ARMY A-A-59134-1997 INSULATING COMPOUND ELECTRICAL EPOXY COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION《填满硅胶用于陶器制造和封装的电绝缘剂》.pdf

《ARMY A-A-59134-1997 INSULATING COMPOUND ELECTRICAL EPOXY COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION《填满硅胶用于陶器制造和封装的电绝缘剂》.pdf》由会员分享，可在线阅读，更多相关《ARMY A-A-59134-1997 INSULATING COMPOUND ELECTRICAL EPOXY COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION《填满硅胶用于陶器制造和封装的电绝缘剂》.pdf（4页珍藏版）》请在麦多课文档分享上搜索。

1、. A-A-59134 U 9999974 0176334 843 = INCH-POUND A-A-59 134 28 October 1997 SUPERSEDING 28 June 1991 MIL-I-46865B (MI) COMMERCIAL ITEM DESCRIPTION INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTING AND ENCAPSULATION The General Services Administration has authorized the use of

2、this commercial item description as a replacement for MIL-I-46865B (MI) for all federal agencies. 1. SCOPE 1.1 compound used for potting and encapsulating Scope. This commercial item description covers an epoxy resin electrical insulating 1.2 Classification. The epoxy resin shall be of the following

3、 types, as specified. Type I - Low viscosity Type II - Medium viscosity Type III - High viscosity 2. SALIENT CHARACTERISTICS 2.1 Materials. 2.1.1 Composition and condition in container. Beneficial comments, recommendations, additions, deletions, clarifications, etc. and any data which may improve th

4、is document should be sent to: Commander, U.S. Army Missile Command. ATTN: AMSMI-RD-SE-TD-ST. Redstone Arsenal. AL 35898-5270. FSC 5970 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-A-A-59134 m 7999974 017b335 7BT = Ingredients Epoxy resin I Epoxy

5、resin II Amine curing agent Colloidal silica A-A-59 134 . Parts be weight Type I Type II Type III 50 50 50 50 50 50 19.5 19.5 19.5 2.5 3.5 5.0 2.1.1.1 CornPosition. The materials furnished under this commercial item description shall be premixed, frozen, degassed compounds formulated from the ingred

6、ients specified in table I. TABLE I. Material cornPosition. 2.1.1.2 Condition in container. The compounds, as received, shall be free of gel particles, dirt, or any other contaminants which would affect the intended use. 2.2.2 Pot life. The useable pot life of the compounds shall be not less than 30

7、 minutes. 2.2.3 Viscosity. The viscosity of the thawed materials, as received, shall be as follows. Type I 300 f 100 centipoises (cP) Type II 850 f 200 CP Type III 7500f2000cP 2.2.4 Storage life. The premix, as furnished by the manufacturer, shall be capable of meeting the requirements specified her

8、ein after storage at a temperature of less than 40 OC in an original closed container for not less than 3 months. 2.3 inch diameter. Porositv. The cured compound shall exhibit no bubbles or porosity smaller than 0.03 1 2.4 D as specified by and when tested in accordance with ASTM D 2240. Hardness. T

9、he cured compound shall have a hardness value of not less than 40 Shore 2.5 2.6 Flexibilitv. Bending shall cause no chipping or cracking. Insulation resistance. The insulation resistance shall be not less than 1 x 10“ ohms. 2 Provided by IHSNot for ResaleNo reproduction or networking permitted witho

10、ut license from IHS-,-,-t A-A-59134 m 9999974 0176336 b1b m * A-A-59134 2.7 colored contaminants, lumps, foreign materials, and other defects that could adversely affect their use. Workmanship. The compound shall be uniform in quality and shall be free of dark 3. REGULATORY REQUIREMENTS 3.1 extent p

11、racticable, in accordance with paragraph 23.403 of the Federal Acquisition Regulation (FAR). The offerodcontractor is encouraged to use recovered materials to the maximum 4. QUALITY ASSURANCE PROVISIONS 4.1 this Commercial Item Description, conform to the producers own drawings, specifications, stan

12、dards, and quality assurance practices, and be the same product offered for sale in the commercial market. The government reserves the right to require proof of such conformance. Product conformance. The products provided shall meet the salient characteristics of 4.2 to document the quality of the p

13、roduct to be provided under this CID. Market Acceptabilitv (MA). The following market acceptability criteria are necessary 4.2.1 requirements of this CID for at least two years. The company producing the item must have been producing a product meeting the 4.2.2 marketplace over the past two years. T

14、he company must have sold 1000 units meeting this CID in the commercial 4.3 to ensure product quality. InsPection requirements. Bid samples may be required for CID items when necessary 4.3.1 requirements of 5.1. Examination. Each container in the sample shall be visually examined to verify the 5. PA

15、CKAGTNG 5.1 shall be as specified in the contract or order. Preservation, packaninn, Packinn and marking. Preservation, packing, and marking 6. NOTES 6.1 than 300 volts) cable compositions of differing viscosities. This compound is intended for use in potting and encapsulation of low voltage (less T

16、ype I - Low viscosity material for use where connector pins have been previously sealed 3 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-A-A-59334 = 9999974 O376337 552 L to prevent leak-through Normally used when heat Type II without pin with type

17、II be cured at A-A-59 134 along the connector pins. curing is desired. Medium viscosity material used with or sealing. If pin sealing is not performed material, the type II material should room temperature. Type III - High viscosity material for use on connectors with large open areas or widely spac

18、ed pins, where the characteristics. material has poor flow 6.2 the Superintendent of Documents, U.S. Government Printing Office, Washington, DC, 20402. Source of documents. The Code of Federai Regulations (CFR) may be obtained from 6.3 Part or identifying number. - A - X Type number (see 1.2) Commer

19、cial Item Description number Commercial Item Description prefix 6.4 Subject term (keyword) listing. Hardener Resin laminate Premix . Crystalline substance 6.5 Product availabilitv. This insulating compound is available commercially as EPO-TEK Epoxy Systems - 360T, 360ST, 353ND-T, and OE138 through E

20、poxy Technology, Inc.; and as E-Cast F-82 with 2 15 Hardener for Type I, E-Cast F-82 with 929 Hardener for Type II, and E-Cast Sur-Grip with 282 Hardener for Type III through the United Resin Corporation. The compound will have to be sent to a company such as APS Adhesive Packaging Specialties, Inc. to be premixed, fiozen, and degassed. Custodian: hy-MI Preparing Activity: Army - MI Project No. 5970 - A698 4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-