ASD-STAN PREN 4660-004-2009 Aerospace series Modular and Open Avionics Architectures Part 004 Final draft of Proposed Standards for Packaging (Edition P 1)《航空航天系列 模块化和开放航空电子架构 第004.pdf
《ASD-STAN PREN 4660-004-2009 Aerospace series Modular and Open Avionics Architectures Part 004 Final draft of Proposed Standards for Packaging (Edition P 1)《航空航天系列 模块化和开放航空电子架构 第004.pdf》由会员分享,可在线阅读,更多相关《ASD-STAN PREN 4660-004-2009 Aerospace series Modular and Open Avionics Architectures Part 004 Final draft of Proposed Standards for Packaging (Edition P 1)《航空航天系列 模块化和开放航空电子架构 第004.pdf(42页珍藏版)》请在麦多课文档分享上搜索。
1、ASD STANDARD NORME ASD ASD NORM prEN 4660-004 Edition P 1 July 2009 PUBLISHED BY THE AEROSPACE AND DEFENCE INDUSTRIES ASSOCIATION OF EUROPE - STANDARDIZATIONAvenue de Tervuren, 270 - B-1150 Brussels - Tel. + 32 2 775 8126 - Fax. + 32 2 775 8131 - www.asd-stan.orgICS: Descriptors: ENGLISH VERSION Aer
2、ospace series Modular and Open Avionics Architectures Part 004: Final draft of Proposed Standards for Packaging Srie arospatiale Architectures Avioniques Modulaires et Ouvertes Partie 004 : Dernire proposition des Standards pour Packaging Luft- und Raumfahrt Modulare und offene Avionikarchitekturen
3、Teil 004: Endgltiger Entwurf des Standards fr Packaging This “Aerospace Series“ Prestandard has been drawn up under the responsibility of ASD-STAN (The AeroSpace and Defence Industries Association of Europe - Standardization). It is published for the needs of the European Aerospace Industry. It has
4、been technically approved by the experts of the concerned Domain following member comments. Subsequent to the publication of this Prestandard, the technical content shall not be changed to an extent that interchangeability is affected, physically or functionally, without re-identification of the sta
5、ndard. After examination and review by users and formal agreement of ASD-STAN, it will be submitted as a draft European Standard (prEN) to CEN (European Committee for Standardization) for formal vote and transformation to full European Standard (EN). The CEN national members have then to implement t
6、he EN at national level by giving the EN the status of a national standard and by withdrawing any national standards conflicting with the EN. Edition approved for publication 31 July 2009 Comments should be sent within six months after the date of publication to ASD-STAN Engineering Procedures Domai
7、n Copyright 2009 by ASD-STAN prEN 4660-004:2009 (E) 2 Contents Page Foreword4 0 Introduction5 0.1 Purpose.5 0.2 Document structure.6 1 Scope 6 2 Normative references 7 3 Terms, definitions and abbreviations8 3.1 Terms and definitions .8 3.2 Abbreviations.8 3.3 Precedence.9 3.4 Definition of terms .9
8、 4 Generic module specification 11 4.1 Introduction. 11 4.2 Module description. 12 4.3 Module Physical Specification 12 4.4 Module Physical Interface - Connector 16 4.5 Module Physical Interface - Cooling. 20 4.6 Module Physical Interface Insertion Extraction Device. 23 5 Module Mechanical Tests 25
9、5.1 Master gauge test . 25 5.2 Module insertion and extraction . 25 6 Guidelines for a rack slot. 27 6.1 Introduction. 27 6.2 Interchangeability . 27 6.3 Rack Slot Design Requirements . 27 6.4 Connector interface 28 6.5 Conduction Cooled Interface. 29 6.6 Air Flow Cooled Interface 30 6.7 Relationshi
10、p between Cooling, Connector and IED Rack Interfaces 32 7 Typical modular avionics environment 33 7.1 Ambient pressure (altitude). 34 7.2 Humidity. 34 7.3 High and low temperatures 34 7.4 Thermal shocks. 35 7.5 Salt spray. 36 7.6 Vibrations 36 7.7 Accelerations 37 7.8 Mechanical shocks . 38 7.9 Cont
11、amination resistance 39 7.10 Flame resistance. 39 7.11 Fungus resistance 39 7.12 Rain 39 7.13 Acoustic noise 40 7.14 Electromagnetic environment . 40 7.15 Explosive atmosphere 40 7.16 Nuclear, Biological and Chemical (NBC) Hazards. 40 7.17 Sand and dust . 42 7.18 Single Event Upset / Multiple Bit Up
