BS 3934-5-1997 Mechanical standardization of semiconductor devices - Recommendations applying to tape automated bonding (TAB) of integrated circuits《半导体器件机械标准化 第5部分 集成电路胶带自动粘合推荐标准》.pdf

《BS 3934-5-1997 Mechanical standardization of semiconductor devices - Recommendations applying to tape automated bonding (TAB) of integrated circuits《半导体器件机械标准化 第5部分 集成电路胶带自动粘合推荐标准》.pdf》由会员分享，可在线阅读，更多相关《BS 3934-5-1997 Mechanical standardization of semiconductor devices - Recommendations applying to tape automated bonding (TAB) of integrated circuits《半导体器件机械标准化 第5部分 集成电路胶带自动粘合推荐标准》.pdf（38页珍藏版）》请在麦多课文档分享上搜索。

1、BRITISH STANDARD BS 3934-5: 1997 IEC 60191-5: 1997 Mechanical standardization of semiconductor devices Part 5: Recommendations applying to tape automated bonding (TAB) of integrated circuits ICS 31.080.01BS3934-5:1997 This British Standard, having been prepared under the directionof the Electrotechn

2、icalSector Board, was published under the authorityof the Standards Boardand comes into effect on 15September1997 BSI 09-1999 ISBN 0 580 27812 3 National foreword This British Standard reproduces verbatim IEC60191-5:1997 and implements it as the UK national standard. It supersedes BS3934-5:1992 whic

3、h is withdrawn. The UK participation in its preparation was entrusted by Technical Committee EPL/47, Semiconductors, to Subcommittee EPL/47/4, Mechanical standardization, which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committe

4、e any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. A list of organizations represented on this subcommittee can be obtained on request to its secretary. From1Januar

5、y1997, all IEC publications have the number60000 added to the old number. For instance, IEC27-1 has been renumbered as IEC60027-1. For a period of time during the change over from one numbering system to the other, publications may contain identifiers from both systems. Cross-references The British

6、Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or using the “Find” facility of the BSI Standards Electronic Catalogue. A British Stand

7、ard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover,

8、an inside front cover, pages i and ii, theCEI IEC title page, page ii, pages 1 to 30 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since public

9、ation Amd. No. Date CommentsBS3934-5:1997 BSI 09-1999 i Contents Page National foreword Inside front cover Text of CEI IEC 60191-5 1ii blankBS3934-5:1997 ii BSI 09-1999 Contents Page Introduction 1 1 Scope 1 2 Terms and definitions 1 3 Description of tape automated bonding (TAB) 2 4 Dimensional requ

10、irements 2 4.1 Film format 3 4.2 Alignment holes 3 4.3 Body size 3 4.4 Test pad patterns 3 4.5 Outer lead patterns 4 4.6 Maximum lead count 4 5 Variation codes 4 6 Requirements for inner and outer lead bonding (ILB and OLB) 4 Annex A (informative) Summary of recommended TAB package configurations (s

11、uper format) 23 Annex B (informative) Summary of recommended TAB package configurations (wide format) 24 Annex C (informative) Outer lead numbering 25 Annex D (informative) Test pad numbering 29 Figure 1 Datums and principal basic dimensions (note 11) 5 Figure 2 Body dimensions and associated tolera

12、nces (note 11) 6 Figure 3 Detail A 7 Figure 4 Detail B 8 Figure 5 Details C and D 9 Figure 6 Detail E (note 12) 10 Figure C.1 TAB package to substrate orientation 26 Figure C.2 Lead 1 orientation features 26 Figure C.3 TAB package and slide carrier orientation 27 Figure C.4 Lead 1 position and numbe

13、ring direction 28 Figure D.1 Test pad numbering 29 Figure D.2 Test pad numbering 30 Table 1 Dimensions and tolerances associated with the film format 11 Table 2 Dimensions and tolerances associated with the package body size 12 Table 3 Dimensions and tolerances associated with the test pad pitch 13

14、Table 4 Dimensions and tolerances associated with the outer lead pitch 13 Table 5 Lead count variations 14BS3934-5:1997 BSI 09-1999 1 Introduction The recommendations contained in this standard cover the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a us

