ASTM F72-2006 Standard Specification for Gold Wire for Semiconductor Lead Bonding 《半导体引线连接用金线的标准规范》.pdf
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1、Designation: F 72 06Standard Specification forGold Wire for Semiconductor Lead Bonding1This standard is issued under the fixed designation F 72; the number immediately following the designation indicates the year of originaladoption or, in the case of revision, the year of last revision. A number in
2、 parentheses indicates the year of last reapproval. A superscriptepsilon (e) indicates an editorial change since the last revision or reapproval.1. Scope1.1 This specification covers round drawn/extruded goldwire for internal semiconductor device electrical connections.Four classifications of wire a
3、re distinguished, (1) copper-modified wire, (2) beryllium-modified wire, (3) high-strengthwire, and (4) special purpose wire.NOTE 1Trace metallic elements have a significant effect upon themechanical properties and thermal stability of high-purity gold wire. It iscustomary in manufacturing to add co
4、ntrolled amounts of selectedimpurities to gold to modify or stabilize bonding wire properties or both.This practice is known variously as “modifying,” “stabilizing,” or“doping.” The first two wire classifications denoted in this specificationrefer to wire made with either of two particular modifiers
5、, copper orberyllium, in general use. In the third and fourth wire classifications,“high-strength” and “special purpose” wire, the identity of modifyingadditives is not restricted.1.2 The values stated in SI units shall be regarded as thestandard.1.2.1 A mixed system of metric and inch-pound units i
6、s inwidespread use for specifying semiconductor lead-bondingwire. SI-equivalent values of other commonly used units aredenoted by parentheses in text and tables.1.3 The following hazard caveat pertains only to the testmethod portion, Section 9, of this specification. This standarddoes not purport to
7、 address all of the safety concerns, if any,associated with its use. It is the responsibility of the user of thisstandard to establish appropriate safety and health practicesand determine the applicability of regulatory limitations priorto use.2. Referenced Documents2.1 ASTM Standards:2E16 Method of
8、 Free Bend Test for Ductility of Welds3F 205 Test Method for Measuring Diameter of Fine Wire byWeighingF 219 Test Methods of Testing Fine Round and Flat Wirefor Electron Devices and LampsF 584 Practice for Visual Inspection of SemiconductorLead-Bonding Wire3. Ordering Information3.1 Orders for mater
9、ial under this specification shall includethe following information:3.1.1 Classification: copper-modified, beryllium-modified,high strength, or special purpose,3.1.2 Quantity,3.1.3 Purity (Section 4),3.1.4 Type, hard, stress relieved, or annealed (Section 5),3.1.5 Breaking load and percentage elonga
10、tion range (Sec-tion 5),3.1.6 Wire diameter (Section 6),3.1.7 Spool type, length of wire per spool, and type of wind(Section 11),3.1.8 Despooling, left-handed unwind or right-handed un-wind (Section 11), and,3.1.9 Packaging and marking (Section 12).4. Chemical Composition4.1 Beryllium-modified mater
11、ial shall conform to thechemical requirements specified in Table 1.4.2 High-strength material shall conform to the chemicalrequirements specified in Table 2.4.3 Special purpose material shall be in accordance withTable 3.NOTE 2Copper-modified wire is used on thermocompression wirebonding machines. B
12、eryllium-modified material is often preferred onhigh-speed automated thermocompression or thermosonic bonding equip-ment. High-strength wire was developed for use on some very high speedautomated thermosonic bonders.1This specification is under the jurisdiction of ASTM Committee F01 onElectronics an
13、d is the direct responsibility of Subcommittee F01.07 on WireBonding, Flip Chip, and Tape Automated Bonding.Current edition approved Jan. 1, 2006. Published March 2006. Originallyapproved in 1966. Last previous edition approved in 2001 as F 72 95 (2001).2For referenced ASTM standards, visit the ASTM
14、 website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.3Withdrawn.1Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2
15、959, United States.5. Mechanical Properties5.1 Material specified by this standard may be either of twotypes:5.1.1 HardWire, as drawn/as extruded.5.1.2 AnnealedWire, annealed after drawing/extruding.5.2 Breaking Load and ElongationThe tension test shallbe the standard test for determining the mechan
16、ical properties,and acceptance or rejection shall depend on the breaking loadand percent elongation at failure of a 254-mm (10.0-in.) lengthof wire.5.2.1 Hard wire shall conform to the requirements of Table4 for beryllium-modified gold wire.5.2.2 Stress relieved/annealed wire shall conform to thereq
17、uirements of Table 5 for beryllium-modified gold wire, tothe requirements of Table 6 for high-strength wire, and to therequirements of Table 7 for special purpose wire.NOTE 3Hard wire is generally used for ultrasonic wire bonding.Annealed wire is used for thermocompression and thermosonic bonding.6.
18、 Dimensions and Permissible Variations6.1 Wire diameters shall be expressed in m (or equivalentdecimal fractions of an inch). Tolerances for the various sizeranges are specified in Table 8.7. Workmanship, Finish, and Appearance7.1 The wire surface shall be clean and free of finger oilsand stains.7.2
19、 The wire surface shall be free of drawing/extrusionlubricant residues, particulate matter and other contaminantsthat would interfere with functional performance of the wire.The seller and the purchaser must agree upon acceptablestandard of surface cleanliness.7.3 The surface shall be free of surfac
20、e contamination thatwould degrade service life of the device to which it is attached.The seller and the purchaser must agree upon acceptablestandard of surface cleanliness.7.4 The wire surface shall be free of nicks, dents, scratches,or other blemishes deeper than 5 % of the wire diameter. TheTABLE
21、1 Chemical Requirements, Beryllium-Modified GoldBonding WireElement Composition, Weight, %Gold, min 99.99Beryllium 0.00030.0010Other impurities, max each 0.003Total of all detectable impurities, max 0.01TABLE 2 Chemical Requirements, High-Strength Gold BondingWireElement Composition, Weight, %Gold,
22、min 99.99Total of all detectable impurities, max 0.01TABLE 3 Chemical Requirements, Special Purpose GoldBonding WireElement Composition, Weight, %Gold Not restrictedOther principal elements Not restrictedTotal of all detectable elements Not restrictedTABLE 4 Breaking Load and Elongation of Hard Wire
23、Beryllium-Modified Gold and High-Strength GoldANominal Diameter,m (in.)Breaking Load, min, N(gf)Elongation in 254 mm10.0 in.), %13 (0.00050) 0.039 (4.0) 0.5 to 2.0, incl18 (0.00070) 0.069 (7.0) 0.5 to 2.0, incl20 (0.00080) 0.088 (9.0) 0.5 to 2.0, incl23 (0.00090) 0.147 (15.0) 1.0 to 2.5, incl25 (0.0
24、010) 0.177 (18.0) 1.0 to 2.5, incl28 (0.0011) 0.216 (22.0) 1.0 to 2.5, incl30 (0.0012) 0.265 (27.0) 1.0 to 2.5, incl31.8 (0.00125) 0.284 (29.0) 1.0 to 2.5, incl33 (0.0013) 0.314 (32.0) 1.0 to 2.5, incl38 (0.0015) 0.392 (40.0) 1.0 to 2.5, incl51 (0.0020) 0.736 (75.0) 1.0 to 3.0, inclAAll modern wires
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