BS 6221-1-1990 Printed wiring boards - Guide for the specification writer《印制线路板 第1部分 规范编制导则》.pdf

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1、BRITISH STANDARD BS 6221-1: 1990 IEC 326-1: 1984 Printed wiring boards Part 1: Guide for the specification writerBS6221-1:1990 This British Standard, having been prepared under the directionof the Electronic Components Standards PolicyCommittee, was publishedunderthe authorityofthe Board ofBSIandcom

2、es intoeffect on 28February1990 BSI 07-1999 The following BSI references relate to the work on this standard: Committee reference ECL/19 Draft for comment 89/23223 DC ISBN 0 580 18154 5 Committees responsible for this British Standard The preparation of this British Standard was entrusted by the Ele

3、ctronic Components Standards Policy Committee (ECL/-) to Technical Committee ECL/19 upon which the following bodies were represented: British Telecommunications plc Electrical and Electronic Insulation Association (BEAMA Ltd.) Electronic Components Industry Federation Electronic Engineering Associat

4、ion ERA Technology Ltd. GAMBICA (BEAMA Ltd.) Institute of Circuit Technology Institute of Metal Finishing Institution of Production Engineers Ministry of Defence National Supervising Inspectorate Printed Circuit Association Telecommunication Engineering and Manufacturing Association (TEMA) Amendment

5、s issued since publication Amd. No. Date of issue CommentsBS6221-1:1990 BSI 07-1999 i Contents Page Committees responsible Inside front cover National foreword ii 1 Introduction 1 2 Scope 1 3 Object 1 4 Structure of standards and specifications 1 5 Levels of standards and specifications 3 Publicatio

6、ns referred to Inside back coverBS6221-1:1990 ii BSI 07-1999 National foreword This Part of BS6221, prepared under the direction of the Electronic Components Standards Policy Committee, is identical with publication326-1:1984, “Printed Boards, Part1: General information for the specification writer”

7、, published by the International Electrotechnical Commission (IEC). This publication refers to the IEC Quality Assessment System for Electronic Components (IECQ), but makes no reference to the corresponding European System of Quality Assessment or to the British System. Information on these systems

8、may be obtained by reference to BSCECC23000 and BS9760 respectively. IEC 249-2:1970, to which reference has been made in the text, has been withdrawn and replaced by IEC249-2, a new series of specifications published in1988, which are currently being prepared for publication as identical British Sta

9、ndards as Sections of BS4584-102, to be published in1990. IEC 194:1975 to which reference has been made in the text has been revised and reissued as IEC194:1988. It is now subject to harmonization procedures in CENELEC and will depending on the result of these procedures be published as an identical

10、 new Group of British Standard, BS4727-1:Group10. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obli

11、gations. Cross-references International standard Corresponding British Standard IEC 68 BS 2011 Environmental testing (Most Parts are identical) IEC 97:1970 BS 5830:1979 Specification for grid system for printed circuits (Identical) IEC 326 BS 6221: Printed wiring boards (Most Parts are identical) Su

12、mmary of pages This document comprises a front cover, an inside front cover, pages i and ii, pages1 to 6, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on theinside fr

13、ont cover.BS6221-1:1990 BSI 07-1999 1 1 Introduction IEC Publication 326 is applicable to printed boards, irrespective of their method of manufacture, when they are ready for the mounting of the components. It is divided into separate parts covering information for the designer, recommendations for

14、the specification writer, test methods and requirements for the various types of printed boards, for example single and double sided, multilayer and flexible printed boards. 1.1 Purpose of Part 1 This part contains general information on the structure of standards and specifications for printed boar

15、ds including those necessary for printed boards under the IEC Quality Assessment System for Electronic Components (IECQ) and gives recommendations to the specification writer on selecting and writing standards and specifications. 1.2 Associated IEC publications This standard shall be used in conjunc

16、tion with the following IEC publications: 2 Scope This standard is applicable to printed boards, irrespective of their method of manufacture, and particularly to the standards and specifications necessary for printed boards. 3 Object To give recommendations to the specification writer on the selecti

