ARMY MIL-M-64034-1986 MICROCIRCUIT SYNCHRONIZER COMMAND OUTPUT (SCO) CLASS B MONOLITHIC CMOS INTEGRATED CIRCUIT《B级命令输出(SCO)同步器单块集成微电路和互补金属氧化物半导体集成电路》.pdf

《ARMY MIL-M-64034-1986 MICROCIRCUIT SYNCHRONIZER COMMAND OUTPUT (SCO) CLASS B MONOLITHIC CMOS INTEGRATED CIRCUIT《B级命令输出(SCO)同步器单块集成微电路和互补金属氧化物半导体集成电路》.pdf》由会员分享，可在线阅读，更多相关《ARMY MIL-M-64034-1986 MICROCIRCUIT SYNCHRONIZER COMMAND OUTPUT (SCO) CLASS B MONOLITHIC CMOS INTEGRATED CIRCUIT《B级命令输出(SCO)同步器单块集成微电路和互补金属氧化物半导体集成电路》.pdf（12页珍藏版）》请在麦多课文档分享上搜索。

1、, MIL-M-69034 13 W 7779906 0353587 8 W -7-=- b542 -3.3 MIL-M-64034(AR) 20 OCTOBER 1986 MILITARY SPECIFICATION MICROCIRCUIT, SYNCHRONIZER, COMMAND OUTPUT (SCO), CLASS B, MONOLITHIC, CMOS, INTEGRATED CIRCUIT This specification is approved for use within the U.S. Army Armament, Munitions and Chemical C

2、ommand, and is available for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification contains requirements not b Provisions for the fabrication of parts and assemblies of the normally covered by drawings and provided Quality Assurance Synchronizer, Co

3、mmand Output. 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications and standards. Unless otherwise specified, the following specifications and standards of the issue listed in that issue of Department of Defense Index of Specifications and Standards (DODSIS) specified in the solici

4、tation, form a part of this specification to the extent specified herein. 0 SPECIFICATIONS MILITARY MIL-M-38510 - Microcircuits, General Specification For. MIL-A-48078- - Ammunition, Standard Quality Assurance Provisions, General Specification for. MIL-M-55565 - Microcircuits, Packaging of. STANDARD

5、S MILITARY MIL-STD-883 - Test Methods and Procedures for Microelectronics. Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improv- ing this document should be addressed to: Commander, U.S. Army Armament, Munitions and Chemical Command, Attn:

6、AMSMC-QA, Dover, New Jersey 07801-5001 by using the self-addressed Standardization Document Improve- ment Proposal (DD Form 1426) appearing at the end of this document or by letter. THIS DOCUMENT CONTAINS / 2 PAGES. AMSC N/A FSC 1345 DISTRIBUTION STATEMENT A. Approved for public release; distributio

7、n is unlimited. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-M-bLI03LI 13 m 777770b 0353588 T 2.1.2 Other Government documents, drawings, and publications. The following other Government documents form a part of this specification to the exten

8、t herein. DRAWINGS U.S. ARMY ARMAMENT RESEARCH, DEVELOPMENT AND ENGINEERING CENTER ( ARDEC) 1900107-200 - Synchronizer, Command Output - Schematic 1900097-202 - Synchronizer, Command Output - Schematic 9333603 - Synchronizer, Command Ouput. Diagram (Mines). Diagram (CI). (Copies of specifications, s

9、tandards, drawings and publications required by the suppliers in connection with specific procurement functions should be obtained from the procuring activity or as directed by the contracting officer). 2.1.3 Order of precedence. In the event of a conflict between the text of this specification and

10、the references dated herein, the text of this specification shall take precedence. 3. REQUIREMENTS 3.1 Device classification. The microcircuit (device) shall conform to the product assurance level Class B, Monolithic, CMOS of MIL-M-38510 and as specified herein. 3.2 Device. The device shall comply w

11、ith all requirements specified on Drawing 1900097-200 (mines) and 1900097-202 (CI) and with all requirements specified in applicable specifications and standards and as specified herein. 3.2.1 Design and manufacturing. Suppliers implementation of design, processing, manufacturing equipment and mater

12、ials instructions in accordance with MIL-M-38510, Appendix A, as well as rebounding and rework criteria per applicable paragraphs of MIL-M-38510, are subject to review and approval by the procuring activity. Paragraphs of MIL-M-38510 concerning (a) line certification, (b) product assurance program p

13、lan, and (c) initial and periodic qualification, are not applicable. . 3.2.2 Design and construction. (1) Physical dimensions connection diagram, and pin assignments: See Figure 1 of Dwg. 9333603. 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL

14、-M-6403Ll L3 U 9999906 0353589 L M MIL-M-64034 (AR) (2) Lead Finish: Finish C in accordance with MIL-M-38510, 3.3 Environmental and mechanical. Devices to be delivered under this specification shall be capable of meeting the following MIL-STD-883 environmental and mechanical tests when the devices a

15、re subjecte to these tests in accordance with this specification. Environmental Tests Moisture resistance Steady state life Temperature cycling High temperature storage Seal (Fine and Gross) Burn-in Mechanical Tests Constant acceleration Mechanical shock Solderability Lead integrity Resistance to so

