ARMY MIL-C-70492-1985 CIRCUIT CARD ASSEMBLY MODEM《电路板组装调制解调器》.pdf

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1、4 - -r I MIL-C-70472 32 7777706 0355233 b MIL-C-70492 (AR) 04 APRIL 85 MILITARY SPECIFICATION CIRCUIT CARD ASSEMBLY, MODEM This specification is approved for use by the US Army Armament, Munitions and Chemical Command and is available for use by all Departments and Agencies of the Department of Defe

2、nse, 1. SCOPE 1.1 Scope. This specification establishes the requirements for manufacture and acceptance of the Modem Circuit Card Assembly: 9355760, used in the Mortar Ballistics Commter (MBC): - M23. 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specification and standards. Unless otherwi

3、se specified, the following specifications and standards of the listed in that issue of the Department of Defense index of Specifications and Standards (DoDISS) specified in the solicitation form a part of this specification to the extent 0 specified herein. SPECIFICATIONS issue MI LI TARY 5i MIL-F-

4、13926 - Fire Control Materiel; General MIL-1-45607 inspection Equipment, Acquisition, Specification Governing the Manufacture and Inspection Maintenance and Disposition of STANDARDS MILITARY MIL-STD-105 - Sampling Procedures and Tables for MIL-STD-109 Quality Assurance Terms and Inspection by Attrib

5、utes Definitions FSC 1220 Beneficial comments (recommendations, additions. deletions) and any pertinent data which may be of use in improving this document should be addressed to: Commander, US Army Armament Research and Development Center, Ath: AMSUC-QA, Dover, New Jersey 07801-5001 by using the se

6、if-aressed Standardization Document Improvement Propoeal (DD Form 1426) appearing at the end of this document or by letter. / , THIS DOCUMENT CONTAINS -?3 - PAGES _- Y- /- - /y- Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-454 - - EPeetrsn

7、fesl Equipment, GeneEal MIL-STD-1521 - Technieal Reviews and Audits for Requirements for Systems, Equipments, and Computer Programa MIL-STD-45662 - Calibration System Requirements (Copies of specifications and standards required by suppliers in conrnection with specific procurement functions shcxld

8、be obtained from the procuring activity or as directed by the esntraetdng officer 1 2.1.2 !e The following other Government documents, drawings, and publications form a part of this specification to the extent specified herein. Unless otherwise indicated, the issue in effect on date of invitation fo

9、r bids or request for proposal. 9355760 - Circuit Card Assemb%y, 9379254 - Software ,. Test Statim-Modem CCA 11785850 - Computer Set, Ballistics, b.flrtt: ha23 maem PACKAGING DATA SHEETS - Packaging of Circuit Cara Assembly, Modefi: 9355760 9355760 (Copies of drawings and packaging data sheets requi

10、red bay manufacturers +in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting officer.) 2.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein, the text o

11、f this specification shall take precedence. 3, REQUIREMENTS 3.1 Item definition. The modem circuit card assembly provides a digital communication link for the Mortar Ballistics Computer to communicate with other compatible Army systems, As shown in Figure I, the three major sections of the circuit c

12、ard assembly include the FSK modem, message preprocessor, and 1/0 control with a status register. The assembly also includes the control circuitry for the LED indicators and audible alarm. The connector contacts are listed in Table I. 2 Provided by IHSNot for ResaleNo reproduction or networking perm

13、itted without license from IHS-,-,-MIL-C-70472 12 W 7777906 0355233 T m brn-C-70492( AR) I I I I I I I I l I I 1 1 O c :. r I I I- 80 ti Elm rl I I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Connector P1 PP P1 P1 P1 P1 P1 Pl P1 P1 P1 P1 P1 P1 F

14、l P1 Pa. P1 P1 P1 Pl P1 Pl P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 l?1 P1 P1 P1 P1 F1 P1 P1 P1 P1 P1 P1 MIL-C-78492 (AR) TABLE I, Modem circuit card assembly connector contacts . Pin - Al A2 A3 A4 A5 A6 A7 A8 A9 A10 All A12 Al 3 A14 Al 5 A16 A17 A18 A19 A20 A21 A22 A23 A24 A2 5 A26 A2 7 A28 A29 A30 A3 1 A3

15、2 A3 3 A34 A3 5 A36 A3 7 A3 8 A3 9 A40 A41 A42 A4 3 A44 A4 5 A46 8ignal Name a5v AB00 ABO1 AB02 AB03 AB04 +5v CFSK WXMT MFSK MODINT“ BEMOD I NT* MC600 DACLK* ROMlCLK* ROM2CLK“ RCDATA RCCLK DCCFSK MC19K +5v MBRST* MCCLR SYNCRST DAENSET* DARST* SAMREGRST * DMODRST“ LDCNT40* RSTRDBC* Spare Spare SEQLED