12、set 42 7.19 Module Tempest 42 prEN 4660-004:2009 (E) 3 Figures Page Figure 1 ASAAC Standard Documentation Hierarchy .5 Figure 2 Module definitions 10 Figure 3 CFM dimensions .13 Figure 4 Module Connector Interface Definition and Identification (connector inserts shown for example only) .16 Figure 5
13、Preferred Contact Identification (viewed from outside module, lowest numbered contact is towards Side C of the cassette) .17 Figure 6 Contact Identification MT Ferrule.18 Figure 7 Polarisation Key identification 19 Figure 8 Conduction Cooled Module Cooling Interface Definition20 Figure 9 Air cooled
14、module Cooling interface definition22 Figure 10 IED Hook characteristics .24 Figure 11 IED Implementation example.25 Figure 12 Rack Connector Physical Interface.28 Figure 13 Conduction Cooled rack guide rail .29 Figure 14 Air Flow Through and Direct Air Flow cooled rack guide rail30 Figure 15 Air Fl
15、ow Around cooled rack guide rail31 Tables Page Table 1 Allowed aluminium protective treatments.14 Table 2 Ambient pressure in relation to altitude 34 Table 3 Temperature environmental conditions - Conditioned bay .35 Table 4 Temperature environmental conditions - Unconditioned bay.35 Table 5 Tempera
16、ture environmental conditions - Storage35 Table 6 Thermal shocks 36 Table 7 Sinusoidal vibrations .36 Table 8 Rotational accelerations37 Table 9 Transversal accelerations .38 Table 10 Functional Shocks .38 prEN 4660-004:2009 (E) 4 Table 11 Summary of environment and bonding environmental Conditions.
17、 40 Table 12 Initial Nuclear radiation conditions 41 Table 13 Nuclear hardening conditions 41 Foreword This standard was reviewed by the Domain Technical Coordinator of ASD-STANs Engineering Procedures Domain. After inquiries and votes carried out in accordance with the rules of ASD-STAN defined in
18、ASD-STANs General Process Manual, this standard has received approval for Publication. prEN 4660-004:2009 (E) 5 0 Introduction 0.1 Purpose This document is produced under contract ASAAC Phase II Contract n97/86.028. The purpose of the ASAAC Programme is to define and validate a set of open architect
19、ure standards, concepts and guidelines for Advanced Avionics Architectures (A3) in order to meet the three main ASAAC drivers. The standards, concepts and guidelines produced by the Programme are to be applicable to both new aircraft and update programmes from 2005. The three main goals for the ASAA
20、C Programme are: 1. Reduced life cycle costs. 2. Improved mission performance. 3. Improved operational performance. The ASAAC standards are organised as a set of documents including: A set of agreed standards that describe, using a top down approach, the Architecture overview to all interfaces requi
21、red to implement the core within avionics system. The guidelines for system implementation through application of the standards. The document hierarchy is given hereafter: (in this figure the document is highlighted) Guidelines for System Issues System Management Fault Management Initialisation / Sh
22、utdown Configuration / Reconfiguration Time Management Security Safety Standard for Architecture Standard for Common Functional ModulesStandard for Communications and Network Standard for Packaging Standard for Software Figure 1 ASAAC Standard Documentation Hierarchy prEN 4660-004:2009 (E) 6 0.2 Doc
23、ument structure The document contains the following sections: Section 1, Scope. Section 2, Normative references. Section 3, Terms, definitions and abbreviation. Section 4, Generic module specification. Section 5, Module Mechanical Tests. Section 6, Guidelines for a rack slot. Section 7, Typical modu
24、lar avionics environment. 1 Scope The purpose of this standard is to establish uniform requirements for Packaging for the Common Functional Modules (CFM) within an Integrated Modular Avionic (IMA) system, as defined per ASAAC. It comprises the module physical properties and the Module Physical Inter
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