ARMY MIL-C-70491-1985 CIRCUIT CARD ASSEMBLY DISPLAY PROCESSOR《电路板组装显示 处理器》.pdf

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1、MIL-C-70Ll71 12 m 77777Ob 0355187 b m 5 -37-03 MIL-C-70491 (AR) 04 APRIL 85 MILITARY SPECIFICATION CIRCUIT CARD ASSEMBLY, DISPLAY/PROCESSOR This specification is approved for use by the US Army Armament, Munitions and Chemical Command and is available for use by all Departments and Agencies of the D

2、epartment of Defense. 1. SCOPE 1.1 Scope. This specification establishes the requirements for manufacture and acceptance of the Display/Processor Circuit Card Assembly: 9379229-1, used in the Mortar Bllistics Computer (MBC): M23. 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specification

3、and standards. Unless otherwise specified, the followins specifications and standards of the issue listed inthat issue of-th Department of Defense index of Specifications and Standards (DoDISS) specified in the solicitation form a part of this specification to the extent specified herein. SPEC IF IC

4、AT IONS MILITARY MIL-F-13926 - Fire Control Materiex; General Specification Governing the Manufacture and Inspection Maintenance and Disposition of MIL-1-45607 - Inspection Equipment, Acquisition, FSC 1220 Beneficial commenta (recommendations. additions, deletions) uid any pertinent data which may b

5、e of une in improving thin document should be addressed to: Commander, US Army Armament Research and Development Center. Attax ASHC-QA, Dover, New Jersey 07801-5001 by using the seif-oiddreued Standardization Document Improvement Proposal (DD Form 1426) ippeuin# at the end of this document or by let

6、ter. /- At THIS WCUMENT CONTAINS PAGES i Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-70473 32 M 7777706 0355370 2 M MIL-C-70491 (AR) MIL-STD-10 5 - Sampling Procedures and Tables for Inspection by Attributes MIL-STD-109 - Quality Assurance

7、Terms and Definit ions M IL-STD-4 54 - Eleetsnic Equipment, General Requirements or MIL-STD-1521 - Teckniaal Reviews and Audits for Systems, Eqnipments, and Computer Programs MIL-STD-45662 - Calibration System Requirements (Copies of specifications and standards required by suppliers in connection w

8、ith specific procurement functions should be obtained from the procuring activity or as directed by the Contracting officer .) 2.1.2 Other Goverment documents, drawings, and publications. The following other Government documents, drawings, and publications form a part of this specification to the ex

9、tent specified herein. Unless otherwise indicated, the issue in effect on date of invitation for bids or request for proposal. DRAWINGS 9379229-1 - Clrcuft Card Assembly, Display/Processor 9379253 - Software, Test Station-Display/ Processor CCA 11785850 - Computer Set, Ballistics, Mortar: M23 PACKAG

10、ING DATA SHEETS 9379229-1 - Packaging of Circuit Card Assembly, Dispay/Proeessor3: 9379229-1 (Copies of drawings and packaging ata sheets required by manufacturers in connection with specific acquisition functions shold be obtained from the contracting activity or as directed by the contracting offi

11、cer.) 2.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein, the text of this specification shall take precedence. 2 .Y t Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- MIL-C-7047

12、1 12 m 7777706 0355191 4 m MIL-C-70491 (AR) 3 . REQUIREMENTS 3.1 Item definition. The display/processor circuit card assembly provides the Mortar Ballistic Computer (MBC) with the following: a. An 8 bit CMOS microprocessor. b. 2048 8-bit words of CMOS Random Access Memory (RAM). c. 16 384 contractor

13、 chooses to use 4.6.1 ESS temperature. Testing equipment utilized in this test shall conform to the requirements of 4.5.2.3.1. The display/processor circuit card assembly shall be placed in the test chamber and the temperature of the chamber reduced 10% (180F) per minute plus or minus l0C (1.8OF) fr

14、om room ambient temperature (as specified in 3.3.1) to -57OC (-7lOF). The assembly shall be maintained at this temperature for a minimum of 20 minutes. Upon completion of the 20 minute exposure, the temperature of the chamber shall be raised 10% (180F) per minute plus or minus 1C (1.80F) to +710F (+

15、160OC). The assembly shall remain at this temperature for a minimum of 20 minutes. Upon completion of the 20 minute exposure the temperature of the chamber shall be reduced 10% (180F) per minute plus or minus 1OC (1.80F) to room ambient temperature (as specified in 3.3.1). The above procedure shall

16、be conducted a minimum of ten times. upon completion of the cycles the assembly shall then be removed from the chamber and subjected to the test in 4.6.3. It shall meet the requirements of 3.2.1.1. 4.6.2 ESS vibration. Conduct the vibration test with the display/pro-t card assembly positioned on an

