ANSI JS-002-2014 Electrostatic Discharge Sensitivity Testing - Charged Device Model (CDM) - Device Level.pdf
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1、ANSI/ESDA/JEDEC JS-002-2014 Revision and Replacement of ANSI/ESD S5.3.1-2009 315-339-6937; FAX: 315-339-6793; www.esda.org 2 JEDEC Global Standards for the Microelectronics Industry; www.jedec.org 3 IEC International Electrotechnical Commission, www.iec.ch ANSI/ESDA/JEDEC JS-002-2014 2 Charged devic
2、e model (CDM) electrostatic discharge (ESD) tester. Equipment (referred to as “tester“ in this standard) that simulates the device level CDM ESD event using the non-socketed test method. Dielectric layer. A thin insulator placed atop the Field Plate used to separate the device from the field plate.
3、Field plate. A conductive plate used to elevate the potential of the device under test (DUT) by capacitive coupling (see Figure 1). Ground plane. A conductive plate used to complete the circuitry for grounding / discharging the DUT (see Figure 1). Software voltage. A user/operator-entered voltage th
4、at, when combined with the scale factor or offset, sets the actual field plate voltage on the system in order to achieve the waveform parameters as defined in Tables 1 or 2. Test condition (TC). For purposes of this document, a test condition refers to the tester plate voltage that meets the wavefor
5、m parameter conditions in a particular column of Tables 1 and 2. 4.0 PERSONNEL SAFETY DURING INITIAL EQUIPMENT SETUP, A SAFETY ENGINEER OR APPLICABLE SAFETY REPRESENTATIVE SHALL INSPECT THE EQUIPMENT IN ITS OPERATING LOCATION TO ENSURE THAT THE EQUIPMENT IS NOT OPERATED IN A COMBUSTIBLE (HAZARDOUS)
6、ENVIRONMENT. 4.1 TRAINING ALL PERSONNEL SHALL RECEIVE SYSTEM OPERATIONAL TRAINING AND ELECTRICAL SAFETY TRAINING PRIOR TO USING THE EQUIPMENT. 4.2 PERSONNEL SAFETY THE PROCEDURES AND EQUIPMENT DESCRIBED IN THIS DOCUMENT MAY EXPOSE PERSONNEL TO HAZARDOUS ELECTRICAL CONDITIONS. USERS OF THIS DOCUMENT
7、ARE RESPONSIBLE FOR SELECTING EQUIPMENT THAT COMPLIES WITH APPLICABLE LAWS, REGULATORY CODES AND BOTH EXTERNAL AND INTERNAL POLICY. USERS ARE CAUTIONED THAT THIS DOCUMENT CANNOT REPLACE OR SUPERSEDE ANY REQUIREMENTS FOR PERSONNEL SAFETY. GROUND FAULT CIRCUIT INTERRUPTERS (GFCI) AND OTHER SAFETY PROT
8、ECTION SHOULD BE CONSIDERED WHEREVER PERSONNEL MIGHT COME INTO CONTACT WITH ELECTRICAL SOURCES. ELECTRICAL HAZARD REDUCTION PRACTICES SHOULD BE EXERCISED AND PROPER GROUNDING INSTRUCTIONS FOR EQUIPMENT SHALL BE FOLLOWED. NOTE: IN ADDITION, CDM TESTERS HAVE MOVING PARTS WHEN IN OPERATION AND CARE SHO
9、ULD BE TAKEN TO AVOID PERSONNEL CONTACT WITH MOVING PARTS WHEN IN OPERATION. 5.0 REQUIRED EQUIPMENT 5.1 CDM ESD Tester Figure 1 represents the hardware schematic for a CDM tester setup to conduct field-induced CDM ESD testing assuming the use of a resistive current probe. The DUT may be an actual de
10、vice or it may be one of the two verification modules (metal discs) described in Annex A. The pogo pin shall be connected to the ground plane with a 1 ohm current path with a minimum bandwidth (BW) of 9 gigahertz (GHz). The 1 ohm pogo pin to ground connection of the resistive current sensor may be a
11、 parallel combination of a 1 ohm resistor between the pogo pin and the ground plane and the 50 ohm impedance of the oscilloscope and its coaxial cable. K1 is the ANSI/ESDA/JEDEC JS-002-2014 3 switch between charging the field plate and grounding the field plate. The CDM ESD testers used within the c
12、ontext of this standard shall meet the waveform characteristics specified in Figure 2, and Tables 1 and 2, without additional passive or active devices, such as ferrites, in the probe assembly. Figure 1: Simplified CDM Tester Hardware Schematic NOTE: When constructing the test equipment, the parasit