17、on and the preparation of the appropriate standards and specifications. 4 Structure of standards and specifications Printed boards may bc manufactured and handled: using conventional IEC standards. The manufacturer produces printed boards entirely independent from any influence or surveillance from

18、any international or national organization. All technical and commercial details are agreed upon between manufacturer and user (or purchaser and vendor); under the IEC Quality Assessment System for Electronic Components (IECQ). The manufacturer must have a capability approval in accordance with the

19、rules of the IECQ system which must be valid for the type of printed board under discussion. The approval will be granted by one of the national organizations approved by the IECQ System; for example the National Supervising Inspectorate. Thecapability test programme is standardized. Quality conform

20、ance inspection of the printed board to be delivered can be chosen to purpose i.e.not below a standardized minimum programme. All technical details not standardized by the system and all commercial details are agreed upon between manufacturer and user (or purchaser and vendor). Both approaches (i.e.

21、with conventional IEC standards and with standards for the IECQ System) require at least partly different standards and specifications. A comparative survey of the standards and specifications and their classification into different levels is given in the table below. A detailed explanation of the l

22、evels, standards, and specifications is given in Clause5. 68: Basic Environmental Testing Procedures. 97 (1970): Grid System for Printed Circuits. 194 (1975): Terms and Definitions for Printed Circuits. 249-2 (1970): Base Materials for Printed Circuits, Part 2: Specifications. 326-2 (1976): Printed

23、Boards, Part 2: Test Methods. 326-3 (1980): Part 3: Design and Use of Printed Boards.BS6221-1:1990 2 BSI 07-1999 For printed boards not intended to be handled under the IECQ System any specification system might be used, in principle. It is however, recommended that the conventional IEC standards (a

24、nd the international experience incorporated herein) be used. For printed boards under the IECQ system the IEC standards and the specification system have to be used in compliance with the rules of the IECQ System and with the special rules laid down in the generic specification for printed boards o

25、f assessed quality. Structure of standards and specifications for printed boards Levels of standards or specifications Title content IEC publications for printed boards under the terms of conventional IEC standards under IECQ System General information General information for the specificationwriter

26、 326-1 Design and use of printed boards 326-3 Artwork 326- under consideration Rework, repair, modification 326- under consideration Basic standard Test methods 326-2 Generic standard Generic specification for printedboardswithin IECQ System not applicable 326- under consideration Sectional standard

27、 Single/double sided printed boardswithplain holes 326-4 326- under consideration Single/double sided printed boardswithplated-through holes 326-5 326- under consideration Multilayer printed boards 326-6 326- under consideration Single/double sided flexibleprintedboards withoutthrough connections 32

28、6-7 326- under consideration Single/double sided flexibleprintedboards withthroughconnections 326-8 326- under consideration Rigid to flexible printed boards 326- underconsideration 326- under consideration Detail specification Capability Detail Specification (CapDS),i.e.sectional specification appl

29、ied to a material, etc., withalldetails necessary fortestingcapability not applicable see Sub-clause5.5.1 Customer Detail Specification (CDS) describing in full detail theparticularprinted board CDS number allocated in the customersownnumbering system NOTEThe number of the IEC publication is intende

30、d to include all published amendments and supplements, if any.BS6221-1:1990 BSI 07-1999 3 5 Levels of standards and specifications 5.1 General information There are several IEC publications containing general information. These publications apply to printed boards irrespective of any standards, spec

31、ifications or handling system. IEC Publication326-3is a standard and contains fundamental information on the design and the application of printed boards, their technical limitations and the main characteristics which can normally be obtained and expected. It is intended to give guidance to the desi

32、gner and the user of printed boards and to the specification writer who should specify the requirements within the limitations and descriptions given in IEC Publication326-3. IEC Publication 326-. is a report and contains information on the artwork necessary to order and to manufacture printed board

33、s. It applies to the artwork in the final stage irrespective of the method of its preparation. It should be noted, however, that computer-aided design (CAD) methods and relevant matters, for example computer languages, are not covered by this report. IEC Publication 326-. is a report and contains in