15、er. They are not intended to govern strictly internal usage by a company such as the use of TAB as one step in the manufacture of QFP or other packages. Dimensional values or requirements given in this standard for tape width, sprocket holes, test pad patterns, or outer leads, etc. correspond to the

16、 state of the technology at the date of publication of this standard. Tape width and sprocket hole dimensions have been derived from motion picture film standards. This standard does not attempt to define the ultimate possibilities of the technology. Progress in integrated circuit assembly technolog

17、y may lead to inclusion of new or additional recommended dimensions in the future. 1 Scope This part of IEC60191 on mechanical standardization gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and i

18、nterconnection functions. This standard is applicable to the finished component supplied by a manufacturer to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB). 2 Terms and definitions For the purpose of this part of IEC60191, the following def

19、initions apply. 2.1 chip (or die) a portion of a silicon wafer which contains at least one integrated circuit which has been separated from the wafer containing an array of such devices 2.2 tape carrier 1) a linear strip of a laminate of an insulating material and a conducting material patterned so

20、as to mechanically support and electrically contact a chip. The strip may contain a series of such patterns and each such pattern is a tape site 2.3 sprocket hole a row of holes on each side of the tape carrier used for driving the tape through equipment or for coarse alignment 2.4 lead pattern the

21、pattern of etched conductive material on a tape carrier including the inner and outer leads and the test pads 2.5 inner lead the extreme interior end of the lead pattern conductor which is used for connection to a chip 2.6 device window a perforation at the centre of a tape site within which the chi

22、p and the inner leads are located 2.7 outer lead or excise window a rectangular perforation on each side of the tape site over which the conductor pattern is suspended. These perforations may form a continuous opening around the tape site. The bonded circuit is normally excised from the tape by cutt

23、ing in this opening 1) “Tape carrier” may be abbreviated to “tape” when no confusion can arise.BS3934-5:1997 2 BSI 09-1999 2.8 support ring the portion of the insulating film which supports the conductor pattern between the device window and the outer lead window 2.9 body size the outside dimension

24、of the support ring 2.10 outer lead the extreme exterior end of the lead pattern conductor which is used for connection at the next level of assembly after the bonded IC is excised from the tape carrier 2.11 alignment holes auxiliary holes in the polymer film used for fine alignment of the tape carr

25、ier during inner lead bonding, electrical test and burn-in, excise and outer lead bonding 2.12 test pads portions of the conductor pattern which are used to make electrical contact to the tape carrier during electrical test and burn-in operations 3 Description of tape automated bonding (TAB) Tape au

26、tomated bonding (TAB) is an assembly process applicable to integrated circuits (IC) which are used without conventional packages, that is with the silicon chip exposed. The basic principle is the attachment of each silicon chip to a special flexible tape. Like a flexible printed circuit, the tape co

27、nsists of a thin plastic base on which metal conductors have been formed. At the inner end of the conductors the pattern matches the pattern of connecting pads on the chip. At the extreme outer end of the conductors, each conductor is attached to a pad for temporary contact for electrical test. Betw

28、een the test pad locations and the chip connection points, there is a length of conductor unsupported by the insulating film which will ultimately form the outer lead of the TAB package. Like a movie film, the tape has a row of sprocket holes on each side of the tape width which are used to move the

29、 tape easily during processing. The TAB tape is normally used in three main steps: a) inner lead bonding IC chip pads are bonded to the inner ends of the conductors (the inner leads) on the tape. The surface of the bonded IC may then be coated with an organic protective layer, or the entire IC may b

30、e encapsulated. b) electrical test Inner lead bonded chips can be electrically tested using the test pads provided on the tape. Similarly, the IC may be subjected to high temperature preconditioning or “burn-in”. c) outer lead bonding The ICs are transferred to their final interconnection location (

31、PC board or other substrate) after being excised from the tape. The unsupported lengths of conductor are retained after excising and form the outer leads of the TAB package. The outer leads are bonded to the final substrate. The manufacturer of the TAB package normally performs all functions require

32、d by steps a) and b). The user will normally perform all functions required by step c). This standard defines the format of the product resulting from steps a) and b). 4 Dimensional requirements The parameters that define a specific TAB variation are film format, body size, test pad pitch and outer

33、lead pitch. Because the dimensions based on these four parameters can be organized into four groups with a high degree of commonality within each group, the complete dimensional requirements in this standard are presented in four tables of common dimensions (seeTable 1 toTable 4). In addition, a tab

