ASHRAE NA-04-4-2-2004 Thermal Profile of a High-Density Data Center-Methodology to Thermally Characterized a Data Center《一个数据中心的特征的高密度的数据中心的方法的热剖面》.pdf
《ASHRAE NA-04-4-2-2004 Thermal Profile of a High-Density Data Center-Methodology to Thermally Characterized a Data Center《一个数据中心的特征的高密度的数据中心的方法的热剖面》.pdf》由会员分享,可在线阅读,更多相关《ASHRAE NA-04-4-2-2004 Thermal Profile of a High-Density Data Center-Methodology to Thermally Characterized a Data Center《一个数据中心的特征的高密度的数据中心的方法的热剖面》.pdf(8页珍藏版)》请在麦多课文档分享上搜索。
1、NA-04-4-2 Thermal Profile of a High-Density Data Center-Methodology to Thermally - Characterize a Data Center Roger R. Schmidt, Ph.D., P.E. Member ASHRAE ABSTRACT The heat dissipated by large sewers and switching equip- ment is reaching levels that make it ve y dijFcult to cool these systems in data
2、 centers or telecommunications rooms. Some of the highestpoweredsystems are dissipatingupwardof2000 W/ fi(21,500 W/m2) based on the equipment footprint. When systems dissipate this amount ofheat and then are clustered together within a data centel; signjcant cooling challenges can result. This paper
3、 describes the thermal projle of a 74j x 84ft(22.6 m x25.6m) data center and the measurement tech- niques employed to fully capture the detailed thermal environ- ment. In aportion of the data center(48j x 56ftr14.6 m x 17. I m) that encompasses the servers the heat flux is 170 W/ fi(1830 W/m2). Most
4、 racks within this area dissipated 6.8 kW while a couple dissipated upward of26 kK Detailed measure- ments were taken in this data center of electronic equipment power usage; perforated floor tile airflow; cable cutout airflow; computer room air conditioning (CRAC) airflow, temperatures andpower usa
5、ge; electronic equipment inlet air temperatures. In addition to these measurements, thephysical features ofthe data center were recorded such that a detailed CFD model could be employed to compare the results. The empirical as well as theflow modeling data are presented and compared. INTRODUCTION Th
6、e heat dissipated by electronic equipment is increasing at a very rapid rate. This increase is summarized in Figure 1, generated by a consortium of 17 industry equipment manu- facturers and published by the Uptime Institute showing that over the last five years the heat flux of rack level servers an
7、d storage doubled. In 2003 the maximum rack heat flux for serv- ers displayed is 15000 W/m2, which translates into 11 kW dissipated from a 19 in. (482.6 mm) rack. Racks with this heat load distributed in a data center present a real challenge for facility engineers in providing adequate cooling to t
8、hese high- density racks. And the problem is exacerbated when clusters of such racks are placed in a data center where zones of high- density servers are beyond the cooling capabilities of the data center. Many data centers employ raised floors to distribute the chilled air to these racks. One of th
9、e challenges to this arrangement is to provide the proper distribution of chilled air to the racks provided by computer room air-conditioning (CRAC) units situated on the raised floor. Kang et al. (2001) and Schmidt et al. (2001) provide some insight in the flow distribution from perforated tiles, a
10、nd Schmidt et al. (2001) show results of the perforated tile distribution on the inlet temperatures of racks located on the raised floor. Figure 1 Equipment heat densities. Roger Schmidt is a distinguished engineer at IBM Corporation, Poughkeepsie, N.Y. 02004 ASHRAE. 635 Figure 3 Cold aisle showing
11、racks Figure 2 Data center layout. Detailed thermal profiles of data centers for the most part do not exist in the literature. Pate1 et al. (2001) developed a three-dimensional model of a laboratory data center and experimentally verified the numerical results to ensure the specified inlet air tempe
12、ratures to the computer systems met the temperature limits. Schmidt (1 997) thermally profiled a non-raised-floor data center in a small office and then compared the results to a CFD model of the space. The results compared favorably. Data from other electronic equipment rooms are available, but it
13、is very difficult to glean important information or correlate or compare data. The motivation for this paper is twofold. First, this paper provides some basic information on the thermal/flow data collected from a high-density data center. Second, it provides amethodology that others can follow in co
14、llecting thermal and airflow data from data centers so that data can be assimilated to make comparisons. This database can then provide the basis for future data center air cooling design and aid in the under- standing of deploying racks of higher heat loads in the future. LAYOUT OF DATA CENTER The
15、data center profiled is the National Center for Envi- ronmental Prediction (NCEP) located in Bethesda, Maryland. All the equipment is located on a raised floor in an enclosed area of 74 ft x 84 ft (22.6 m x 25.6 m). A plan view ofthe data center, indicating the location of the electronic equipment,
16、power distribution units (PDU), CRAC units, and perforated floor tiles, is shown in Figure 2. Most of the servers (5 1 racks) are IBM Model 7040(p690). The other systems are a mix of Fgure 4 Blockages underneath rased$ooz switching, communications, and storage equipment. The key classes of equipment
17、 are highlighted in Figure 2. The ceiling height, as measured from the raised floor to the ceiling, is 10 ft (3.05 m) with a raised floor height of 17 in. (431.8 mm). Computer room air-conditioning units (seven operational CRAC units) as well as power distribution units (six opera- tional PDU units)
18、 are located around the perimeter of the room. Potential expansion is anticipated and additional PDU and CRAC units are also shown in Figure 2. The servers are located in a cold aisleihot aisle arrangement with aisle widths of approximately 4 ft (1.2 m) (two floor tiles wide). The cold aisles were p
19、opulated with 25% open tiles with the dampers removed on all the tiles. A cold aisle, showing the rows of racks, is seen in Figure 3. In addition, underfloor blockages occurred beneath the raised floor. These were either insulated chilled water pipes, as shown in Figure 4, or cabling located beneath
20、 the server equipment. When the data center was first populated with equipment, high rack inlet air temperatures were measured at a number of rack locations. The problem was that the perimeter between the raised floor and subfloor was not blocked off, and the chilled air from the CRAC units was exit
21、ing to other portions 636 ASHRAE Transactions: Symposia of the building (this data center was centrally located among other raised floor data and office space). In addition, the total heat dissipation by the electronic equipment in the room exceeded the sensible cooling capacity of the CRAC units. B
22、ased on these problems, an additional CRAC unit was installed and the entire perimeter of the region between the raised floor and subfloor was enclosed. (Although the “before“ results will not be presented in this paper, the result- ing flow increased by about 50% and the rack inlet tempera- tures d
23、ecreased on average about 5C with these two noted changes). MEASUREMENT TOOLS The airflow through the perforated floor tiles, cable cutouts, and CRAC units was measured with an Alnor velom- eter. The unit was calibrated on a wind tunnel and all measure- ments were adjusted based on the calibration (
24、velometer was measuring approximately 4% low for the range of airflows measured). In addition to this correction, the reading of the velometer also needs to be corrected for the reduction in airflow caused by the flow impedance of the unit. The unit was modeled using a computational fluid dynamics s
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