ASTM F641-2009 Standard Specification for Implantable Epoxy Electronic Encapsulants《可植入的环氧树脂电子胶囊密封材料标准规范》.pdf
《ASTM F641-2009 Standard Specification for Implantable Epoxy Electronic Encapsulants《可植入的环氧树脂电子胶囊密封材料标准规范》.pdf》由会员分享,可在线阅读,更多相关《ASTM F641-2009 Standard Specification for Implantable Epoxy Electronic Encapsulants《可植入的环氧树脂电子胶囊密封材料标准规范》.pdf(4页珍藏版)》请在麦多课文档分享上搜索。
1、Designation: F 641 09Standard Specification forImplantable Epoxy Electronic Encapsulants1This standard is issued under the fixed designation F 641; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of last revision. A number
2、 in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope1.1 This specification covers thermoset plastics based ondiglycidyl ethers of bisphenol A and amino functional curingagents or amine catalysts.1.
3、2 The epoxy encapsulants covered by this specificationare intended to provide a tissue-compatible protective coveringfor implantable medical devices such as pulse generators,telemetry devices and RF receivers. The biocompatibility ofepoxy plastics has not been established. Epoxy plastic is ageneric
4、term relating to the class of polymers formed fromepoxy resins, certain curing agents or catalysts and variousadditives. Since many compositions and formulations fallunder this category, it is essential that the fabricator assuresafety of implantability of the specific composition or formu-lation fo
5、r the intended use by current state-of-the-art testmethods. This specification can be used as a basis for stan-dardized evaluation of biocompatibility for such implantableencapsulants.1.3 The encapsulants covered by this specification are foruse in devices intended as long-term implants.1.4 Limitati
6、onsThis specification covers only the initialqualification of epoxy encapsulants for implantable electroniccircuitry. Some of the requirements are not applicable toroutine lot-to-lot quality control.1.5 The values stated in SI units are to be regarded asstandard. No other units of measurement are in
7、cluded in thisstandard.1.6 This standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior
8、 to use.2. Referenced Documents2.1 ASTM Standards:2D 149 Test Method for Dielectric Breakdown Voltage andDielectric Strength of Solid Electrical Insulating Materialsat Commercial Power FrequenciesD 150 Test Methods for AC Loss Characteristics and Per-mittivity (Dielectric Constant) of Solid Electric
9、al Insula-tionD 257 Test Methods for DC Resistance or Conductance ofInsulating MaterialsD 570 Test Method for Water Absorption of PlasticsD 638 Test Method for Tensile Properties of PlasticsD 790 Test Methods for Flexural Properties of Unreinforcedand Reinforced Plastics and Electrical Insulating Ma
10、terialsD 1042 Test Method for Linear Dimensional Changes ofPlastics Under Accelerated Service ConditionsD 1239 Test Method for Resistance of Plastic Films toExtraction by ChemicalsD 1434 Test Method for Determining Gas PermeabilityCharacteristics of Plastic Film and SheetingD 2240 Test Method for Ru
11、bber PropertyDurometerHardnessD 2471 Practice for Gel Time and Peak Exothermic Tem-perature of Reacting Thermosetting Resins3D 2562 Practice for Classifying Visual Defects in PartsMolded from Reinforced Thermosetting PlasticsD 2566 Test Method for Linear Shrinkage of Cured Ther-mosetting Casting Res
12、ins During Cure3D 2734 Test Methods for Void Content of Reinforced Plas-ticsD 3137 Test Method for Rubber PropertyHydrolytic Sta-bilityF74 Practice for Determining Hydrolytic Stability of Plas-tic Encapsulants for Electronic Devices3F 135 Test Method for Embedment Stress Caused by Cast-ing Compounds
13、 on Glass-Encased Electronic Components3F 602 Criteria for Implantable Thermoset Epoxy PlasticsF 748 Practice for Selecting Generic Biological Test Meth-ods for Materials and DevicesF 895 Test Method for Agar Diffusion Cell Culture Screen-ing for CytotoxicityF 981 Practice for Assessment of Compatib
14、ility of Bioma-terials for Surgical Implants with Respect to Effect ofMaterials on Muscle and Bone1This specification is under the jurisdiction of ASTM Committee F04 onMedical and Surgical Materials and Devices and is the direct responsibility ofSubcommittee F04.11 on Polymeric Materials.Current edi
15、tion approved Aug. 1, 2009. Published September 2009. Originallyapproved in 1979. Last previous edition approved in 2003 as F 641 98a(2003).2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volum
16、e information, refer to the standards Document Summary page onthe ASTM website.3Withdrawn.1Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.2.2 AAMI Standard:EOS-D E-O Sterilization Standard42.3 ISO Standard:ISO 10993 Biological Evalua
17、tion of Medical Devices53. Classification3.1 Encapsulants shall be classified as follows:3.1.1 Type IThose encapsulants which contact the tissuedirectly or indirectly.3.1.2 Type IIThose encapsulants used only within her-metically sealed containers. The epoxy encapsulant has nocontact with tissues or
18、 physiological fluids.4. Chemical Composition4.1 Additives (Type I Encapsulants Only):4.1.1 Reactive DiluentsThe following compounds whenused as reactive diluents shall not be used in concentrationsgreater than 12 parts per hundred resin (phr).4.1.1.1 Butyl glycidyl ether (BGE).4.1.1.2 Phenyl glycid
19、yl ether (PGE).4.1.2 Other Additives (see Note 1)Other additives shall beshown to be nonextractable in 37C physiological saline for thedevice design life in concentrations sufficient to significantlyaffect the properties of the encapsulant or to produce asignificant biological reaction.NOTE 1Other a
20、dditives, as indicated in Criteria F 602, include com-pounds such as nonreactive diluents, fillers, release agents, and the like.4.1.3 Phthalate EstersPhthalate esters such as dibutylphthalate shall not be used in concentrations $10 phr.4.2 Mix Ratios (Type I and Type II Encapsulants):4.2.1 AminesTh
21、e mix ratio shall be maintained at 65equivalent % of stoichiometry.4.2.2 CatalystsThe mix ratio shall be maintained withinthe ranges recommended by the formulator.4.3 Carbonates (Type I and Type II Encapsulants)Theencapsulant shall be poured under conditions such that theformation of amine carbonate
22、s is minimized. The devicemanufacturer may specify maximum limits for carbon dioxideor water vapor, or both, in the atmosphere in which theencapsulant is being mixed or poured.5. Physical Properties5.1 Type I Encapsulants:5.1.1 Peak Exotherm Temperature (Test Method D 2471)The peak exotherm temperat
23、ure during cure shall be keptbelow the maximum acceptable value for the lowest tempera-ture rated component of the device.5.1.2 Fully Cured SpecimensThe required propertiesmeasured on fully cured specimens conditioned as in 6.1 are asfollows:5.1.2.1 TransparencyIn cases where no fillers or rein-forc
24、ements are used, the encapsulant shall have sufficienttransparency so that the circuitry may be visually inspectedafter encapsulation.5.1.2.2 Foreign ParticlesNo foreign particles, particulatematter, or gross contamination shall be observed when checkedunder 23 wide field magnification.5.1.2.3 Bioco
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