17、appropriate adapter affixed to a vibrating machine that is capable of providing the amplitudes and frequencies specified in 3.3.3. Unless otherwise specified, the test equipment shall be in accordance with the “Test Facilities“ requirements of MIL-F-13926. The applied motion shall be in two separate

18、 planes for the time period specified. Upon completion of the vibration sweep the assembly shall be removed from the vibration adapter and shall be subjected to the test in 4.6.3. It shall meet the requirements of 3.2.1.1. 14 Provided by IHSNot for ResaleNo reproduction or networking permitted witho

19、ut license from IHS-,-,-MIL-C-70!i91 12 9999906 0355203 7 m MIL-C-70491 (AR) 4.6.3 Functional. This test is to be conducted utilizng the computer must have prior approval of the procuring activity. The display/processor circuit card assembly shall be attached to the CA8200 utllizing appropriate fixt

20、ures and/or cables and connected as specified in Table IV. The assembly shal be tested in accordance with the tegt patterns contained on the- Test Station Software-Display/Processor CCA: activity. The assembly shall meet the requirements of 3.2.1.1. - Computer Automation CA8200 or equivalent. Use of

21、 an equivalent 9379253 provided by the procuring TABLE IV. Display/processor circuit card assembly test fixture connector contacts. Di splay/Proces sor Connect to CA8200 Connector P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 Pin Al A2 A3 A4 A5

22、 A6 A7 A8 A9 A10 All A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31 A32 A33 A34 - 15 Pin VO+ 322 323 324 325 326 327 328 329 330 331 332 333 334 335 336 337 339 340 341 342 343 344 345 346 347 348 349 350 351 352 354 - - VO+ vr+ Provided by IHSNot for ResaleNo reprod

23、uction or networking permitted without license from IHS-,-,- - MIL-C-70472 22 7777706 0355204 7 W MIL-C-70491 (AR) TABLE IV. Display/processor circuit card assembly test fixture connector contacts.-Continued Display/Processor Connect to CA8200 Pin Pin Connector - P1 A3 5 355 P1 A36 356 P1 A37 357 P1

24、 A38 358 P1 A39 359 P1 A40 360 P1 A41 361 P1 A4 2 362 P1 A43 363 P1 A44 364 P1 A4 5 365 P1 A46 366 P1 A4 7 367 P1 A4 8 368 P1 A49 369 P1 A50 370 P1 B1 GND P1 B2 372 P1 B3 373 P1 B4 374 P1 B5 375 P1 B6 376 P1 B7 377 378 379 P1 B8 P1 B9 P1 B10 380 P1 B11 381 P1 B12 382 P1 B13 383 P1 B14 384 Pl B15 385

25、 P1 B16 386 P1 B17 387 P1 B18 GND P1 B19 389 P1 B20 390 P1 B21 391 P1 B22 392 P1 B23 -v3+ P1 B24 394 P1 B25 395 P1 B27 397 P1 B26 396 P1 B28 398 16 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-70491 (AR) TABLE IV. DisplaS/processor circuit c

26、ard assembly test fixture connector contacts.-Continued Display/Processor Pin Connector - P1 P1 P1 P1 P1 P1 P1 P1 Pl P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 P1 TP TP TP TP TP TP TP TP TP TP TP TP TP TP TP TP TP TP TP TP TP TP B29 B30 B31 B32 B33 B34 B35 B36 B37 B38 B39 B40 B41 B42 B43 B44 B45 B46 B47 B4

27、8 B49 B50 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Connect to 17 CA8200 Pin - 399 400 401 402 GND 404 405 406 407 408 409 410 411 412 413 414 415 416 417 418 GND 421 422 423 424 425 426 427 428 429 430 431 432 433 434 435 436 437 438 439 440 441 442 - VZ+ Provided by IHSNot for Resal

28、eNo reproduction or networking permitted without license from IHS-,-,- MIL-C-70972 22 9999906 0355206 2 MIL-%-70491 (AR) TABLE IV. Display/processor circuit card assemb-ly test fixture connector contacts.-Continued Di splay/Pr ocessor Connect to CA8200 Connec tor TP TP TP TP TP TP TP TP TP TP TP TP

29、TP TP TP TP TP TP TP TP TP TP TP TP TP TP -TP TP TP TP TP giJ 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 Pin 443 444 445 446 447 448 449 450 451 452 453 454 455 456 457 458 459 460 461 462 463 464 465 466 467 468 469 470 471 472 473 - 4.6.4 Memory re

30、ad cycle. Tests 4.6.5 and 4.6.6 shall be performed by first connecting the following connector contacts together and then applying a 5.3 plus or minus .1 volt dc power supply to Pl-Al with respect to P1-B18 (GND). The display/processor assembly shall be initialized for memory tests by connecting Pl-