34、le which shows the maximum lead count for each of the permutations of these four parameters is included (seeTable 5).BS3934-5:1997 BSI 09-1999 3 4.1 Film format The film format is defined by the tape width and the sprocket hole size. Dimension D6 defines the tape width. The tape widths included in t

35、his standard are35mm, 48mm and70mm. The outside edges of the tape should not be used as a mechanical reference except in the least sensitive operations. The length of an individual tape site when excised from a tape carrier strip is given by dimension E6. Sprocket hole size is defined by dimension G

36、. Only the sizes referred to as “super” and “wide” are included herein. Either super or wide sprocket holes are allowed with48mm and70mm tape formats, but only super sprocket holes are allowed with the35mm format. Dimensions associated primarily with the film format are included inTable 1. 4.2 Align

37、ment holes Two options for the alignment holes are allowed. These features may be etched or punched holes in the support film, or etched metal features. Use of the film alignment hole option will require very precise alignment of the metallization artwork during tape manufacture in order for the fin

38、ished tape to meet the positional tolerance requirements. Use of the metal alignment hole option decreases the need for such precise artwork alignment because the relationship between the alignment holes and the metallization in that case is the precision of the artwork itself. For these reasons the

39、 metal option is highly recommended for TAB packages with the finer outer lead or test pad pitches. The metal alignment feature is, however, more easily damaged and, when it is present on a package, should be used only for operations such as electrical test and burn-in that require the most precise

40、alignment. Because of the area required for the metal ring, when the metal alignment hole is used, a reduction in the maximum number of test pads may be necessary. The alignment holes are also used as features for defining datums X, Y and Z. All positional tolerances reference these datums. The alig

41、nment hole size is defined by dimension F and their locations are defined by dimensions D5 and E5. The values of dimensions associated with the alignment holes are shown inTable 1. 4.3 Body size The body size for the tape carrier package is given by dimensions D1 and E1. Only specific body sizes are

42、 possible or allowed for each tape width as follows: Film format: body sizes 35mm: 14mm, 16mm, 18mm and20mm; 48mm: 16mm, 20mm, 24mm, 26mm and 28mm; 70mm: 24mm, 28mm, 32mm, 36mm and40mm. Dimensions associated primarily with the body size of a tape carrier package are included inTable 2. 4.4 Test pad

43、patterns All test pads are arranged in two nested rows on all four sides of the tape site. The length and width of the test pads are defined by dimensions B1 and B2. The overall pitch of the test pad array is defined bydimension e1, but the two rows on each side are staggered so that the pitch withi

44、n each row is two timese1.The location of the test pad arrays on the tape site are defined by dimensions D3, D4, E3 and E4; the pitch between the two rows is a constant value for tape widths. The number of test pads on the tape carrier package is given by the values for the symbols M1, M2, M3 and M4

45、 for the four allowed test pad pitches. These values are dependent on the test pad pitch and the available space between the alignment holes on each side of the tape site. The minimum spacing between the edge of the outermost test pad and the alignment hole centre is1,20mm for the film hole option a

46、nd1,40mm for the metal hole option. The centre pad in the outer row of test pads on each side of the tape site is electrically connected only when an odd number of outer leads per side is used and is identified with a special shape. Dimensions primarily associated with the test pad patterns are incl

47、uded inTable 1 andTable 3.BS3934-5:1997 4 BSI 09-1999 4.5 Outer lead patterns The pitch and width of the outer lead conductors is defined by dimensions e and b. Prior to excise and outer lead bonding, the outer lead conductors span the outer lead window defined by dimensions D and D1. An even number

48、 of leads per side of the tape carrier package is required for all combinations of tape format and body size with the exception of35mm tape with20mm body and48mm tape with28mm body. For these two combinations only, an odd number of leads per side is defined. The maximum number of leads for each tape

49、 carrier package is determined on the basis of lead pitch, body size, number of test pads and conductor routing between outer leads and test pads. All outer leads shall be connected to a test pad. Dimensions associated primarily with the outer lead pattern are included inTable 4. 4.6 Maximum lead count The specified lead counts inTable 5 have been determined by studies of the routing between the outer leads and the test pads. These studies followed a design rule requiring that the minimum width of conductors and the spaces between th