34、formation on rework, repair, and modification. It lists defects experienced in practice and gives illustrations of possible methods of rectification. Although this publication is primarily intended to apply to printed boards, it may well be applied to repair and modification of printed board assembl

35、ies also. The specification writer may be concerned since agreement between manufacturer and user may be necessary for certain features. 5.2 Basic standard IEC Publication 326-2 is a catalogue of test methods. It describes test methods and procedures including environmental conditioning for printed

36、boards. The specification writer has to select the tests to be applied (if applicable in accordance with the relevant sectional standards), to define the test conditions where necessary and to specify the requirements to be fulfilled. This standard applies irrespective of the printed board being han

37、dled under the terms of conventional IEC standards or under the IECQ System. 5.3 Generic standard IEC Publication 326-. applies to printed boards under the IECQ System only. This is a necessary standard in the IECQ System where it has to be followed. There is no equivalent for printed boards handled

38、 under the terms of conventional IEC standards. The publication contains the conditions for the application of the IECQ System on printed boards, details of the capability approval procedure including maintenance of capability approval, general details of the quality conformance inspection as basis

39、for the sectional and detail specifications and it gives rules for the preparation of detail specifications. 5.4 Sectional standards 5.4.1 Conventional IEC standards At present, the following IEC publications are available: Further publications, for example for rigid-to-flexible printed boards, are

40、under consideration. These publications contain fundamental information on characteristics listed and subdivided into two categories (basic and additional characteristics), make reference to the test methods to be used to verify these characteristics and specify conditions of test and requirements t

41、o be met as far as they are generally applicable and not depending on the particular design of a printed board. Customer detail specifications for particular printed boards should be based on the appropriate standard of this series. Publication 326-4 (1980): Printed Boards, Part 4: Specification for

42、 Single and Double Sided Printed Boards with Plain Holes. Publication 326-5 (1980): Part 5: Specification for Single and Double Sided Printed Boards with Plated-through Holes. Publication 326-6 (1980): Part 6: Specification for Multilayer Printed Boards. Publication 326-7 (1981): Part 7: Specificati

43、on for Single and Double Sided Flexible Printed Boards without Through Connections. Publication 326-8 (1981): Part 8: Specification for Single and Double Sided Flexible Printed Boards with Through Connections.BS6221-1:1990 4 BSI 07-1999 5.4.2 Standards for printed boards under IECQ System At present

44、, the following IEC publications are under consideration: Further publications, for example for rigid-to-flexible printed boards, will be prepared when the relevant publications in Sub-clause5.4.1 are available. These publications contain the same fundamental information on characteristics, tests, e

45、tc., as the publications listed in Sub-clause5.4.1, either directly or by reference to the relevant publication of Sub-clause5.4.1. Additionally, they contain the necessary information on the capability test programme and on quality conformance inspection of the printed boards to be delivered. The s

46、tandardized test patterns, already shown as non-compulsory examples in the publications of Sub-clause5.4.1, become here a mandatory part of the capability test programme. The capability detail specification (CapDS) has to be based on the relevant standard of this series while the customer detail spe

47、cification (CDS) for a particular printed board should make use of the relevant standard of this series as much as possible. 5.5 Detail specifications 5.5.1 Capability Detail Specification (CapDS) The CapDS is an essential part of the IECQ System. There is no equivalent for printed boards not intend

48、ed to be handled under the IECQ System. The CapDS may be prepared by IEC, by a national organization or by a manufacturer. If it is prepared by IEC it will have an IEC number. If it is prepared by a national Organization or by a manufacturer the relevant national numbering rules apply. The CapDS has

49、 to be prepared in accordance with the generic and the relevant sectional standard. It applies the relevant sectional standard to a specific material, for example according to IEC Publication249-2, and possibly to a specific surface finish, for example tin-lead or gold. Where the technical details are sufficiently equal, a group of materials or of surface finishes may be covered by oneCapDS. The CapDS will normally have the format of the relevant sectional standard with the information on the additional capability added in a suitable way. 5.5.2 Customer Detail Specificati