16、lvents Vibration, variable f r equenoy External visual Internal visual Bond strength Physical dimensions Met hod 1004 1005 1010 1008 1014 1015 Method 2001 2002 2003 2004 2015 2007 2009 2010 2011 2016 Conditions D, 100 hrs 125OC C, 10 cycles C (A or B & C) D, 168 hrs 125OC respect i ve 1 y Conditions

17、 E, Y1 orientation B only B2 A B D 3.4 6. The device shall have the following electrical characteristics. 3.4.1 Absolute maximum ratings. See Table I of Dwg. 9333603. 3.4.2 Operating conditions (Inputs), The components shall be operational in the conditions specified in Table II of Dwg. 9333603. 3.4

18、.3 Electrical characteristics. The component shall meet the electrical performance characteristics specified in Table III of Dwg. 9333603. 3.5 Sequential performance. Sequential performance testing or the fast clock lockout and FSK Manchester to NRZ Decoder are described in Bwg. 9333603. 3 Provided

19、by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-M-b403i 13 7777906 0353570 8 MIL-M-64034 (AR) 3.6 Required tests and suggested methods of examination. The test methods which follow are intended to convey the idea of what is to be tested and provide a simp

20、le method of doing it. recognized that automatic (computerized) tests will differ as to implementation of the test. Each test shall be run at minimum and maximum operating supply voltage as specified in Table I of Dwg. 9333603 unless otherwise specified. It is 3.6.1 Operating current. This test veri

21、fies the requirement of Table III of Dwg. 9333603 Connect the device under test as shown in Figure 3 of Dwg. 9333603 and measure the current out of Pin 27 or into Pin 13. Verify that the current value is within the range specified in Table III of Dwg. 9333603. 3.6.2 LO frequency. This test verifies

22、the requirements of Table III of Dwg. 9333603. Connect the device under test as shown in Figure 3 of Dwg. 9333603 and measure the frequency of the signal at Pin 17. Verify that the frequency is as specified in Table III of Dwg. 9333603. 3.6.3 DCL frequency. This test verifies the requirement of Tabl

23、e III of Dwg. 9333603. Connect the device under test as shown in Figure 3 of Dwg. 9333603. Switch PSD (Pin 26) to +5V and verify the frequency of DCL (Pin 4) is the max. value as specified in Table III of Dwg. 9333603. Switch PSD (Pin 26) to ground and verify the frequency of DCL (Pin 4) is the mini

24、mum value as specified in Table III of Dwg. 9333603. 4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-M-64034 13 m 7777706 0353571 T m MIL-M-64034 (AR) 3.7 Screeninq. All devices shall be 100% screened in full accordance-with MIL-STD-883, Method

25、 5004, class b. Final electrical tests per Table III of Dwg. 9333603. Burn-in per Figure 1 herein. +5v Figure 1 . Burn-in circuit (or .equipment) 3.7.1 Pre-Burn-in electrical tests. Pre-Burn-in electrical tests shall include all parameters specified in Table III of Dwg. 9333603 measured at TA = 25OC

26、. done in accordance with D(2) of Dwg. 9333603. 3.7.2 Final electrical tests. Final electrical tests shall he 5 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-M-bO34 13 7777706 0353572 I MIL-M-64034 (AR) 3.8 Part marking. Only parts having met a

27、ll requirements herein shall be marked with the following information in accordance with MIL-M-38510: (A) manufacturers name or symbol, (B) manufacturers date code (traceable to the wafer manufacturers diffusion run) (C) the source control number “1920050CN9333603“. Note: Once the part has been mark

28、ed, the part is classifed confidential and shall be handled as such. 3.8.1 Other marks. The vendor may add additional markings, for his own use, on the bottom surface of the package provided that these markings do not interfere with the required markings. when subjected to the resistance to solvents

29、 testing of MIL-STD-883, Method 2015. manufacturing of microcircuits to assure a reliable end item shall be submitted to the designated agency specified in 6.3 herein prior to the start of fabrication. 3,8.2 Resistance to solvent. The marking shall remain legible 3.9 Process control. All process con

30、trols essential fol: the 3.10 Workmansh&. (See MIL-M-38510) 4. QUALITY ASSURANCE PROVISIONS 4.1 Responsibility for inspection and standard quality assurance provisions. Unless otherwise specified herein or in the contract, the provisions of MIL-M-38510 shall apply and are hereby made part of this de

31、tail.specification. for the performance of all inspection requirements as specified herein, and the supplier may use his own or any other facilities suitable for the performance of the tests and inspection requirements speciied herein, unless disapproved by the Government. In addition, the Governmen

32、t reserves the right to witness or to perform any of these tests and inpections set forth in this specification where such test and inspections are deemed necessary to assure that supplies and services conform to prescribed requirements. resulting from the manufactuuers performance of these tests an

33、d inspections. The supplier is responsible The Government reserves the right to audit the data 4.2 Classification of inspections. The following types of inspection shall be conducted on this item. a. First Article Inspection b. Quality Conformance Inspection c. Screening. 6 Provided by IHSNot for Re