16、 BATLED Pin B1 I32 R3 B4 35 B6 B7 B8 B9 B1Q l311 B12 B13 B14 B15 B16 317 B18 B19 328 B21 822 B23 E324 325 B26 B27 B29 330 B31 B32 B33 B34 B35 B36 B37 B38 B39 B40 B41 B42 B43 B44 B45 B46 - 28 Signal Name GND DB O DBP BB 2 DB 3 DB4 BB5 DIB 6 DB3 RD“ wT* IO/M* Spare LE GND WIREN Spare XMTKY XMTKYR MC60

17、0 DCALK“ ROMPCEK* ROM2CLK“ RCDATA RCCEK DCCFSK MC19K GWD 614.4KHZ 5Hz 2Hz 1Hz 2SEC 3SEC 6SEC LEDDC DSPON“ BATLOW ONLED MS G LED Spare 4 - a 1 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-I I I i I l O MIL-C-70LI72 12 7797706 0355215 3 - MIL-C-7049

18、2(AR) TABLE I. Modem circuit card assembly connector contacts.-Continued P1 . A47 MC9 . 6K B47 MSGLED P1 A4 8 MC2400 B48 MC2400 P1 A49 MC1200 B49 MC1200 i P1 A50 -5v B50 GMD 3.2 Performance. The performance of the Modem circuit card assembly shall be in accordance with the following requirements. 3.

19、2.1 Functional. The modem circuit card assembly shall be attached to the Computer Automation CA8200 tester or equivalent, using the connections as specified in Table IV and pass the test patterns induced by Test Station Software-Modem CCA: 9379254. 3.2.2 Physical characteristixx. The physical charac

20、teristics shall be as prescribed by the drawings, specifications, and QAPs. 3.2.3 Reliability. When specified in the contract, a special sample shall be subjected to reliability testing. The manufacturing and production techniques emloyed in the fabrication of the Modem circuit card assembly shall n

21、ot degrade the inherent reliability. The inherent reliability shall not be less than 84,422 hours Mean Time Between Failures (MTBF). meet the requirements specified herein unless otherwise specified. (See 4 and 6) 3.3 Environmental. The modem circuit card assembly shall 3.3.1 Room ambient temperatur

22、e. The requirements of this specification shall be met with the modem assembly thermally stabilized at room ambient temperature of +160C to +32% (+60OF to +900F), unless otherwise specified in the requirements paragraph. modem circuit card assembly shall meet the requirements of 3.2.1 after having b

23、een exposed to a minimum of ten temperature cycles at temperatures of -57% and +710C (-71OF and +1600F). 3.3.2 Environmental stress screen (ESS) temperature. The 3.3.3 Environmental stress screen (ESS) vibration. The modem circuit card assembly shall meet the requirements of 3.2.1 after having been

24、subjected to a random or psudorandom vibration which includes .frequency content from 100 Hz to 1000 Hz and up to a 3g RMS in two axis for a period of 10 minutes plus or minues 15 seconds . 3.4 Fabrication. The modem circuit card assembly shall be manufactured in accordance with drawing 9355760. 5 P

25、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-70472 12 m 77777Ob 03552Lb 5 m MIE-C-90492 (AR) 3.5 First article, When specified in the contract, a sample shall be subjected to first article inspection (See 4 and 6). 3.6 Workmanship. The workma

26、nship requirements of MIL-F-13926 and MIL-STD-454 shall be met. Al1 components shall be fitted properly and firmly in their respective positions. AI1 electrical connections shll be mechanically secure and Glectrically sound. -There shall be no evidence of corrosion, burrs, roughness, sharp edges or

27、other defects which could adversely affect its use or suitability for the purpose intended. 3.7 Materials. Materials shI1 be in accordance with drawings, material specifications and generl specifications forming a part of this specification. 4. QUALITY ASSURANCE PROVISIONS 4.1 Responsibility for ins

28、pection. Unless otherwise specified in the contract or purchase order, the contractor is responsible or the performance of a11 inspection requirements as specified herein. Except as otherwise specified in the contract or purchase order, the contractor may use his own or any other facllities suitable

29、 for the performance of the inspection requirements specified herein, unless disapproved by the Government. The Government reserves the right to perform any of the inspections set forth in this specification where such inspections are deemed necessary to assure supplies and services conform to presc

30、ribed requirements. I 4.1*1 General provisions. -The component and subassembly inspection requirements of MIL-F-13926 and MIL-STD-454 form a part of the Quality Assurance Provisions of this specification. Definitions of inspection terms shall be as listed in MIL-STD-109. 4.2 First article (initial p

