 covers finish group21 and23 finish group24 covers finish group24 only Each organic finish in2.2.2 over a finish from group11,12 or13 covers11, 12 or13 only. Each organic finish in2.2.2 over a

40、finish from group14,15,16 or17 covers11, 12 or13 in addition. 3.2 QPL information The QPL information shall be given in accordance with3.4 of BS EM123000 and shall contain the following details: 4 Capability test programme Each separate process shall be assessed within the test programme. 4.1 Capabi

41、lity demonstration Capability shall be demonstrated by the manufacturer using9 composite test patterns (CTPs) of one variant from each material group claimed. Testing shall be in accordance with Table I. 4.1.1 Other metallic surface finishes If claimed, other metallic surface finishes, as designated

42、 in2.2.1, shall be demonstrated by the manufacture of3 CTPs which include sufficient extra specimens A and H to meet the requirement of Table II. Testing shall be in accordance with Table II. NOTE 1The maximum claimed active board size for the finish shall be demonstrated. NOTE 2Demonstration of met

43、allic surface finishes using materials from group A or group B apply to that group only. reference to the BS EN Generic Specification :123000 reference to the BS EN Sectional Specification :123400 reference to this BS CECC Capability Detail Specification :123400-003 materials for which approval is g

44、ranted as given in2.1 surface finishes for which approval is granted as given in2.2 any additional capability,3.5.3 of BS EN123000 refers.BSCECC123400-003:1994 4 BSI 09-1999 4.1.2 Organic surface finishes Each claimed organic surface finish, as designated in2.2.2, shall be demonstrated by the manufa

45、cture of3CTPs using the pattern in Appendix B for marking inks and Appendix C for coverlayers/solder mask. Testing shall be in accordance with Table III. NOTE 1The maximum claimed active board size for the finish shall be demonstrated. NOTE 2Demonstration of organic surface finishes shall be made on

46、 each material group claimed. 4.1.3 Bonded stiffeners and rigidizers Material for stiffeners shall be selected from material groups C or D, as appropriate far base material groupA or B. Rigidizer materials shall be selected from material groups E and F. Each combination of stiffener and adhesive sys

47、tem and of rigidizer and adhesive system shall be demonstrated by the manufacture of3CTPs using the pattern specified in Appendix D. Testing shall be in accordance with Table IV 5 Traceability Traceability of all test specimens to the original production panel shall be maintained. the method used to

48、 identify individual test specimens shall not affect the test results. BSCECC123400-003:1994 BSI 09-1999 5 Table I Capability approval test schedule Characteristics Test No. CECC 00010 Specimen of Composite test pattern Number of Specimens Test Conditions Requirements/Material Remarks Required Failu

49、res permitted 8 (Polyester) IEC 249-2-13 (Polyimide) 15 (Polyimide) GENERAL EXAMINATION (before subdivision into specimens) Visual inspection Conformity and identification Appearance and workmanship Board edges Bonding conductor to substrate Conductor defects Particles between conductors Edge connector defects11a 1a 1a 1b 1b 2a Complete CQC Complete CQC Complete CQC Complete CQC Complete CQC Complete CQCK All CQCsAll CQCs All CQCs All CQCs All CQCs All CQCs All Specimens 00 0 0 0 0 0 Pattern, material and finishes shall