ASHRAE FUNDAMENTALS SI CH 25-2017 Heat Air and Moisture Control In Building Assemblies-Fundamentals.pdf
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1、25.1CHAPTER 25HEAT, AIR, AND MOISTURE CONTROL IN BUILDING ASSEMBLIESFUNDAMENTALSFUNDAMENTALS. 25.1Terminology and Symbols 25.1Hygrothermal Loads and Driving Forces. 25.2HEAT TRANSFER . 25.5Steady-State Thermal Response. 25.5Transient Thermal Response . 25.8AIRFLOW 25.9MOISTURE TRANSFER 25.10Moisture
2、 Storage in Building Materials 25.10Moisture Flow Mechanisms . 25.11COMBINED HEAT, AIR , AND MOISTURE TRANSFER. 25.14SIMPLIFIED HYGROTHERMAL DESIGN CALCULATIONS AND ANALYSES. 25.14Surface Humidity and Condensation . 25.14Interstitial Condensation and Drying 25.14TRANSIENT COMPUTATIONAL ANALYSIS . 25
3、.15Criteria to Evaluate Hygrothermal Simulation Results . 25.16ROPER design of space heating, cooling, and air-conditioningPsystems requires detailed knowledge of the building envelopesoverall heat, air, and moisture performance. This chapter discussesthe fundamentals of combined heat, air, and mois
4、ture movement asit relates to the analysis and design of envelope assemblies. Guid-ance for designing mechanical systems is found in other chapters ofthe ASHRAE Handbook.Because heat, air, and moisture transfer are coupled and interactclosely with each other, they should not be treated separately. F
5、orexample, improving a building envelopes energy performance maycause moisture-related problems. Conversely, evaporation of waterand removal of moisture by other means are processes that requireenergy. Only a sophisticated moisture control strategy can ensurehygienic conditions and adequate durabili
6、ty for modern, energy-efficient building assemblies. Effective moisture control design mustdeal with all hygrothermal (heat and humidity) loads acting on thebuilding envelope.1. FUNDAMENTALS1.1 TERMINOLOGY AND SYMBOLSThe following heat, air, and moisture definitions, properties, andsymbols are commo
7、nly used.A building envelope or building enclosure provides physicalseparation between the indoor space and the outdoor environment. Abuilding assembly is any part of the building envelope, such as awall, window, or roof assembly, that faces the interior and exterior ofthe building. A building compo
8、nent is any element, layer, or mate-rial within a building assembly.HeatSpecific heat capacity c is the change in heat (energy) of a unitmass of material for a unit change of temperature in J/(kgK).Volumetric heat capacity c is the change in heat stored in a unitvolume of material for a unit change
9、of temperature, in J/(m3K).Heat flux q, a vector, is the time rate of heat transfer through a unitarea, in the direction perpendicular to that area, in W/m2.Thermal conductivity k in Europe, the Greek letter (lambda) isused is a material property describing ability to conduct heat, and isdefined by
10、Fouriers law of heat conduction. Thermal conductivity isthe property that describes heat flux through a unit thickness of a ma-terial in a direction perpendicular to the isothermal planes, inducedby a unit temperature difference. (ASTM Standard C168 defineshomogeneity.) Units are W/(mK). For anisotr
11、opic materials, the di-rection of heat flux in the material must be noted. Thermal conduc-tivity must be evaluated for a specific mean temperature, thickness,age, and moisture content. Thermal conductivity is normally consid-ered an intrinsic property of a homogenous material. In porous mate-rials,
12、heat flow occurs by a combination of conduction, convection,and radiation, and may depend on orientation, direction, or both.When nonconductive modes of heat transfer occur within the speci-men or the test specimen is nonhomogeneous, the measured propertyof such materials is called apparent thermal
13、conductivity. The spe-cific test conditions (e.g., sample thickness, orientation, environ-ment, environmental pressure, surface temperature, meantemperature, temperature difference, moisture distribution) should bereported with the values of apparent thermal conductivity. The sym-bol kapp(or app) is
14、 used to denote the absence of pure conduction orto indicate that all values reported are apparent. Materials with a lowapparent thermal conductivity are called insulation materials (seeChapter 26 for more detail).Thermal resistivity ruis the reciprocal of thermal conductivity.Units are (mK)/W.Therm
15、al resistance R is an extrinsic property that describes theresistance of a material layer or assembly to heat transfer. It is deter-mined by the steady-state or time-averaged temperature difference(between two defined surfaces of a material layer within a buildingassembly) that induces a unit heat f
16、lux, in (m2K)/W. When the twodefined surfaces have unequal areas, as with heat flux through mate-rial layers of nonuniform thickness, an appropriate mean area andmean thickness must be given. Thermal resistance formulas involv-ing materials that are not uniform slabs must contain shape factors toacc
17、ount for the area variation involved. When heat flux occurs byconduction alone, the thermal resistance of a layer of constant thick-ness may be obtained by dividing the materials thickness by its ther-mal conductivity. When several modes of heat transfer are involved,the apparent thermal resistance
18、may be obtained by dividing thematerials thickness by its apparent thermal conductivity. When aircirculates within or passes through insulation, as may happen in low-density fibrous materials, the apparent thermal resistance is affected.Thermal resistances of common building and insulation materials
19、are listed in Chapter 26.Thermal conductance C is the reciprocal of thermal resistance.Units are W/(m2K).Heat transfer or surface film coefficient h is the value that de-scribes the total heat flux by both convection and radiation betweena surface and the surrounding environment. It is defined as th
20、e heattransfer per unit time and unit area induced by a unit temperaturedifference between the surface and the reference temperature in thesurrounding environment. Units are W/(m2K). For convection toThe preparation of this chapter is assigned to TC 4.4, Building Materialsand Building Envelope Perfo
21、rmance.25.2 2017 ASHRAE HandbookFundamentals (SI)occur, the surrounding space must be filled with a fluid, usually air.If the space is evacuated, heat flow occurs by radiation only. In thecontext of this discussion, indoor or outdoor heat transfer or sur-face film coefficient hior horelates to an in
22、terior or exterior surfaceof a building envelope assembly. The heat transfer film coefficientis also commonly known as the surface film conductance.Thermal transmittance U is the quantity equal to the steady-state or time-averaged heat flux from the environment on the oneside of a body to the enviro
23、nment on the other side, per unit tem-perature difference between the two environments, in W/(m2K).Thermal transmittance is sometimes called the overall coefficientof heat transfer or U-factor. Average thermal transmittance differsfrom clear-wall transmittance, in that the former considers all ther-
24、mal bridge effects in the assembly.Thermal emissivity is the ratio of radiant flux emitted by a sur-face to that emitted by a black surface at the same temperature. Emis-sivity refers to intrinsic properties of a materials surface and isdefined only for a specimen of the material that is thick enoug
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