34、saleNo reproduction or networking permitted without license from IHS-,-,- ._ MIL-M-64039 13 m 777970b 0353593 3 m MIL-M-64034(AR) 4.3 First article inspection. 4.3.1 Submission, The contractor shall submit a first article . sample as designated by the Contractinq Officer for evaluation in accordance

35、 with the provisions of 4.3.2 The first article inspection lot size after screening shall consist of fifty (50) devices, minimum. 4.3.2 Inspection to be performed. First article inspection shall be in accordance with the applicable requirements of MIL-M-38510 and as modified by this specification, e

36、xcepth that the procuring agency shall be the qualifyinq activity. requirements shall consist of inspections specified in subgroups “a“ through iifr listed in Table IV herein. First article items may be subjected by the qualifying activity (Government) to all of the examinations and tests specificed

37、 in this specification and to any requirements of the applicable drawings. If any device fails to comply with any of the applicable requirements, the first article sample shall be rejected. inspection upon any failure of a device in the sample to comply with any of the stated requirements. First art

38、icle 4 * 4.3.3 Rejection. The Goverment reserves the riqht to terminate its 7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-U-64034 13 = 9777706 0353574 5 W C O U u al rn E al rl u er( U Li a U a Li 4 cr, .d .r( s H W 4 E-i 2 U I a U rr O ro C

39、a E u Li al N .d C O Li c u E h m U !3 u Li .d u O Li u - b .d i .d :c - a )-i O a) mil -0 . - m m m m m milm mm e*m . o mmm m m m m m mmm . o . . o mm . I h .m - Cu m- In In 1C.l P4 uu ouioui h u C al 1 ac al u C m U u) .d rn al u al U a O c !3 .d n Y id al d al C 4 iCI U I4 a al VI h Y a al rl rn

40、rn O u tn rl a al m Y rn U C al 3 ri O u) O U ual Lia nrn rra, .d ma ? - NI rn d rl I a 5 C O n U 5 oi C al Li L) rn a E O El 8 ,- .+i 6 .- .I- . Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-M-bLI03LI 13 m 777770b 0353575 7 m - L e -0 U .rl .r

41、l 1 CJ & t iF U I a U I O 5 c id E V Li a, N .rl C O Li c o c 3.1 rn U 1 o Li 8 4 5 .rl mm a30 COO IN m5 mo IC 44J Ha cc n 5 m a, 3wc ooid c EUU k 7 Em mu, PIa, coo O d . m. mmm mm m mmm . . e. e n 5 a, U o a, a VI C .d rn 5 id a, d 3.1 U .rl ml Y h Y m al d al c .d %I Y rl id a, cn h Y id a, rl 111

42、 8 Li tn rl a a, rn Y N id 5 drnrn rn-dLiE w .d .FI .rl 3 a 7 . 9 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-M-64034 (AR) 4.3.4 Requalification. The device shall be subjected.to another First Article as stipulated in the contract if: affect

43、the form, fit, function or internal geometry of the device by either the contractor or one of his sub-contractors supplying parts assemblies. a. The contractors manufacturing techniques or process b. The contractor relocated his assembly facilities. c. The contractor uses a new sub-contractor for ma

44、terial, parts, or assembly. d. A change occurs in devices material, performancp or assembly. 4.4 Quality conformance inspection. 4.4.1 inspection lot formation. inspection lots formation shall be as defined in MIL-M-38510 for Class B devices. 4.4.2 Examination. a. Quality conformance inspection requ

45、irements shall be in accordance with Tables I, II, III of Dwg. 9333603 and specified herein. b. Inspection requirements. Inspection requirements for this device shall be in accordance with the requirements of MIL-M-38510 and MIL-STD-883B8 Method 5004.4 (Class B). C. Conformance testing. Groups A, B,

46、 C, and D test procedures shall be in accordance with MIL-STD-883, Method 5005, Class B. Group A electrical tests per Table III of Dwg. 9333603. Groups C and D end point parameters per Table III of Dwg. 9333603. Sampling plan shall be in accordance with applicable paragraphs of MIL-M-38510, Appendix

47、 B. d. General inspection conditions. Disposition of failed lots and lot resubmission procedures shall be in accordance with applicable paragraphs of MIL-M-38510. 10 1 h Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-M-bV034 13 7797706 0353577 O

48、 W MIL-M-64834 (AR) 4.5 eures. 4.5.1 Alternate methods, circuits and procedures. Unless otherwise sshods and circuits shown are given as the basic measurement method. For alternate methods, circuits and procedures the manufacturer shall demonstrate to the procuring activity that alternates which he

49、may desire and propose to use are equivalent: and give results within the desired accuracy of measurement (See 6.3) 4.5.2 Test conditions. Unless otherwise specified all examinations and tests shall be made undeic the following conditions: Temperature - 250 t 3OC Humidity - 10 to 70 percent M Pressure - 29 - .t 3 inehes of Hg 5. PACKING 5.1 Packaginq req