13、ics in the charge and discharge paths should be minimized since the resistance inductance-capacitance (RLC) parasitics in the equipment greatly influence the test results. NOTE: For existing equipment designed to meet ANSI/ESD 5.3.1 and / or JEDEC C101 standards, it is recommended to contact qualifi
14、ed service personnel to determine compliance to this standard upon removal of ferrite components. 5.1.1 Current Sensing Element A current sensing element shall be incorporated into the ground plane. The resistance of this element shall have a value of 1.0 ohm + 10%. A resistor, as specified in Secti
15、on 5.1, shall be used as the current sensing element. The value of resistance (including the 50 ohm cable / oscilloscope termination) shall be measured using an ohmmeter as described in Section 5.5. The resistance value shall be used to calculate the first peak current. The current sensing element s
16、hall have a minimum frequency response of 9 GHz (specified by maximum rolloff of 3 dB at 9 GHz). 5.1.2 Ground plane The probe assembly shall contain a square ground plane with the probe pin centered within it as shown in Figure 1. The dimensions of the ground plane shall be 63.5 mm x 63.5 mm + 6.35
17、mm (2.5 inches x 2.5 inches + 0.25 inches). 5.1.3 Field Plate / Field Plate Dielectric Layer The field plate shall have a surface flatness to vary no more than + 0.127 mm (0.005 inch). The field plate dielectric layer should be made with a FR4 or similar epoxy-glass material. For FR4, the thickness
18、and thickness tolerance of this dielectric layer should be 0.381 mm + 0.0254 mm (0.015 inches + 0.001 inches) in order to result in a capacitance measurement (as specified in normative Annex B) in the range specified in Table 4 in Annex A. If a different material is used, the material thickness is c
19、hosen to result in a capacitance measurement in the range specified in Table 4 in Annex A. Pogo pin to ground resistance = 1 002.1.2014 ANSI/ESDA/JEDEC JS-002-2014 4 5.1.4 Charging Resistor The charging resistor shown in Figure 1 shall nominally be 100 megohms or greater. Resistor values higher than
20、 100 megohms may be used, but this may not allow very large devices (refer to Section 6.9 and Annex H) to charge fully before being discharged by the probe assembly. This effect can be overcome by adding a delay between discharges in the CDM tester programming software. If using a resistor greater t
21、han 100 megohms, it is recommended that the tester or the device itself be characterized to determine if a delay is needed for discharging large devices. A procedure for this large device delay characterization is given in Annex H. 5.2 Waveform Measurement Equipment The CDM waveform measurement equi
22、pment shall consist of the following components. 5.2.1 Cable Assemblies Cable assemblies with combined internal tester cable and external cable total loss of no more than 2 dB at frequencies up to 9 GHz and a nominal 50 ohm impedance. 5.2.2 Equipment for High Bandwidth Waveform Measurement 5.2.2.1 H
23、igh Bandwidth Oscilloscope An oscilloscope or transient digitizer with a minimum real-time (single shot) 3 dB BW of at least 6 GHz and 20 gigasample/sec sampling rate with a nominal 50 ohm input impedance. 5.2.2.2 Attenuator A 20 dB attenuator with a precision of 0.5 dB, at least 12 GHz BW, and an i
24、mpedance of 50 ohms 5.0 ohms. 5.2.3 Equipment for 1.0 GHz Waveform Measurement 5.2.3.1 1 GHz Oscilloscope An oscilloscope or transient digitizer with a real-time (single shot) 3 dB BW of 1 GHz with a nominal 50 ohm input impedance. The sampling rate shall be 5 gigasample/sec. NOTE: The user has an o
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