31、roduction) approval. The requirement for first article approval and the responsibility (Government or contractor) for first article testing shall be as specified in the contract. .The sample for first article approval test shall consist of three (3) modem circuit card assemblies plus three (3) each

32、of all items covered by QAP. The three modem circuit card assemblies shall be tested as specified herein for all the requirements of this specification. The items covered by QAP shall be tested, as specified thereon, for all characteristics dlineated on the QAP. The samples shall be manufactured in

33、the same manner, using the same materialc, equipment, processes, and procedures as wlll be used in the production of the balance of the contract quantity. All parts and materials, including packaging and packing, shall be obtained from the same source of supply as wlll be used in the production of t

34、he balance of the contract quant it y. 6 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-7Q492 (AR) 4.2.1 Government testinq. When the Government is responsible for conducting first article approval tests, the contractor prior to submitting the

35、 sample to the Government, shall inspect the sample to insure that it conforms to a81 requirements of the contract and submit a record of this inspection with the sainplel including certificates of conformance for all materials. O 4.2.2 Contractor testing, When the contractor 1s responsible for cond

36、ucting first article approval tests, the sample shall be inspected by the contractor foi-all the requirements-f the contract. The sample and a record of this Inspection, including certificates of conformance for all materials, shall be submitted to the Government for approval. The Government reserve

37、s the right to witness any or all of the contractors inspections. t 4.3 Inspection provisions. 4.3,P &.k. Unless otherwise specified by the contracting officer, inspection Ist size, lot formation, and presentation of lots shall be in accordance with “Submission of ProductC provision of MIL-STD-105.

38、4-3.2 Examination and tests. 4.3.2.1. 1. APP components arid subassemblies shall be inspected in accordance with the inspection provisions contained in Quality ssurance Provisions (QAP s) listed in the Technical. Bata Package (TDP). In the absence of QABss, the applicable Quality Assuramce Provision

39、s of MIL-F-13926 ahaff apply. 4*4 Sampling. 4.4,l Environmental/performance. The modem circuit card assembly shall be inspected to the requirements in Table II. TABLE II. Classification of defects. - No. Characteristics Requirement Test Procedure 100% inspection 1. Functional test 2. ESS temperature

40、 3. ESS vibration MAJOR: AQL 1.0% Defective 101. Workmanship 3.2.1 3.3.2 3.3.3 3.6 4.6.3 4.6.1 4.6.2 4.6.4 7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-70LI72 32 m 7777906 0355238 7 m 4.4.2 Special sampling. One modem circuit card assembly

41、 shall be selected at random as a special sample from each lot or each 100 produced which ever occurs first. The sample shall meet the requirements and tests in Table III. TABLE III. Classification of defects. - No. Characteristics Requirement Test Procedure 201. Fabrication 202. Materials 3.4 3.7 A

42、pplicable Drawing/ Visual Applicable Drawing/ Visual NOTE: The tests in Table III shall be conducted at room ambient temperature (as specified in 3.3.1). sampling fail to meet the specified test requirements, acceptance of the represented inspection lot will be suspended by the Government until nece

43、ssary corrections have been made by the contractor and resubmitted items have been approved in accordance with “Acceptance and Rejection“ as specified in MIL-STD-105. by the contract, the contractor shall supply and maintain inspection equipment in accordance with the applicable requirements of MIL-

44、1-45607. contract provides for Government furnished test equipment, supply and maintenance of test equipment shall be in accordance with the applicable requirements specified in MIL-1-45607. 4.4.3 Failure of sample. Should any one item of a special 4.5 Inspection equipment. Except as otherwise provi

45、ded for 4.5.1 Government furnished inspection equipment. Where the 4.5.2 Contractor furnished inspection equipment. 4.5.2.1 Government design. All inspection equipment specified by drawing number in specificationor QAP forming a part of the contract shall be supplied by the contractor in accordance

46、with technical data included in the Technical Data Package List (TDPL) . 4.5.2.2 Contractor design. In the absence of Government inspection equipment design, the contractor shall design and supply inspection equipment compatible with the “Test Methods and Procedures specified in 4.6 of this specific

47、ation and with the component inspection procedures specified in “Examination“ and “Test Facilities“ requirements of MIL-F-13926. Since tolerance of test equipment is normally considered to be within 10% of the product tolerance for which it is intended, this inherent error in the test equipment desi

48、gn must be considered as part of the 8 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-t MIL-C-70472 12 W 7777706 0355237 O prescribed product tolerance limit. materials, dimensions, and tolerance used in the design of test equipment shall be so sele

49、cted and controlled as to insure that the test equipment will reliably indicate acceptability of a product which does not exceed 90% of the prescribed tolerance limit, and permit positive rejection when non-conforming. Construction shall be such as to facilitate routine calibration of test equipment. Thus, concept, construction, 4.5.2.3 Inspection equipment desi