31、A25 (BREQ“) to GND and then momentarily connecting P1-B15 (RESET*) to GND. 18 . - . Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- MIL-C-70471 12 = 9999706 O355207 4 m - MIL-C-70491 (AR) Memory Test Connections Pl-Al to Pl-A33 Pl-Al to P1-B23 Pl-Al

32、9 to Pl-Bl9 P1-A43 to P1-B43 Pl-A44 to P1-B44 4.6.5 RAM write cycle. Pl-A45 to P1-B45 Pl-A46 to Pl-B46 P1-A47 to Pl-B47 Pl-A48 to P1-B48 P1-A25 to Pl-Bl a. Write to RAM with hexidecimal data (01) using the RAM write cycle specified in 3.2.1.3. b. Verify the data written to RAM is correct by reading

33、data from using the memory read cycle described in 3.2.1.2. c. Rotate to the right by 1 bit the data in the memory location being tested and reverify the data for each rotation. d. Data shll be written as in a. thru c. to the full range of RAM from hexideciml address (F800) to address (FFFF). e. Wri

34、te to the fll range of RAM from hexideciml address (F800) to address (FFFF) with hexidecimal data (00) using the RAM write cyc-le specified in 3.2.1.3. f. Write to the RAM location being tested with hexideciml data (FF) using the RAM write cycle specified in 3.2.1.3. g. Verify that 11 RAM addresses

35、that differ from the test addressby 1 bit contain hexidecimal data (00) by using the memory read cycle described in 3.2.1.2. h. Data shaIl be written as in e. thru g. to the fu.11 range of RAM from hexidecimal address (F800) to address (FFFF). 4.6.6 EPROM proqram cycle. An EPROM program cycle shall

36、be accomplished by applying the signals specified in Figure 3.4 and Table I. Pl-A39 sha-11 have the input parameters as specified on the EPROMs respective drawing. 4.6.7 EPROM erasure. The EPROM shal be erased by exposing the transparent window to high intensity ultraviolet light. A light sou;ce wit

37、h a wavelength of 2537 Angstroms yielding a minimum integrated dosage of 15 w-se/cm(2) is required. An ultraviolet light source with a power of 12,000 microwatts/cm(2) placed within 1 inch of the window will erase the EPROM in 20 minutes. The EPROM shall be erased when requirement 3.2.1.5 is met . 1

38、9 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- - MIL-C-7047L 12 m 9779706 0355208 b m MIL-C-70491 (AR) 4.6.8 Workmanship. The displap/processor circuit card assembly shll be subjected to a visudl and tactlle examination for evidence of faulty wor

39、kmanship. The assembly shall conform to the requirements of 3.6. 4.7 Reliability testing, The requirement for rliability test approval and the responsibility (Government or contractor) for re-liability testing shall be as specified in the contract. The sample for reliability test shall consist of 3

40、display/processor circuit card assemblies. The samples shall be manufactured in the same manner, using the same materials, equipment, processes, and procedures as will be used in the production of the balance of the contract quantity. AI1 parts and materials, including packaging and packing, shall b

41、e obtained from the same source of supply as will be used in the production of the balance of the contract quantity. 4.7.1 Government testinq. When the Government is responsible for conducting reliabllity tests, the contractor prior to submitting the sample to the Government, shall inspect the sampl

42、e to assure that it conforms to all requirements of the contract and submit a record of this inspection with the sample, including certificates of conformance for all materials. 4.7.2 Contractor testing. When the contractor is responsible for conducting reliability tests, the sample shall be inspect

43、ed and tested by the contractor for all the requirements of the contract. The sample and a record of these inspections and tests, including certificates of conformance for a11 materials, shall be submitted to the Government for approval. The Government reserves the right to witness any or a11 of the

44、 contractors reliability tests and inspections. 5. PREPARATION FOR DELIVERY 5,l Delivery requirements. Handling, packaging, packing, shipping, and marking of the display/processor circuit card assembly, 9379229-1 shall be in accordance with Packaging Data Sheet 9379229-1. The level of protection sha

45、ll be as specified in the procurement document. 6. NOTES 6.1 Intended use. The display/processor circuit card assembly described herein is intended for use in the MBC. See drawing 11785850. 20 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-C-704

46、91 (AR) 6.2 Orderinq data. Procurement documents shall specify the - fowing: a. Title, number and date of this specification. b. Provisions for first article testing. c. Provisions for reliability testing. d. Applicable Packaging Data Sheet. e. Applicable levels of preservation, packing, and marking (see 5.1). f. Applicable stock numbers. Custodian: Army-AR Preparing activity: Army-AR (Project 1220-A299) 21 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-